https://www.patsnap.com/resources/blog/rd-blog/laser-processing-and-applications-ultrafast-laser-ablation-patent-landscape-patent-landscape/ · Patsnap · data cut-off 2026-08-31 · downloaded from the live page
Patent Landscape · Ultrafast Laser Ablation
Ultrafast Laser Ablation Patents: Who Holds the Ground and Where It Is Still Open

A data-backed view of ultrafast laser ablation patent filings: who leads, how filing volume has grown, where technology claims concentrate, and where white space remains open for new entrants.

91
Published Records
42%
Top-5 Share of All Records
+300%
Filing Growth 2021→2024
US
Leading Jurisdiction

Filing growth = 2021 (2 records) → 2024 (8); 2024 is the last year we treat as complete. Top-5 share = the 5 largest assignees ÷ all 91 records in scope (CR5), not the ranked leaders only.

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Published byPatsnap Research··7 min readSourced from Patsnap Eureka
Field Overview

What the ultrafast laser ablation patent record actually shows

Ultrafast laser ablation covers material removal, drilling and surface modification using pulses in the femtosecond-to-picosecond range, where energy is deposited faster than heat can diffuse into surrounding material. That physical property is why the claim language in this dataset clusters so heavily around welding, soldering and brazing (B23K) rather than around laser sources themselves — the patents are protecting how the pulse is applied to a workpiece, not the laser architecture that generates it. A smaller but persistent set of records reaches into diagnosis and surgery, MEMS manufacturing, scanning-probe measurement, optical elements and glass compositions, each carrying a handful of filings rather than a wave.

The filing history in scope runs from 2015 through the 2026 cut-off, with a peak year of 2020 at 12 published records. Because publication trails filing by roughly 18 months, the most recent one or two years in any chart will read lower than actual filing activity and should not be read as a slowdown.

Filing activity and technology mix, 2015–2026
  1. 1PANASONIC HOLDINGS CORP14
  2. 2GSI LUMONICS CORP6
  3. 3IPG PHOTONICS CORP6
  4. 4COHERENT INC6
  5. 5LI MING6
  6. 6LASERFACTURING5
  7. 7BOARD OF RGT THE UNIV OF TEXAS SYST5
  8. 8ROFIN SINAR TECH LLC5
  9. 9RES DEVMENT FOUND4
  10. 10LIU XINBING3
Source: Patsnap Eureka. Assignee ranking and totals. Derived from a Patsnap search on Laser Processing & Applications: Ultrafast Laser Ablation Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

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The Data

Filing trend and technology concentration

Two views of the same 91-record dataset: how filing volume has moved year over year, and which IPC subclasses carry the claim density.

A three-year filing acceleration, off a small base

Annual filings rose from 2 records in 2021 to 8 in 2024, a +300% increase over that span, after a 2020 peak of 12 records earlier in the window. The 2025–2026 figures are still filling in behind the publication lag and should not be read as a decline.

A three-year filing acceleration, off a small base03691202017201820191220202021202220232024202502026Most recent year is partial — publication lag means later filings are not yet visible.

Publication lags filing by roughly 18 months, so 2025 onwards are still filling in. Growth rates on this page therefore end at 2024; running them to the last bar would understate the field.

Claim density sits almost entirely in one subclass

B23K accounts for 90.1% of the 91 records in scope, dwarfing every other class. A61B, B81C, G01Q, G02B and H10P each sit at 6.6%, and B22F and C03C at 5.5% — all secondary branches rather than parallel centres of activity, since a single record can carry more than one class.

Claim density sits almost entirely in one subclassB23K · Welding, soldering & brazing8290.1%A61B · Diagnosis & surgery66.6%B81C · MEMS manufacturing66.6%G01Q · Scanning-probe & nanometric me…66.6%G02B · Optical elements & systems66.6%H10P66.6%B22F · Powder metallurgy55.5%C03C · Glass & enamel compositions55.5%Other6065.9%

Shares are the percentage of the 91 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.

Source: Patsnap Eureka. Filing trend and technology composition. Derived from a Patsnap search on Laser Processing & Applications: Ultrafast Laser Ablation Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish.

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Key Patents

The record that still defines the freedom-to-operate question

Representative Filing
US8858676B22014-10-14

US8858676B2 — Nanoparticle production in liquid with multiple-pulse ultrafast laser ablation (IMRA America)

IMRA AMERICA, INC.

A method for generating nanoparticles in a liquid comprises generating groups of ultrafast laser pulses, each pulse in a group having a pulse duration of from 10 femtoseconds to 200 picoseconds, and each group containing a plurality of pulses with a pulse separation of 1 to 100 nanoseconds, and directing the groups of pulses at a target material in a liquid to ablate it. The multiple-pulse group ablation produces nanoparticles with a reduced average size, a narrow size distribution, and improved production efficiency compared to prior pulsed ablation systems.Filed by IMRA America, granted 2014-10-14. Its claim structure around pulse-group timing and separation is a recurring reference point for anyone filing on liquid-phase nanoparticle generation.

US8858676B2 — patent drawing 1US8858676B2 — patent drawing 2
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Most-cited records in the dataset
#Publication no.Patent titleCitations
1US20050274702A1Method and apparatus for dicing of thin and ultra thin semiconductor wafer using ultrafast pulse laser275
2US20060169677A1Method and apparatus for via drilling and selective material removal using an ultrafast pulse laser225
3US20070051706A1Transparent material processing with an ultrashort pulse laser173
4US20060000814A1Laser-based method and system for processing targeted surface material and article produced thereby152
5US7804043B2Method and apparatus for dicing of thin and ultra thin semiconductor wafer using ultrafast pulse laser138
6US20020060208A1Apparatus for drilling holes with sub-wavelength pitch with laser107
7US20210053160A1Method and System for Ultrafast Laser-based Material Removal, Figuring and Polishing62
8US6897405B2Method of laser milling using constant tool path algorithm62
9US7528342B2Method and apparatus for via drilling and selective material removal using an ultrafast pulse laser61
10US20060091125A1Laser micromachining method55

Citation counts favour older filings inside this corpus; treat them as a signal of influence on the field, not of current commercial relevance.

Each row carries its publication number; clicking a row searches Eureka by that number.

Source: Patsnap Eureka. Citation counts and representative records. Derived from a Patsnap search on Laser Processing & Applications: Ultrafast Laser Ablation Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
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Insights

What the concentration numbers mean for a filing decision

Three figures from the ranking and citation data that matter more than the raw record count.

Concentration
41.8%
of 91 records held by the top 5 assignees

The leaderboard is top-heavy but not closed

The top 5 assignees combined account for 38 of the 91 records in scope — 41.8% — with the leader alone holding 14. That leaves a long tail across the remaining 59 of 64 ranked companies, most with only one or two records, which is typical of a field still being staked out rather than one owned outright.

Source: assignee ranking, 64 companies
Breadth
65.9%
of records held by the top 10 assignees

Ownership widens fast past the leader

Moving from the top 5 to the top 10 assignees adds another 22 records, taking combined share from 41.8% to 65.9% of all 91 records. Fifth place holds 6 records and tenth place holds 3, so the drop-off from leader to mid-table is steep but the mid-table itself is still active.

Source: assignee ranking, top 10
Vintage
275 citations
on the single most-cited record

The most influential prior art predates the current filing wave

The five most-cited records in this dataset all address semiconductor wafer dicing, via drilling and transparent-material processing, and their citation counts run from 138 to 275. None of them falls inside the 2021–2024 growth window, which means new entrants are building on a decade-old technical base rather than on recent art.

Source: most-cited records table
Geography
45 filings
at the United States receiving office

Filing is concentrated in the US and PCT route

Of the receiving offices captured, the United States accounts for 45 filings and the WIPO PCT route for 19, with Europe, China, India and Singapore trailing behind. That pattern points to the US as the primary venue for contesting freedom-to-operate on this technology.

Source: receiving office counts
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Source: Patsnap Eureka. Co-assignee relationships and derived observations. Derived from a Patsnap search on Laser Processing & Applications: Ultrafast Laser Ablation Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
What's Next

Where to take this analysis

The dataset points to specific next questions rather than a single conclusion.

Map the white space inside the secondary IPC branches

A61B, B81C, G01Q, G02B and C03C each sit at 5.5–6.6% of records — too thin to be a wave, thick enough to hold a real claim. Pulling the underlying claim language in those subclasses shows what has already been staked versus what a new filing could still occupy.

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Track the co-assignee clusters for who is actually behind the leader

The strongest co-assignee pairs in this dataset repeat the same names across three separate pairings, which usually marks a stable core inventing team rather than one-off collaborations. Understanding who those individuals report to clarifies where the leader's R&D investment is actually concentrated.

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Re-run the trend once 2025–2026 filings finish publishing

Publication lag means the true 2025 and 2026 filing counts are still arriving. Revisiting the growth trend in twelve months will show whether the 2021–2024 acceleration held or eased once the full picture is in.

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Source: Patsnap Eureka. Forward-looking reading of the same dataset. Derived from a Patsnap search on Laser Processing & Applications: Ultrafast Laser Ablation Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
FAQ

Common questions on the ultrafast laser ablation patent landscape

Answers are grounded in the same dataset. Derived from a Patsnap search on Laser Processing & Applications: Ultrafast Laser Ablation Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company's registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.