Lens Coating & Antireflection Patents: Leaders & White Space 2026
- 72.7% of the field sits with five companies. the top 5 assignees account for 24 of 33 records in scope, while the ranked list of 18 companies covers the entire set the data endpoint returns.
- Filing peaked in 2019 at 7 records. activity has not returned to that level since, and the most recent years are undercounted because publication lags filing by roughly 18 months.
- Semiconductor and imaging classes dominate the claims. H01L appears on 45.5% of records and H04N on 33.3%, while classic optics (G02B) sits at 24.2% — coating claims are being written as device and imaging claims, not standalone optics.
Top-5 share is the combined record count of the five largest assignees divided by all 33 records in scope (CR5), not by the ranked leaders only.
What this landscape covers
This dataset tracks patent activity where lens antireflection coating, moth-eye structures and infrared cut filters intersect with durability and process claims: reflectance at angle, coating adhesion, environmental durability, angular blue shift, sputtering process and particle defect. The scope is deliberately narrow — it is not general optics or general semiconductor coating, but the specific overlap where camera module makers have to prove a coating survives handling, temperature cycling and viewing-angle shift, not just that it reduces reflectance in a lab measurement.
Coverage runs from 2015-01-01 to the 2026-07-31 data cut-off, giving a decade of filing history across 33 published records. Because publication trails filing by around 18 months, the last one to two years in any trend line will look thinner than they eventually turn out to be.
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Filing trend and technology composition
Two views of the same 33 records: how filing activity has moved year over year, and which IPC subclasses the claims actually sit in.
Filing trend, 2017–2026
Filing rose to a peak of 7 records in 2019 and has not matched that level since. With fewer than four complete years remaining once the publication lag is accounted for, no growth rate can be stated reliably from this trend — read the recent years as a floor, not a ceiling.
IPC subclass composition
H01L (semiconductor devices) leads at 45.5% of the 33 records, followed by H04N (pictorial communication) at 33.3% and a tie between G02B (optical elements & systems) and H10P at 24.2% each. Because a single record can carry several IPC classes, these shares add up to more than 100% of the record total — that overlap is itself informative: it shows coating claims being drafted alongside imaging-sensor and packaging claims rather than as isolated optics filings.
Shares are the percentage of the 33 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.
Go deeper on Lens Coating and Antireflection for Modules with Eureka
This page is one run against one query. Ask Eureka your own question about lens coating and antireflection for modules and every answer comes back with the patent numbers behind it.
Try EurekaMost-cited records in this field
US20160154309A1 — Method of manufacturing structure on substrate
Filed by Ushio Denki Kabushiki Kaisha, this record describes a two-beam laser interference method for exposing a resist layer to produce a fine periodic pattern on a substrate — the kind of sub-wavelength structure used to build moth-eye antireflection surfaces. Two branch beams are crossed at an interference angle to create a first interference pattern, then a second interference beam is generated at a different predetermined angle and exposed onto the same resist layer, before the exposed resist is removed to leave the fine pattern.Dated 2016-06-02.


| # | Publication no. | Patent title | Citations |
|---|---|---|---|
| 1 | US20090253227A1 | Engineered or structured coatings for light manipulation in solar cells and other materials | 94 |
| 2 | US20090284631A1 | Semiconductor package and camera module | 53 |
| 3 | CN110473887A | 光学传感器、光学传感系统及其制造方法 | 35 |
| 4 | TW202010140A | Optical sensor, optical sensing system and method for manufacturing the same | 20 |
| 5 | WO2020038408A1 | 光学传感器、光学传感系统及其制造方法 | 17 |
| 6 | US8228426B2 | Semiconductor package and camera module | 10 |
| 7 | WO2009084701A1 | Semiconductor package and camera module | 8 |
| 8 | US20090180804A1 | Image forming apparatus and process cartridge | 7 |
| 9 | US20070153115A1 | Image pickup device | 7 |
| 10 | US20240214696A1 | Headsets having improved camera arrangements and depth sensors, and methods of use thereof | 4 |
Citation counts reward older filings that have had more time to be cited within this searched corpus — treat them as a signal of influence on the field's prior art, not as a ranking of current commercial importance.
Patent titles are shown in the language they were filed in, not translated, so that each record stays verifiable against the original filing — a translated title will not match in Eureka or in any national register. Each row carries its publication number; clicking a row searches Eureka by that number.
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Browse MCP servers →What the numbers mean for a filing decision
Three read-outs from the concentration, trend and citation data that matter more than the headline counts.
The field is concentrated, not open
24 of the 33 records in scope belong to five companies, and the full ranked list of 18 companies accounts for all 33 records with no long unranked tail beyond it. A new entrant is filing into a space where the leading positions are already staked out by a small group.
Activity has cooled since its 2019 peak
Filing rose to 7 records in the peak year and has not returned to that level in the years since. Recent-year momentum by assignee shows several of the largest filers at zero in the latest year, though the publication lag means the most recent 18 months are always understated.
Coating claims are drafted as device claims
H01L (semiconductor devices) and H04N (pictorial communication) together tag well over half the record set, ahead of G02B, the classic optics class, at 24.2%. Claims in this space are increasingly written to cover the packaged imaging module, not the coating or optical structure in isolation.
Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to lens coating and antireflection for modules, with the prior art for and against each one.
Who holds the leading positions
The ranked list covers 18 companies and all 33 records in scope — there is no larger unranked population behind it. The leader holds 7 records; by fifth place that has fallen to 3, and by tenth place to 1, which is the shape of a field with a clear top tier and a long single-filing tail.
A single leader well ahead of the field
The top-ranked assignee holds 7 of the 33 records in scope, more than double the count needed to reach fifth place. That gap suggests one organisation has built a genuinely broader filing programme rather than a handful of opportunistic filings.
A compact second tier
From second to fifth place the counts cluster tightly, each holding a handful of records rather than a single dominant filing. Together with the leader they make up the 72.7% concentration figure for the top 5.
A tail of single-filing entrants
By tenth place, assignees hold just 1 record each, and the ranking closes out exactly at the 33-record total — there is no unranked population hiding beyond it. Co-assignee pairs are rare, with the strongest pairing appearing on only 3 records.
| Assignee | Recent year | YoY |
|---|---|---|
| Meta Platforms Technologies, LLC | 0 | -100% |
| Egis Technology Inc. | 0 | — |
| Toshiba Corporation | 0 | — |
| Huawei Technologies Co., Ltd. | 0 | — |
| DEFRIES ANTHONY | 0 | — |
| BRONGERSMA MARK | 0 | — |
| General Plasma, Inc. | 0 | — |
| Ricoh Co., Ltd. | 0 | — |
Where to take this analysis
The counts and rankings on this page are a starting point for scoping freedom-to-operate work or identifying acquisition targets, not a substitute for either.
Check freedom-to-operate against the leader's claim set
With one assignee holding 7 of 33 records, a claim chart against that portfolio should come before any coating or structure design is finalised.
Explore claim scope in EurekaTrack the co-assignee pairings for licensing signals
The strongest co-assignee pair appears on 3 records, which can indicate a stable internal inventor team or an external collaboration worth investigating before approaching either party.
Map assignee relationships in EurekaWatch the white-space branches for new entrants
Under-claimed sub-areas such as angular blue-shift correction and adhesion for multi-layer IR-cut stacks show activity without a dominant claimant, which is where new filings are most likely to succeed cleanly.
Set up monitoring in EurekaCommon questions on this landscape
This dataset shows a top-5 group holding 24 of the 33 records in scope, or 72.7% of the field, with the single leader at 7 records and a drop to 3 records by fifth place. The full ranking covers 18 companies and accounts for all 33 records, so there is no larger unranked population behind the visible leaders. That shape — one clear leader, a compact second tier, then a long tail of single-filing entrants down to 1 record by tenth place — is typical of a technology area where the core structural approaches are already staked out but plenty of process variants remain open.
Filing peaked at 7 records in 2019 and has not returned to that level in the years since, based on the trend data covering 2017 through 2026. A reliable growth rate cannot be stated from this trend because fewer than four complete years remain once the roughly 18-month publication lag is accounted for, so recent years understate true filing activity. Anyone benchmarking momentum should treat the last one to two years of any chart in this space as a floor rather than a ceiling.
US20160154309A1, filed by Ushio Denki Kabushiki Kaisha, describes a two-beam laser interference lithography method for exposing a resist layer to create a fine periodic pattern on a substrate, the kind of sub-wavelength structure used in moth-eye antireflection surfaces. Its claims are process claims tied to generating two crossed interference beams at defined angles and sequential exposure steps, not a claim over antireflection coatings generally. A design using a different patterning method, such as nanoimprint lithography or self-assembled particle masking, sits outside the specific interference-exposure steps this record claims.
The composition data shows H01L (semiconductor devices) on 45.5% of the 33 records and H04N (pictorial communication) on 33.3%, ahead of G02B (optical elements and systems) and H10P, each at 24.2%. Because coating claims in this field are frequently drafted alongside device and imaging-module claims rather than as standalone optics filings, a search limited to G02B alone would miss a majority of the relevant art. A thorough freedom-to-operate search should span all four classes, plus the smaller G06F, G06T, H04M and H04R classes that each appear on 9.1% of records.
The composition and co-assignee data point to under-claimed branches including angular blue-shift correction coatings, moth-eye structure durability under environmental cycling, sputtering process control aimed specifically at particle defect reduction, and coating adhesion for multi-layer infrared-cut filter stacks. These areas show filing activity in the dataset but no single dominant claimant, unlike the core structural antireflection claims held by the top assignees. That combination — present but not concentrated — is the signal worth following up with a targeted claim search before committing to a specific process route.
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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.
Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company’s registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.