https://www.patsnap.com/resources/blog/rd-blog/liquid-crystal-polymer-molding-process-patent-landscape/ · Patsnap · data cut-off 2026-07-31 · downloaded from the live page
Polymers & Composites · Patent Landscape
Liquid Crystal Polymer Molding Process Patents
  • Filing has plateaued, not grown. Annual filings peaked at 24 in 2021 and have since declined toward single digits, with the midpoint year (2022) already back down to 15 — this is a maturing claim space, not an expanding one.
  • Japan and Europe outfile the US. Japan (149 records) and the EPO (146) both lead the United States (114) as receiving offices, meaning freedom-to-operate analysis built only on US filings will miss most of the prior art.
  • The oldest citations still carry the most weight. The two most-cited records date to 1993 and 1997, and a 1984 extrusion patent still draws 134 citations — foundational molding and self-reinforcement claims from the 1980s-90s remain the reference point examiners return to.
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570
Published Records
26%
Top-5 Share of All Records
-79%
3-Yr Growth (lag-adjusted)
JP
Leading Jurisdiction
Published byPatsnap Research··7 min readSourced from Patsnap Eureka
Overview

What this landscape covers

This dataset tracks 570 patent families filed between 2015 and mid-2026 at the intersection of liquid crystal polymer chemistry and shaping processes — injection molding, thin-wall molding, film extrusion and melt processing — indexed under IPC classes covering polymer compositions (C08L), plastics shaping (B29C) and polymer additives (C08K). It is not a survey of LCP chemistry generally; the search string requires both the material and a molding or processing step in the claims or description, so it isolates process-linked filings rather than raw resin composition work.

Because publication lags filing by roughly 18 months, the 2025-2026 figures in any trend line are undercounts rather than a genuine drop-off — treat the most recent one to two years as provisional until the next data refresh.

Filing activity and IPC composition, 2017-2026
  1. 1POLYPLASTICS CO LTD45
  2. 2CELANESE CORP32
  3. 3NIPPON PETROCHEMICAL CO LTD28
  4. 4THE UNIVERSITY OF AKRON26
  5. 5UNITIKA LTD20
  6. 6SUMITOMO CHEM CO LTD16
  7. 7EI DU PONT DE NEMOURS & CO15
  8. 8TICONA LLC14
  9. 9DENKA CO LTD14
  10. 10NTN CORP10
Source: Patsnap Eureka. Assignee ranking and totals. Derived from a Patsnap search on Liquid Crystal Polymer Molding Process covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

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The data

Filing trend and technology composition

Two views of the same 570-family dataset: how filing volume has moved year over year, and which IPC subclasses carry the claim density.

A plateaued filing curve

Filings rose from 19 in 2017 to a peak of 24 in 2021, then eased back to 15 by 2022 and continued down toward single digits by the most recent (partial) year. Read this as a mature, well-picked-over claim space rather than a shrinking one — molding process improvements around an established resin class tend to arrive in smaller increments once the core routes are patented.

A plateaued filing curve06131925192017201820192020242021202220232024202532026Most recent year is partial — publication lag means later filings are not yet visible.

Where the claims concentrate

Polymer compositions (C08L, 368 records) and plastics shaping (B29C, 298) dominate, with additives (C08K, 199) and processing/solutions (C08J, 118) forming a second tier. Laminates (B32B, 77) and condensation polymer chemistry (C08G, 83) sit at the edges — smaller but not negligible bodies of art worth checking before filing composite or layered-LCP claims.

Where the claims concentrateC08L · Polymer compositions36864.6%B29C · Shaping of plastics29852.3%C08K · Use of additives in polymers19934.9%C08J · Polymer processing & solutions11820.7%C09K · Materials for misc. applicatio…10318.1%B29K · Plastics moulding materials (i…8615.1%C08G · Condensation polymers8314.6%B32B · Layered products & laminates7713.5%Other43075.4%

Shares are the percentage of the 570 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.

Source: Patsnap Eureka. Filing trend and technology composition. Derived from a Patsnap search on Liquid Crystal Polymer Molding Process covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.

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Key patents

The documents examiners keep citing

Representative filing
US5260380A1993-11-09

US5260380A — Self-reinforced composite and process for preparing same

UNIVERSITY OF AKRON, THE

Describes melt blending a matrix LCP with a fiber-forming second LCP under high-strain mixing to induce in-situ fiber formation, then shaping the blend by injection molding or extrusion at a temperature set between the two polymers' processing windows so the fiber-forming phase retains its fibrous morphology in the finished part.Filed by the University of Akron; issued 1993-11-09.

View full record
Most-cited records in this corpus
#Publication no.Patent titleCitations
1US5275877ASelf reinforced thermoplastic composite laminate170
2US5719354AMonolithic LCP polymer microelectronic wiring modules159
3US4468364AProcess for extruding thermotropic liquid crystalline polymers134
4US5268225ASelf reinforced thermoplastic composite laminate81
5US4966807AMultiaxially oriented thermotropic polymer films and method of preparation64
6US6010760AThermoplastic resin composition, injection molding method thereof, and injection molded article61
7US6063848ALiquid crystalline polymer composition and moldings58
8US5260380ASelf-reinforced composite and process for preparing same54
9US5006402AWholly aromatic polyester fiber-reinforced high performance thermoplastic and process for preparing same53
10US4332759AProcess for extruding liquid crystal polymer52

Citation counts inside a searched corpus favour older filings simply because they have had longer to accumulate references — treat this table as a map of influence on later claim drafting, not a ranking of current commercial relevance.

Each row carries its publication number; clicking a row searches Eureka by that number.

Source: Patsnap Eureka. Citation counts and representative records. Derived from a Patsnap search on Liquid Crystal Polymer Molding Process covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
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Insights

What the numbers mean for a filing decision

Three read-throughs from the trend, geography and citation data above.

Filing momentum
24 → 15 → 3
peak (2021) → midpoint (2022) → latest partial year

The growth phase is over

A peak in 2021 followed by a steady decline through 2022 and beyond signals that the core molding routes for LCP — injection molding of thin-wall parts, film extrusion, melt blending for self-reinforcement — are largely staked out. New filings now are more likely to be incremental process tweaks than foundational claims.

Confirm against the next data refresh before treating the latest year as a real decline.
Jurisdiction spread
JP 149 · EP 146 · US 114
records by receiving office

Japan and Europe lead, not the US

Japanese and European filings each outnumber US filings in this corpus. Any freedom-to-operate check limited to USPTO art will miss over half the relevant prior art — Japanese resin makers and European compounders have been the more active filers on molding process claims.

China (48) and PCT (31) filings are smaller but growing reference points for regional strategy.
Citation depth
134-170 citations
on the top five most-cited records

Foundational art is decades old

The most-cited documents span 1984 to 1997 and cover extrusion of thermotropic LCPs and self-reinforced composite laminates. Claims that touch fiber-forming in-situ blends or oriented thermotropic films should expect examiners to cite this cluster regardless of filing year.

High citation count signals influence on later drafting, not current market activity.
Co-filing pattern
10 co-assignee pairs
strongest pair: 6 shared filings

Collaboration is limited and concentrated

Only ten co-assignee pairs appear across the whole dataset, and the strongest single pairing accounts for just six shared filings. Most LCP molding process patents in this corpus are filed by a single assignee working alone, with joint filing the exception rather than the norm.

Co-filing here tends to pair a resin supplier with a smaller processing or material specialist.
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Looking for what nobody has claimed yet?

Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to liquid crystal polymer molding process, with the prior art for and against each one.

Find the white space →
Source: Patsnap Eureka. Co-assignee relationships and derived observations. Derived from a Patsnap search on Liquid Crystal Polymer Molding Process covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
Players

Who holds the claim space — and where it's still open

Recent-year filing activity across the named assignees below has dropped to zero for the most recent tracked year across the board, consistent with the corpus-wide plateau rather than any single company exiting the field.

Filing pattern
0 filings
latest tracked year, across all leading assignees

Momentum has stalled at the top

Every one of the leading named assignees in the recent-momentum data shows zero filings in the latest tracked year. That is consistent with the corpus-wide plateau after 2021 rather than a single company's retreat — the whole molding-process niche has gone quiet at once.

Watch for a rebound once 18-month publication lag clears the 2025-2026 backlog.
Co-filing
6 shared filings
strongest assignee pair in the dataset

Resin suppliers pair with specialists

The strongest co-assignee pairing in this corpus links a major LCP resin producer with a materials-processing partner, at six shared filings — the largest joint-filing relationship found, though still modest against 570 total families.

Most other pairings in the dataset sit at two shared filings.
Citation legacy
1984-1997
filing dates of the five most-cited records

Legacy assignees still anchor the art

The most heavily cited patents in this space were filed by composite and materials-science originators in the 1980s and 1990s. Newer entrants drafting claims around self-reinforcement or oriented thermotropic film need to design around this older, still-live citation cluster.

Citation weight favours age; check current assignee status separately.
🔍
Under-claimed sub-areas worth a closer look
Branches with thinner filing density relative to the corpus core, based on IPC weighting.
In-situ fibrillated LCP blends for thin-wall partsMultiaxially oriented LCP film for high-frequency substratesLCP-laminate interlayer bonding (B32B overlap)Condensation-route LCP monomer processing (C08G overlap)Low-cite-density film extrusion variants
Rank all filers by momentum →
Recent-year filing momentum by assignee
AssigneeRecent yearYoY
Polyplastics Co., Ltd.0
Celanese Corporation0
Nippon Petrochemicals Co., Ltd.0
The University of Akron0
Unitika Ltd.0
E.I. du Pont de Nemours and Company0
Sumitomo Chemical Co., Ltd.0
Denka Company Limited0
Source: Patsnap Eureka. Assignee-level momentum. Derived from a Patsnap search on Liquid Crystal Polymer Molding Process covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
What's next

Where to take this

The dataset points to two practical next steps depending on whether you are clearing a filing or scouting a gap.

Run a freedom-to-operate check across JP and EP art

With Japan and Europe each outfiling the US in this corpus, a US-only FTO search on LCP molding claims is incomplete. Pull the Japanese and European family members of the most-cited records before drafting new claims.

Explore assignee families in Eureka

Map the under-claimed film and laminate branches

In-situ fibrillated blends, oriented film for high-frequency substrates and laminate interlayer bonding all show thinner filing density than the C08L/B29C core. These are candidate spaces for a first-mover claim rather than a design-around.

Run a white-space search in Eureka
Source: Patsnap Eureka. Forward-looking reading of the same dataset. Derived from a Patsnap search on Liquid Crystal Polymer Molding Process covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
FAQ

Common questions on LCP molding process patents

Answers are grounded in the same dataset. Derived from a Patsnap search on Liquid Crystal Polymer Molding Process covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company's registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.