Book a demo

Liquid Silicone Rubber Injection Molding Patents: Top Companies & Trends 2026

Liquid Silicone Rubber Injection Molding Patents: Top Companies & Trends 2026
https://www.patsnap.com/resources/blog/rd-blog/liquid-silicone-rubber-injection-molding-patent-landscape/ · Patsnap · data cut-off 2026-07-31 · downloaded from the live page
Patent Landscape · Silicone Materials
Liquid Silicone Rubber Injection Molding Patents: Who Leads and Where Filing Is Heading
  • Concentrated at the top. the five leading assignees together hold 31.3% of all 1,235 records in scope, and the top ten hold 40.5% — well ahead of a long tail of single- and few-filing entrants.
  • Filing has cooled from its 2019 peak. activity peaked at 68 records in 2019 and fell from 55 in 2021 to 13 in 2024, a documented -76% move across that span, though 2025-2026 counts are still filling in under publication lag.
  • Composition and shaping claims dominate. C08L polymer-composition claims (30.0%) and B29C shaping-of-plastics claims (26.8%) lead the IPC mix, with additive (C08K) and condensation-polymer (C08G) classes trailing but still substantial.
Get a prior-art report on your approach
1,235
Published Records
31%
Top-5 Share of All Records
-76%
Filing Growth 2021→2024
US
Leading Jurisdiction

Filing growth compares 2021 (55 records) with 2024 (13) — a three-year span. 2024 is the most recent year we treat as complete: publication lags filing by roughly 18 months, so 2025 onwards are still filling in and any growth rate that ends there would understate the field. Top-5 share is the combined record count of the five largest assignees divided by all 1,235 records in scope (CR5), not by the ranked leaders only.

Published byPatsnap Research··7 min readSourced from Patsnap Eureka
Overview

What this landscape covers

This landscape tracks patent filings at the intersection of liquid silicone rubber (LSR) formulation and injection molding process engineering — cold-runner tooling, vulcanization timing, flash-free part design, mold release chemistry, shot metering and self-adhesive grades. The scope spans 1,235 published records filed between 2015 and mid-2026, drawn from documents that combine LSR or two-component silicone chemistry with a specific molding-process term.

Because the search pairs a materials term with a process term, the corpus skews toward filings where formulation and tooling claims are made together — a narrower and more decision-relevant slice than a generic silicone-materials search would return.

Filing activity and technology mix, 2015-2026
  1. 1DOW SILICONES CORP160
  2. 2SHIN ETSU CHEMICAL CO LTD89
  3. 3FUJIFILM BUSINESS INNOVATION CORP52
  4. 4RTX CORP43
  5. 5CANON KK43
  6. 6MOMENTIVE PERFORMANCE MATERIALS INC26
  7. 7NANOCORE APS25
  8. 8DOW CORNING TORAY SILICONE CO LTD23
  9. 9SIO2 MEDICAL PRODUCTS INC20
  10. 10GENERAL ELECTRIC CO19
Source: Patsnap Eureka. Assignee ranking and totals. Derived from a Patsnap search on Liquid Silicone Rubber Injection Molding covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

Let an AI agent run this analysis on your own technology

Pick a task. Every answer cites the patents behind it.

10,000 free credits to start
The Numbers

Filing trend and technology composition

Two views of the same 1,235 records: how filing activity has moved year over year, and which IPC subclasses carry the claim density.

A 2019 peak followed by a multi-year pullback

Filings rose to 68 records in 2019, the high point of the window, then declined; the documented move from 55 records in 2021 to 13 in 2024 is a -76% change over three years. The 2025 and 2026 counts are still incomplete because publication typically lags filing by about 18 months, so the most recent years should not yet be read as a continued decline.

A 2019 peak followed by a multi-year pullback020406080622017201868201920202021202220232024202522026Most recent year is partial — publication lag means later filings are not yet visible.

Composition and shaping claims lead the mix

C08L (polymer compositions) and B29C (shaping of plastics) are the two largest subclasses, at 30.0% and 26.8% of the 1,235 records respectively. C08K additive claims (20.7%) and C08G condensation-polymer claims (15.0%) follow, with G03G electrography (11.5%) reflecting the print/imaging-component use case and A61M (6.2%) marking the medical-device angle. Records can carry more than one class, so these shares sum above 100%.

Composition and shaping claims lead the mixC08L · Polymer compositions37130.0%B29C · Shaping of plastics33126.8%C08K · Use of additives in polymers25620.7%C08G · Condensation polymers18515.0%G03G · Electrography & electrophotogr…14211.5%C08J · Polymer processing & solutions1159.3%A61M · Devices for body fluids766.2%B32B · Layered products & laminates725.8%Other1,271102.9%

Shares are the percentage of the 1,235 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.

Source: Patsnap Eureka. Filing trend and technology composition. Derived from a Patsnap search on Liquid Silicone Rubber Injection Molding covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.

Go deeper on Liquid Silicone Rubber Injection Molding with Eureka

This page is one run against one query. Ask Eureka your own question about liquid silicone rubber injection molding and every answer comes back with the patent numbers behind it.

Try Eureka
Key Patents

A representative filing

Representative Record
US20210032470A12021-02-04

Process and device assembly for producing molded silicone rubber products from LSR via injection molding

ELKEM SILICONES USA CORP.

The invention relates to a device assembly and methods for producing molded silicone rubber products from liquid silicone rubber compositions via injection molding. The methods provide a flexible process to produce faster-cured silicone rubber products from LSR, allowing use of low curing temperature in the molding cavities without drastically lowering cure speed or the physical properties of the finished part — which in turn allows LSR overmolding onto heat-sensitive substrates. The device assembly permits a faster cycle and precise dosing and mixing.Filed by Elkem Silicones USA Corp., published 2021-02-04.

US20210032470A1 — patent drawing 1US20210032470A1 — patent drawing 2
View full record
Most-cited records in this landscape
#Publication no.Patent titleCitations
1US20100210745A1Molecular Healing of Polymeric Materials, Coatings, Plastics, Elastomers, Composites, Laminates, Adhesives, a…718
2US20100233146A1Coatings and Surface Treatments Having Active Enzymes and Peptides317
3US5714738AApparatus and methods of making and using heater apparatus for heating an object having two-dimensional or th…309
4US7141812B2Devices, methods, and systems involving castings298
5US20110240064A1Polymeric Coatings Incorporating Bioactive Enzymes for Cleaning a Surface292
6US20110189440A1Systems, Devices, and/or Methods for Manufacturing Castings289
7US20120097194A1Polymeric Coatings Incorporating Bioactive Enzymes for Catalytic Function250
8US6627704B2Poly(arylene ether)-containing thermoset composition, method for the preparation thereof, and articles derive…250
9US5061965AFusing assembly with release agent donor member236
10US7585166B2System for monitoring temperature and pressure during a molding process227

Citation counts reflect influence within the searched corpus and skew toward older filings; they are not a measure of current commercial relevance.

Each row carries its publication number; clicking a row searches Eureka by that number.

Source: Patsnap Eureka. Citation counts and representative records. Derived from a Patsnap search on Liquid Silicone Rubber Injection Molding covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
Run it yourself

Put your own technology through the same analysis

 
Where to run it
Fastest

Eureka on the web

When you want the answer in the next five minutes.

The agent works the prompt against patents and technical literature, citing every source.

Run your analysis now →
For builders

MCP server & REST API

When it has to run inside your own pipeline.

Patent search, landscape analysis and assignee resolution as MCP tools. Drop them into any agent framework, or call REST directly.

Browse MCP servers →
Insights

What the data means for a filing decision

Three read-throughs from the concentration, trend and composition figures above.

Concentration
40.5%
held by the top 10 of 1,235 records

The top of the field is dense, not open

The top 10 assignees account for 40.5% of all 1,235 records in scope, with the leader alone at 160 records. New entrants filing formulation-plus-molding claims are filing into occupied ground at the composition and shaping level, not into a vacuum.

Filing here means designing around, not around a gap.
Momentum
-76%
2021 (55) to 2024 (13) filings

Activity has pulled back from its 2019 peak

The documented -76% move from 2021 to 2024 marks a real slowdown in complete-year filings, following a 2019 peak of 68 records. This is a maturity signal on the process-engineering side of the claim set, not evidence that the underlying chemistry is exhausted.

Read 2025-2026 counts as incomplete, not as continued decline.
Composition
30.0% / 26.8%
C08L vs. B29C share of records

Formulation claims edge out process claims

C08L polymer-composition claims cover 30.0% of the 1,235 records, just ahead of B29C shaping-of-plastics claims at 26.8%. The gap to C08K additive claims (20.7%) and C08G condensation-polymer claims (15.0%) suggests formulation chemistry is claimed more heavily than tooling mechanics.

Additive and cross-linking chemistry trail the two lead classes.
Eureka AI Agent
Looking for what nobody has claimed yet?

Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to liquid silicone rubber injection molding, with the prior art for and against each one.

Find the white space →
Source: Patsnap Eureka. Co-assignee relationships and derived observations. Derived from a Patsnap search on Liquid Silicone Rubber Injection Molding covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
Players

Who is filing, and where the gate sits

A ranked list of 100 assignees sits behind this landscape; the figures below describe patterns in that ranking, not a curated top-100 or top-50.

Leader
160
records, leading assignee

One filer sits well clear of the field

The leading assignee holds 160 records, more than triple the fifth-place count of 43 and over eight times the tenth-place count of 19 — a sharp drop-off rather than a gradual one.

The gap between rank 1 and rank 5 is the steepest in the ranking.
Recent momentum
0 in latest year
across several leading assignees

Even the leaders show a quiet latest year

Several of the most active historical filers, including the top-ranked assignee, show zero records in the latest tracked year, with year-over-year change recorded at -100% for some. This lines up with the broader 2021-2024 pullback rather than signalling those filers have exited the space.

Publication lag means the latest year understates true activity for everyone.
Co-filing
10
co-assignee pairs identified

Co-filing is limited and concentrated around one firm

Only 10 co-assignee pairs appear in the data, and the strongest pairs all involve the same lead assignee working with either a corporate affiliate or named individual inventors. Collaborative filing is the exception here, not the norm.

Most records in this field carry a single corporate assignee.
🔍
Under-claimed branches worth a closer look
Sub-areas where filing density is comparatively thin relative to the core formulation and shaping classes.
low-temperature cure for heat-sensitive substrate overmoldingflash-free cold-runner cavity designself-adhesive grade primer-free bondingshot-metering precision dosing unitsmedical-grade LSR for fluid-contact devices
Rank all filers by momentum →
Recent-year filing momentum by assignee
AssigneeRecent yearYoY
Dow Silicones Corporation0-100%
Shin-Etsu Chemical Co., Ltd.0
FUJIFILM Business Innovation Corp.0-100%
Canon Inc.0-100%
Micro Systems Inc.0
General Electric Company0
Momentive Performance Materials Inc.0
SiO2 Medical Products, Inc.0
Source: Patsnap Eureka. Assignee-level momentum. Derived from a Patsnap search on Liquid Silicone Rubber Injection Molding covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
What's Next

Where to take this next

The landscape points to where claim space is dense and where it is thinner; the next step is testing a specific claim or design against it.

Check a formulation or process claim against the corpus

Run a candidate LSR formulation or tooling design through the full 1,235-record set to see which classes and assignees it lands closest to before drafting.

Explore in Patsnap Eureka

Track the leading assignees' next moves

Several top filers show zero records in the latest tracked year; watching their filing behaviour as 2025-2026 publications catch up will clarify whether the pullback continues.

Set up monitoring in Patsnap Eureka

Test the white-space chips against your roadmap

Low-temperature overmolding, flash-free cold-runner design and shot-metering precision are comparatively thin in claim density; a first-filed claim there faces less prior art.

Run a white-space search in Patsnap Eureka
Source: Patsnap Eureka. Forward-looking reading of the same dataset. Derived from a Patsnap search on Liquid Silicone Rubber Injection Molding covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
FAQ

Common questions about this landscape

Answers are grounded in the same dataset. Derived from a Patsnap search on Liquid Silicone Rubber Injection Molding covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

Research Liquid Silicone Rubber Injection Molding in depth with Eureka

Go past this page: query the whole liquid silicone rubber injection molding corpus yourself, in your own scope.
Every answer comes back with patent numbers you can open.

Try Eureka

Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company’s registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.

Help us improve this page

Found incorrect or outdated information? Let us know and we'll get it fixed.