One assignee leads the ranked field with 462 records, well ahead of the fifth-place holder at 133. That said, the drop from fifth to tenth place (133 to 107) is gradual, meaning several companies file at broadly comparable volumes rather than a single runner-up chasing the leader. The full ranking covers 100 assignees, and the top 10 combined account for 24.4% of all 7,089 records in scope, so most of the field’s activity sits outside the leadership group entirely.

Filings peaked in 2020 at 472 and then declined to 265 by 2024, a 40% drop over that three-year span using the only years complete enough to trust. Counts for 2025 and 2026 look much lower still, but that reflects the roughly 18-month lag between filing and publication rather than an actual collapse in activity. Anyone reading the most recent one or two years as a downtrend is likely reading incomplete data.

H05K (printed circuits and assemblies) covers 32.3% of the 7,089 records in scope, the single largest class, followed by H01L (semiconductor devices) at 17.8%. B32B (layered products) and C08L (polymer compositions) each sit at 11.5%, and H01R (connectors and current collectors) — the class most directly tied to connector hardware — is smaller still at 9.7%. This tells you claim pressure concentrates on what LCP parts connect to and how they’re built up in layers, more than on the connector housing itself.