Liquid Silicone Rubber Injection Molding Patents: Top Companies & Trends 2026
- Concentrated at the top. the five leading assignees together hold 31.3% of all 1,235 records in scope, and the top ten hold 40.5% — well ahead of a long tail of single- and few-filing entrants.
- Filing has cooled from its 2019 peak. activity peaked at 68 records in 2019 and fell from 55 in 2021 to 13 in 2024, a documented -76% move across that span, though 2025-2026 counts are still filling in under publication lag.
- Composition and shaping claims dominate. C08L polymer-composition claims (30.0%) and B29C shaping-of-plastics claims (26.8%) lead the IPC mix, with additive (C08K) and condensation-polymer (C08G) classes trailing but still substantial.
Filing growth compares 2021 (55 records) with 2024 (13) — a three-year span. 2024 is the most recent year we treat as complete: publication lags filing by roughly 18 months, so 2025 onwards are still filling in and any growth rate that ends there would understate the field. Top-5 share is the combined record count of the five largest assignees divided by all 1,235 records in scope (CR5), not by the ranked leaders only.
What this landscape covers
This landscape tracks patent filings at the intersection of liquid silicone rubber (LSR) formulation and injection molding process engineering — cold-runner tooling, vulcanization timing, flash-free part design, mold release chemistry, shot metering and self-adhesive grades. The scope spans 1,235 published records filed between 2015 and mid-2026, drawn from documents that combine LSR or two-component silicone chemistry with a specific molding-process term.
Because the search pairs a materials term with a process term, the corpus skews toward filings where formulation and tooling claims are made together — a narrower and more decision-relevant slice than a generic silicone-materials search would return.
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Filing trend and technology composition
Two views of the same 1,235 records: how filing activity has moved year over year, and which IPC subclasses carry the claim density.
A 2019 peak followed by a multi-year pullback
Filings rose to 68 records in 2019, the high point of the window, then declined; the documented move from 55 records in 2021 to 13 in 2024 is a -76% change over three years. The 2025 and 2026 counts are still incomplete because publication typically lags filing by about 18 months, so the most recent years should not yet be read as a continued decline.
Composition and shaping claims lead the mix
C08L (polymer compositions) and B29C (shaping of plastics) are the two largest subclasses, at 30.0% and 26.8% of the 1,235 records respectively. C08K additive claims (20.7%) and C08G condensation-polymer claims (15.0%) follow, with G03G electrography (11.5%) reflecting the print/imaging-component use case and A61M (6.2%) marking the medical-device angle. Records can carry more than one class, so these shares sum above 100%.
Shares are the percentage of the 1,235 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.
Go deeper on Liquid Silicone Rubber Injection Molding with Eureka
This page is one run against one query. Ask Eureka your own question about liquid silicone rubber injection molding and every answer comes back with the patent numbers behind it.
Try EurekaA representative filing
Process and device assembly for producing molded silicone rubber products from LSR via injection molding
The invention relates to a device assembly and methods for producing molded silicone rubber products from liquid silicone rubber compositions via injection molding. The methods provide a flexible process to produce faster-cured silicone rubber products from LSR, allowing use of low curing temperature in the molding cavities without drastically lowering cure speed or the physical properties of the finished part — which in turn allows LSR overmolding onto heat-sensitive substrates. The device assembly permits a faster cycle and precise dosing and mixing.Filed by Elkem Silicones USA Corp., published 2021-02-04.
| # | Publication no. | Patent title | Citations |
|---|---|---|---|
| 1 | US20100210745A1 | Molecular Healing of Polymeric Materials, Coatings, Plastics, Elastomers, Composites, Laminates, Adhesives, a… | 718 |
| 2 | US20100233146A1 | Coatings and Surface Treatments Having Active Enzymes and Peptides | 317 |
| 3 | US5714738A | Apparatus and methods of making and using heater apparatus for heating an object having two-dimensional or th… | 309 |
| 4 | US7141812B2 | Devices, methods, and systems involving castings | 298 |
| 5 | US20110240064A1 | Polymeric Coatings Incorporating Bioactive Enzymes for Cleaning a Surface | 292 |
| 6 | US20110189440A1 | Systems, Devices, and/or Methods for Manufacturing Castings | 289 |
| 7 | US20120097194A1 | Polymeric Coatings Incorporating Bioactive Enzymes for Catalytic Function | 250 |
| 8 | US6627704B2 | Poly(arylene ether)-containing thermoset composition, method for the preparation thereof, and articles derive… | 250 |
| 9 | US5061965A | Fusing assembly with release agent donor member | 236 |
| 10 | US7585166B2 | System for monitoring temperature and pressure during a molding process | 227 |
Citation counts reflect influence within the searched corpus and skew toward older filings; they are not a measure of current commercial relevance.
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Browse MCP servers →What the data means for a filing decision
Three read-throughs from the concentration, trend and composition figures above.
The top of the field is dense, not open
The top 10 assignees account for 40.5% of all 1,235 records in scope, with the leader alone at 160 records. New entrants filing formulation-plus-molding claims are filing into occupied ground at the composition and shaping level, not into a vacuum.
Activity has pulled back from its 2019 peak
The documented -76% move from 2021 to 2024 marks a real slowdown in complete-year filings, following a 2019 peak of 68 records. This is a maturity signal on the process-engineering side of the claim set, not evidence that the underlying chemistry is exhausted.
Formulation claims edge out process claims
C08L polymer-composition claims cover 30.0% of the 1,235 records, just ahead of B29C shaping-of-plastics claims at 26.8%. The gap to C08K additive claims (20.7%) and C08G condensation-polymer claims (15.0%) suggests formulation chemistry is claimed more heavily than tooling mechanics.
Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to liquid silicone rubber injection molding, with the prior art for and against each one.
Who is filing, and where the gate sits
A ranked list of 100 assignees sits behind this landscape; the figures below describe patterns in that ranking, not a curated top-100 or top-50.
One filer sits well clear of the field
The leading assignee holds 160 records, more than triple the fifth-place count of 43 and over eight times the tenth-place count of 19 — a sharp drop-off rather than a gradual one.
Even the leaders show a quiet latest year
Several of the most active historical filers, including the top-ranked assignee, show zero records in the latest tracked year, with year-over-year change recorded at -100% for some. This lines up with the broader 2021-2024 pullback rather than signalling those filers have exited the space.
Co-filing is limited and concentrated around one firm
Only 10 co-assignee pairs appear in the data, and the strongest pairs all involve the same lead assignee working with either a corporate affiliate or named individual inventors. Collaborative filing is the exception here, not the norm.
| Assignee | Recent year | YoY |
|---|---|---|
| Dow Silicones Corporation | 0 | -100% |
| Shin-Etsu Chemical Co., Ltd. | 0 | — |
| FUJIFILM Business Innovation Corp. | 0 | -100% |
| Canon Inc. | 0 | -100% |
| Micro Systems Inc. | 0 | — |
| General Electric Company | 0 | — |
| Momentive Performance Materials Inc. | 0 | — |
| SiO2 Medical Products, Inc. | 0 | — |
Where to take this next
The landscape points to where claim space is dense and where it is thinner; the next step is testing a specific claim or design against it.
Check a formulation or process claim against the corpus
Run a candidate LSR formulation or tooling design through the full 1,235-record set to see which classes and assignees it lands closest to before drafting.
Explore in Patsnap EurekaTrack the leading assignees' next moves
Several top filers show zero records in the latest tracked year; watching their filing behaviour as 2025-2026 publications catch up will clarify whether the pullback continues.
Set up monitoring in Patsnap EurekaTest the white-space chips against your roadmap
Low-temperature overmolding, flash-free cold-runner design and shot-metering precision are comparatively thin in claim density; a first-filed claim there faces less prior art.
Run a white-space search in Patsnap EurekaCommon questions about this landscape
One assignee leads the ranked field with 160 records, well ahead of the fifth-ranked assignee at 43 and the tenth-ranked at 19. The top five assignees combined hold 31.3% of all 1,235 records in scope, and the top ten hold 40.5%, showing a field that is concentrated at the top with a long tail of smaller filers below it. This concentration means a new entrant is filing against occupied claim space at the top of the ranking, not into an open field.
Filing peaked at 68 records in 2019 and has since pulled back, with a documented -76% move from 55 records in 2021 to 13 in 2024. That three-year span is the last one that can be treated as a complete picture, because publication typically lags filing by around 18 months, so 2025 and 2026 counts are still filling in. Read the recent slowdown as real but not necessarily final until later filing years finish publishing.
Polymer-composition claims under IPC class C08L cover 30.0% of the 1,235 records, the single largest class, closely followed by shaping-of-plastics claims under B29C at 26.8%. Additive claims (C08K, 20.7%) and condensation-polymer claims (C08G, 15.0%) trail those two. Because a single record can carry several IPC classes, these shares add up to more than 100% and should be read as overlapping claim coverage rather than mutually exclusive categories.
US20210032470A1, filed by Elkem Silicones USA Corp. and published in early 2021, covers a device assembly and method for producing molded silicone rubber products from liquid silicone rubber compositions via injection molding. Its core claims center on enabling faster cure at low mold-cavity temperatures without sacrificing cure speed or the physical properties of the finished part, which is what allows LSR overmolding directly onto heat-sensitive substrates. Anyone designing a low-temperature-cure LSR overmolding process should map their dosing, mixing and cavity-temperature approach against this filing before finalizing tooling design.
Filing density is comparatively thin in low-temperature cure for heat-sensitive substrate overmolding, flash-free cold-runner cavity design, self-adhesive grade primer-free bonding, precision shot-metering dosing units, and medical-grade LSR for fluid-contact devices relative to the dominant formulation and shaping classes. These are not gaps in the sense of zero prior art, but areas where the core C08L and B29C claim density thins out. A first claim in one of these branches should be checked specifically against the representative filings in that sub-area rather than against the field's aggregate concentration.
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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.
Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company’s registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.