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Run your analysis now →A data-backed view of ultrafast laser ablation patent filings: who leads, how filing volume has grown, where technology claims concentrate, and where white space remains open for new entrants.
Filing growth = 2021 (2 records) → 2024 (8); 2024 is the last year we treat as complete. Top-5 share = the 5 largest assignees ÷ all 91 records in scope (CR5), not the ranked leaders only.
Ultrafast laser ablation covers material removal, drilling and surface modification using pulses in the femtosecond-to-picosecond range, where energy is deposited faster than heat can diffuse into surrounding material. That physical property is why the claim language in this dataset clusters so heavily around welding, soldering and brazing (B23K) rather than around laser sources themselves — the patents are protecting how the pulse is applied to a workpiece, not the laser architecture that generates it. A smaller but persistent set of records reaches into diagnosis and surgery, MEMS manufacturing, scanning-probe measurement, optical elements and glass compositions, each carrying a handful of filings rather than a wave.
The filing history in scope runs from 2015 through the 2026 cut-off, with a peak year of 2020 at 12 published records. Because publication trails filing by roughly 18 months, the most recent one or two years in any chart will read lower than actual filing activity and should not be read as a slowdown.
Pick a task. Every answer cites the patents behind it.
Two views of the same 91-record dataset: how filing volume has moved year over year, and which IPC subclasses carry the claim density.
Annual filings rose from 2 records in 2021 to 8 in 2024, a +300% increase over that span, after a 2020 peak of 12 records earlier in the window. The 2025–2026 figures are still filling in behind the publication lag and should not be read as a decline.
Publication lags filing by roughly 18 months, so 2025 onwards are still filling in. Growth rates on this page therefore end at 2024; running them to the last bar would understate the field.
B23K accounts for 90.1% of the 91 records in scope, dwarfing every other class. A61B, B81C, G01Q, G02B and H10P each sit at 6.6%, and B22F and C03C at 5.5% — all secondary branches rather than parallel centres of activity, since a single record can carry more than one class.
Shares are the percentage of the 91 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.
This page is one run against one query. Ask Eureka your own question about laser processing & applications: ultrafast laser ablation patent landscape and every answer comes back with the patent numbers behind it.
Try EurekaA method for generating nanoparticles in a liquid comprises generating groups of ultrafast laser pulses, each pulse in a group having a pulse duration of from 10 femtoseconds to 200 picoseconds, and each group containing a plurality of pulses with a pulse separation of 1 to 100 nanoseconds, and directing the groups of pulses at a target material in a liquid to ablate it. The multiple-pulse group ablation produces nanoparticles with a reduced average size, a narrow size distribution, and improved production efficiency compared to prior pulsed ablation systems.Filed by IMRA America, granted 2014-10-14. Its claim structure around pulse-group timing and separation is a recurring reference point for anyone filing on liquid-phase nanoparticle generation.


| # | Publication no. | Patent title | Citations |
|---|---|---|---|
| 1 | US20050274702A1 | Method and apparatus for dicing of thin and ultra thin semiconductor wafer using ultrafast pulse laser | 275 |
| 2 | US20060169677A1 | Method and apparatus for via drilling and selective material removal using an ultrafast pulse laser | 225 |
| 3 | US20070051706A1 | Transparent material processing with an ultrashort pulse laser | 173 |
| 4 | US20060000814A1 | Laser-based method and system for processing targeted surface material and article produced thereby | 152 |
| 5 | US7804043B2 | Method and apparatus for dicing of thin and ultra thin semiconductor wafer using ultrafast pulse laser | 138 |
| 6 | US20020060208A1 | Apparatus for drilling holes with sub-wavelength pitch with laser | 107 |
| 7 | US20210053160A1 | Method and System for Ultrafast Laser-based Material Removal, Figuring and Polishing | 62 |
| 8 | US6897405B2 | Method of laser milling using constant tool path algorithm | 62 |
| 9 | US7528342B2 | Method and apparatus for via drilling and selective material removal using an ultrafast pulse laser | 61 |
| 10 | US20060091125A1 | Laser micromachining method | 55 |
Citation counts favour older filings inside this corpus; treat them as a signal of influence on the field, not of current commercial relevance.
Each row carries its publication number; clicking a row searches Eureka by that number.
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Run your analysis now →When it has to run inside your own pipeline.
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Browse MCP servers →Three figures from the ranking and citation data that matter more than the raw record count.
The top 5 assignees combined account for 38 of the 91 records in scope — 41.8% — with the leader alone holding 14. That leaves a long tail across the remaining 59 of 64 ranked companies, most with only one or two records, which is typical of a field still being staked out rather than one owned outright.
Moving from the top 5 to the top 10 assignees adds another 22 records, taking combined share from 41.8% to 65.9% of all 91 records. Fifth place holds 6 records and tenth place holds 3, so the drop-off from leader to mid-table is steep but the mid-table itself is still active.
The five most-cited records in this dataset all address semiconductor wafer dicing, via drilling and transparent-material processing, and their citation counts run from 138 to 275. None of them falls inside the 2021–2024 growth window, which means new entrants are building on a decade-old technical base rather than on recent art.
Of the receiving offices captured, the United States accounts for 45 filings and the WIPO PCT route for 19, with Europe, China, India and Singapore trailing behind. That pattern points to the US as the primary venue for contesting freedom-to-operate on this technology.
Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to laser processing & applications: ultrafast laser ablation patent landscape, with the prior art for and against each one.
The dataset points to specific next questions rather than a single conclusion.
A61B, B81C, G01Q, G02B and C03C each sit at 5.5–6.6% of records — too thin to be a wave, thick enough to hold a real claim. Pulling the underlying claim language in those subclasses shows what has already been staked versus what a new filing could still occupy.
Explore white space in EurekaThe strongest co-assignee pairs in this dataset repeat the same names across three separate pairings, which usually marks a stable core inventing team rather than one-off collaborations. Understanding who those individuals report to clarifies where the leader's R&D investment is actually concentrated.
Trace inventor networks in EurekaPublication lag means the true 2025 and 2026 filing counts are still arriving. Revisiting the growth trend in twelve months will show whether the 2021–2024 acceleration held or eased once the full picture is in.
Set a monitoring alert in EurekaThe assignee ranking covers 64 companies, and it is not a top-50 or top-100 cut — it is the full ranked list the dataset returns. The leader holds 14 of the 91 records in scope, with a steep drop to fifth place at 6 and tenth place at 3. Combined, the top 5 assignees hold 41.8% of all records and the top 10 hold 65.9%, which means the field has a clear leader but is far from a closed market, since more than a third of activity sits outside the top 10.
Filing activity grew from 2 records in 2021 to 8 in 2024, a +300% increase over that three-year span, after an earlier peak of 12 records in 2020. Because patent publication typically lags filing by around 18 months, the 2025 and 2026 figures in any chart will understate real activity and should not be read as evidence of a slowdown. The safest read is that filing accelerated through 2024 and the most recent years are simply incomplete.
The overwhelming majority of records — 90.1% of the 91 in scope — carry an IPC classification in B23K, welding, soldering and brazing, which covers how pulsed energy is applied to remove or modify material rather than how the laser itself is built. Smaller clusters extend into diagnosis and surgery, MEMS manufacturing, scanning-probe measurement, optical elements and glass or enamel compositions, each around 5.5–6.6% of records. Because a single filing can carry several IPC codes, these shares add up to more than 100% and should be read as overlapping applications, not a strict market split.
US8858676B2, assigned to IMRA America and granted in 2014, claims a method for generating nanoparticles in liquid by directing groups of ultrafast pulses — each 10 femtoseconds to 200 picoseconds long, spaced 1 to 100 nanoseconds apart within a group — at a target material submerged in liquid. The specific claim scope around pulse-group timing and spacing for liquid-phase nanoparticle production makes it a recurring reference point for anyone filing in that sub-area. Its relevance is about the precision of the claimed pulse parameters, not about ultrafast ablation broadly, so it does not block work outside liquid-phase nanoparticle generation.
The IPC data shows almost all claim density sitting in B23K, with A61B, B81C, G01Q, G02B and C03C each holding only 5.5–6.6% of the 91 records. Those thinner branches — surgical applications, MEMS fabrication, scanning-probe measurement, optical elements and glass compositions — are documented enough to show real interest but not so dense that claim space is fully occupied. Combined with a long tail of single-record assignees below the top 10, that pattern points to secondary application areas as the more open filing targets rather than the core material-removal claims already held by the leader.
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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.
Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company's registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.