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Laser Powder Bed Fusion Feedstock Development Patent Landscape

Laser Powder Bed Fusion Feedstock Development Patent Landscape
Competitive Landscape
Laser Powder Bed Fusion Feedstock Development Patent Landscape in 2026

The LPBF feedstock field is in sustained growth, with a 34% rise in the recent filing window and China-originated filings as the dominant jurisdictional force. RTX Corp holds the largest single portfolio but the top tier is shared between Western industrial players and a dense cluster of Chinese research universities.

843
Patent families in scope
22%
Top-5 share of top-100 filers
+34%
3-yr filing growth (lag-adj.)
China
Leading jurisdiction
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Published byPatSnap Insights Team··7 min readVerified by PatSnap Eureka data
Overview

RTX Corp leads a field split between aerospace industrials and Chinese academia

RTX Corp ranks first with 43 patent families, followed by Shanghai Jiao Tong University at 28, and South. China University of Technology and Central South University each at 26. The top five filers’ combined share of the hundred largest filers stands at 22%, indicating a moderately concentrated but far from monopolized competitive space.

A two-tier structure is visible: one Western industrial leader (RTX Corp) and one European energy specialist (Ansaldo Energia IP UK Ltd at 16 families) sit alongside a dense cluster of Chinese universities occupying ranks two through ten. No single organization has established a dominant blocking position.

Leading applicants
#ApplicantPatent familiesShare
1RTX Corp43
2Shanghai Jiao Tong University28
3South China University of Technology26
4Central South University26
5Ansaldo Energia IP UK Ltd16
6Northwestern Polytechnical University16
7Jilin University15
8North University of China14
9Xi’an Jiao Tong University12
10NANJING UNIV OF AERONAUTICS & ASTRONAUTICS12
#ApplicantPatent familiesShare
11General Electric Company12
12Jinan University11
13UNIV OF SCI & TECH BEIJING10
14Lawrence Livermore National Security LLC10
15HUAZHONG UNIV OF SCI & TECH10
16United Technologies Corporation10
17Shanghai Hanbang United 3D Technology Co. Ltd.9
18LLC Institute (Russia)9
19Guangdong Institute of New Materials9
20LLC United (Russia)8
↗ Hover a row · click a company to ask Eureka

RTX Corp’s lead, built on powder metallurgy and additive manufacturing process claims, reflects a systematic aerospace-industrial strategy rather than opportunistic filing. The university cluster signals that much of the upstream materials science remains in academic hands, creating licensing and partnership pathways for industrial entrants.

Filings from 2025 and 2026 are materially under-counted due to publication lag and should not be treated as indicators of slowing activity. Longer-window growth, applicant concentration, and technology-route coverage are therefore more reliable signals than the latest-year bar alone.

Source: PatSnap Eureka. Chart shows the top applicants ranked by patent families. Applicant counts can overlap where a patent family lists several applicants, so they need not sum to the total in scope.Explore deeper in Eureka →
Trends & Structure

Sustained annual growth with powder metallurgy and alloy chemistry as the technology core

The filing trend and technology composition charts together show an expanding field anchored in established IPC classes, with a 34% growth in the recent window confirming that investment in feedstock IP is accelerating rather than consolidating.

Annual filing trend

Annual filings climbed from 19 in 2017 to a recorded high of 150 in 2024, with the field still in its growth stage according to lifecycle analysis. The 2025 and 2026 figures (127 and 13 respectively) are substantially understated by publication lag and must not be read as a downturn.

Annual filing trendAnnual values from 2017 to 2026, peaking at 150 in 2024.1920174520186520199220201162021902022126202315020241272025132026↗ Hover for values · click a bar to ask Eureka

Technology composition

B22F (Powder metallurgy) and B33Y (Additive manufacturing) dominate the branch mix, reflecting the core process-and-material pairing of LPBF feedstock work. C22C (Alloys) is the third-largest branch, confirming alloy composition as a central R&D axis. Lower-frequency branches such as C23C (Coating & surface deposition) and A61L (Sterilising & disinfecting) reveal adjacent application areas with much sparser coverage.

Technology compositionB22F · Powder metallurgy leads with 886; B33Y · Additive manufacturing (3D printing) 802.B22F · Powder metallurgy886B33Y · Additive manufact…802C22C · Alloys569C22F · Non-ferrous metal…88B29C · Shaping of plastics69B23K · Welding, solderin…44C23C · Coating & surface…35A61L · Sterilising & dis…34↗ Hover for values · click a bar to ask Eureka
Source: PatSnap Eureka. Technology-branch counts are measured in patent records; a single patent family can carry several IPC classes, so class totals can exceed the family total in scope.Explore deeper in Eureka →
Key Patents

Highly cited patent families surfaced by the query

Citation-heavy patent families returned by the query. Use this section as citation context, not as a curated list of the most topic-specific patents.

Featured patent
WO2025202196A1Published 2025-10-02

Graphite-based steel alloy and method for producin…

UNIVERSITÉ De LIÈGE

The present invention relates to a process for producing a steel alloy part, which includes providing a steel alloy powder mixture containing SiC, forming the part from the powder mixture using an additive manufacturing technique, and subjecting the formed part to a thermal treatment for a duration of 1 to 150 minutes at a temperature ranging from 600°C to… (excerpt from the patent abstract)

Graphite-based steel alloy and method for producin… — patent drawingGraphite-based steel alloy and method for producin… — patent drawing
Representative drawings from the patent document.
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Highly cited patent families surfaced by this query
#PatentCitations
1Control of solidification in laser powder bed fusi…181
2一种采用选区激光熔化技术制备钛合金工艺品的方法80
3Method for additively manufacturing an article mad…69
4Method for additively manufacturing an article mad…68
5一种选区激光熔化成形用Inconel718镍基合金粉末及其制备方法51
6Silver-based alloy powder for manufacturing of 3-d…50
7一种增材制造高强铝合金粉及其制备方法和应用49
8Selective laser melting system49

Ranked by total forward citations. Citation counts favour older and broadly cited patent families, and broad or adjacent patents may appear when they match the search scope. Treat this section as citation context, not as a curated list of the most topic-specific patents. Some patent titles may be shown in their original, non-English language where an accurate translation could not be guaranteed.

Source: PatSnap Eureka. Citation-ranked patent families surfaced by this query.Open in Eureka →
Insights

What the structural evidence means for R&D investment decisions

The combination of sustained growth, moderate concentration, active university-industry collaboration, and. China’s jurisdictional dominance shapes both the risk profile and the entry points available to new investors in this field.

Growth

Growth stage: annual volume still rising

The lifecycle analysis places LPBF feedstock development firmly in the Growth stage, with annual filings still rising and a 34% increase in the recent window. The 2024 recorded peak of 150 filings and the positive multi-year trajectory indicate that the field has not yet entered the consolidation phase where incremental innovation dominates. Early-mover advantages in novel alloy systems and powder production methods remain available.

Growth stage
Concentration

Moderate concentration leaves room for challengers

The top five filers account for 22% of the hundred largest filers’ combined total, and no applicant holds a dominant blocking position across the full feedstock space. RTX Corp’s 43-family lead is meaningful in aerospace-grade superalloys, but the university-heavy mid-tier means that commercialization rights to academically developed feedstocks remain contestable. Focused entrants targeting specific alloy classes or particle morphology methods can find defensible niches.

Moderate concentration
Collaboration

South China University of Technology is the most active co-filer

South China University of Technology appears in the most co-filing relationships, partnering with Guangdong Huayi Sanitary Ware Industrial Co. Ltd. (4 joint families), Guangzhou Leijia Additive Technology Co. Ltd. (2), Ningbo Zhongke Xianglong Lightweight Technology Co. Ltd. (2), Sun Yat-sen University Cancer Center (2), and Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences (2). Shanghai Jiao Tong University co-files with Anhui Xiangbang Composite Material Co. Ltd. (3 joint families), while North University of China co-files with the Aviation Industry Corporation of China Aviation Manufacturing Technology Institute (3). These pairings cluster around materials production, aerospace, and emerging biomedical applications.

University-industry pairs
Geography

China accounts for the majority of jurisdictional coverage

China is the lead filing jurisdiction by a wide margin, followed by the United States and Europe (EPO). Russia and India show smaller but non-trivial presences. The geographic concentration in China reflects both the density of Chinese university applicants and the domestic commercialization push in additive manufacturing. Western players seeking freedom-to-operate in Chinese manufacturing markets should treat this jurisdictional skew as a risk factor requiring targeted freedom-to-operate analysis.

China-dominant
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Top collaboration links
ApplicantCollaboratorCo-filings
South China University of TechnologyGuangdong Huayi Sanitary Ware Industrial Co. Ltd.4
Shanghai Jiao Tong UniversityAnhui Xiangbang Composite Material Co. Ltd.3
North University of ChinaAviation Industry Corporation of China Aviation Manufacturing Technology Institute3
Central South UniversityHunan Dingli Technology Co. Ltd.2
South China University of TechnologyGuangzhou Leijia Additive Technology Co. Ltd.2
South China University of TechnologyNingbo Zhongke Xianglong Lightweight Technology Co. Ltd.2
South China University of TechnologySun Yat-sen University Cancer Center2
South China University of TechnologyNingbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences2
Northwestern Polytechnical UniversityNorthwestern Polytechnical University Shenzhen Research Institute2
Central South UniversityAECC South Industry Co. Ltd.1

Co-filing pairs, ranked by the number of jointly-filed patent families.

Source: PatSnap Eureka. Insight cards are derived from lifecycle, applicant ranking, collaboration pairs, and jurisdiction data within the LPBF feedstock corpus.Explore insights →
Leaders

RTX Corp leads on process-and-machine claims; Chinese universities anchor materials chemistry

The leader board separates a Western aerospace industrial with a broad process portfolio from a cluster of Chinese research universities whose recent momentum trends vary. RTX Corp entered the ranking as a new entrant in the recent period while several established Chinese filers show declining recent activity.

Leader · RTX Corp

RTX Corp

RTX Corp holds 43 patent families and is flagged as a new entrant in the recent three-year window with 39 recent families, signaling a rapid, concentrated filing campaign rather than a long-term incremental buildup. Its technology focus sits squarely in B22F 10 (powder metallurgy process), B33Y 10 (additive manufacturing method), and B33Y 30 (additive manufacturing apparatus), reflecting an integrated feedstock-to-process strategy consistent with its aerospace turbine component manufacturing needs.

families: 43
Challenger · Shanghai Jiao Tong University

Shanghai Jiao Tong University

Shanghai Jiao Tong University holds 28 patent families and focuses on B33Y 10 (additive manufacturing method), B22F 10 (powder process), and B33Y 70 (additive manufacturing materials). Its recent filing trend shows a 41% decline versus the prior three-year period, suggesting a possible shift in research priorities or a transition from filing to commercialization. Its active co-filing relationship with Anhui Xiangbang Composite Material Co. Ltd. (3 joint families) indicates ongoing industrial translation efforts.

families: 28
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Central South UniversityAnsaldo Energia IP UK Ltd+ more
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Leading-applicant momentum (recent 3 yrs, lag-adjusted)
ApplicantRecent (3 yrs)Trend
RTX Corp39▲ new entrant
Central South University6▼ -60%
South China University of Technology9▼ -36%
Shanghai Jiao Tong University10▼ -41%
Northwestern Polytechnical University8▲ new entrant
Jilin University5▲ new entrant
North University of China4▲ new entrant
Xi’an Jiao Tong University7▲ new entrant
Source: PatSnap Eureka. Player cards draw on applicant ranking, applicant momentum, and technology focus data from the LPBF feedstock corpus.Explore players →
Adjacent Branches

Under-served adjacent branches worth monitoring in LPBF feedstock R&D

Several IPC branches appear at low coverage relative to the dominant B22F/B33Y/C22C core. Two branches stand out as worth watching based on their technical adjacency and realistic entry paths, though they represent observations of relative sparsity rather than validated commercial opportunities.

C23C · Coating & surface deposition

C23C appears in only 35 records within the corpus, representing about 1% of the branch mix. Surface treatment of LPBF feedstock particles — including oxidation barrier coatings, lubricant layers, and flowability-enhancing deposits — is a technically meaningful area that directly affects powder recyclability and part density. The sparse coverage suggests that post-atomization surface engineering of LPBF powders has not yet attracted systematic patent protection, creating a potential entry path for materials and coating specialists willing to bridge the powder production and surface chemistry communities.

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B23K · Welding, soldering & brazing

B23K appears in 44 records at roughly 2% of the branch mix, reflecting work at the interface of laser-matter interaction and feedstock behavior. Residual stress management, in-situ alloying via welding-adjacent energy delivery, and hybrid directed-energy deposition approaches that draw on LPBF feedstocks are areas where B23K expertise intersects with feedstock development. The low coverage suggests that the welding and joining community has not yet systematically claimed this intersection, leaving room for applicants with laser processing and metallurgy expertise to establish positions.

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Unlock the full white-space map
See coverage density, filing velocity, and key assignees across all adjacent IPC branches in the LPBF feedstock landscape.
A61L · Sterilising & disinfecting (biomedical powder applications)C22F · Non-ferrous metal treatment (post-process heat treatment of LPBF feedstocks)+ more
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Source: PatSnap Eureka. Adjacent branch analysis is based on IPC branch frequency within the LPBF feedstock corpus relative to the dominant B22F/B33Y/C22C classes.Explore emerging →
Route Matrix

How leading applicants differ in their technology route emphasis

Route coverage across the main technology branches in the current evidence set.

PlayerB33Y 10 · Additive manufacturing (3D printing)B22F 10 · Powder metallurgyB33Y 70 · Additive manufacturing (3D printing)B22F 1 · Powder metallurgyC22C 1 · Alloys
Shanghai Jiao Tong UniversityStrong · 26Strong · 22Strong · 17Moderate · 10Strong · 15
Central South UniversityStrong · 27Moderate · 13Strong · 24Moderate · 7Moderate · 12
South China University of TechnologyStrong · 22Strong · 20Strong · 15Strong · 12Moderate · 8
RTX CorpStrong · 35Strong · 38AbsentAbsentAbsent
Northwestern Polytechnical UniversityStrong · 13Strong · 13Strong · 11Strong · 7Strong · 8
North University of ChinaStrong · 10Strong · 10AbsentStrong · 7Strong · 6
Xi’an Jiao Tong UniversityAbsentStrong · 10Strong · 9Strong · 7Strong · 7
Source: PatSnap Eureka. Matrix values are measured in patent records and should not be compared directly with family-level applicant totals.Compare in Eureka →
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Disclaimer. This page is generated from PatSnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

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