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Run your analysis now →Filing growth compares 2021 (160 records) with 2024 (151) — a three-year span. 2024 is the most recent year we treat as complete: publication lags filing by roughly 18 months, so 2025 onwards are still filling in and any growth rate that ends there would understate the field. Top-5 share is the combined record count of the five largest assignees divided by all 4,482 records in scope (CR5), not by the ranked leaders only.
Low noise amplifier design sits at the intersection of RF front-end architecture and receiver sensitivity, and the patent record reflects that: claims cluster around noise figure, input matching, linearity, gain flatness and bias network techniques rather than any single circuit topology. The dataset spans 4,482 published families filed between 2015 and mid-2026, drawn from a search anchored on core amplifier IPC codes (H03F) and transmission codes (H04B).
Filing activity rose through the late 2010s, peaked in 2023, and has not broken through that ceiling since. Because publication typically lags filing by around 18 months, the most recent one to two years in any such trend will always look thinner than they eventually turn out to be — but the flattening visible from 2022 onward is wide enough to read as a real plateau, not just a reporting artefact.
Two views of the same 4,482-family dataset: how filing volume has moved year over year, and which IPC subclasses carry the claim weight.
Filings climbed from 154 in 2017 toward a peak of 174 in 2023, with 2022 sitting at 171 — a midpoint close to the peak, which is the signature of a technology that has stopped accelerating rather than one still building. The partial 2026 count of 20 is not yet meaningful given publication lag.
H03F (amplifiers) appears in 3,199 records and H04B (general transmission) in 1,942 — together accounting for the large majority of the corpus. Smaller but non-trivial clusters sit in H03G (gain and level control, 608), H03H (impedance networks and filters, 219) and H01L (semiconductor devices, 216), pointing to where secondary claim activity is happening around the core amplifier art.
Shares are the percentage of the 4,482 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.
This page is one run against one query. Ask Eureka your own question about low noise amplifier design and every answer comes back with the patent numbers behind it.
Try EurekaA low noise amplifier and an ultra-wideband receiver are provided. In the low noise amplifier a first amplifying unit includes a first common-source amplifier transistor, a second common-source amplifier transistor, a first negative feedback unit, a second negative feedback unit and an inter-stage matching unit. In the inter-stage matching unit the sixth inductor is in connection with a drain of the first common-source amplifier transistor, and the sixth inductor is in connection with the fourth capacitor to form a feedback node, the first transmission line inductor is in suspended connection with the feedback node, and the fourth capacitor is in connection with the gate of the second common-source amplifier transistor.Filed by Nanjing Milewei Corp, published 2026 — illustrates current-generation claim drafting around inter-stage matching and negative feedback in cascaded LNA stages.


| # | Publication no. | Patent title | Citations |
|---|---|---|---|
| 1 | US6366622B1 | Apparatus and method for wireless communications | 630 |
| 2 | US6026286A | RF amplifier, RF mixer and RF receiver | 412 |
| 3 | US5420536A | Linearized power amplifier | 388 |
| 4 | US6421389B1 | Baseband signal converter for a wideband impulse radio receiver | 315 |
| 5 | US6009129A | Device and method for detection and reduction of intermodulation distortion | 291 |
| 6 | US20060128322A1 | Transceiver apparatus and module | 252 |
| 7 | US20150091650A1 | Amplifier with Variable Feedback Impedance | 213 |
| 8 | US6414562B1 | Circuit and method for impedance matching | 210 |
| 9 | US6377784B2 | High-efficiency modulation RF amplifier | 208 |
| 10 | US20090233568A1 | High-linearity receiver with transmit leakage cancellation | 202 |
Citation counts inside a searched corpus favour older filings that have had more years to accumulate citations — read them as markers of foundational influence, not current commercial relevance.
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Browse MCP servers →Four read-outs from the dataset that matter more for strategy than the raw counts alone.
The climb from 154 filings in 2017 to a peak of 174 in 2023, with 2022 already at 171, shows a technology approaching saturation in its filing behaviour. New entrants are more likely to be designing around existing claims than opening new ground.
The United States receives more than three times the filings of the next office (EPO at 586), with China, WIPO/PCT, Japan and South Korea each holding meaningful but smaller shares. A freedom-to-operate check that skips China or Korea risks missing regionally-filed blocking art.
H03F carries the large majority of filings, with H04B transmission claims layered on top. Smaller clusters in H03G, H03H and H01L show where gain-control, filtering and device-level claims are being staked out adjacent to the core art.
The assignee with the most recent-year filings is still down 50% year over year, and several historically prolific names — including major semiconductor and telecom players — show zero filings in the latest year. That pattern is consistent with a claim space where the dominant architectures are already covered.
Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to low noise amplifier design, with the prior art for and against each one.
Filing activity concentrates among a small group of semiconductor and telecom-equipment firms, with a long tail of single- or few-filing entrants behind them. Co-assignment activity is sparse — only 10 co-assignee pairs appear across the entire corpus — suggesting most LNA IP is developed and held in-house rather than through joint filings.
Qualcomm remains the most active recent filer in this dataset, but its latest-year count is down 50% from the prior year — consistent with the broader plateau visible across the corpus rather than an isolated slowdown.
The strongest co-assignee pair links Samsung Electronics with Georgia Tech Research Corporation, and Qualcomm appears paired with individual named inventors rather than corporate co-assignees. Co-filing is not a major route into this space.
Broadcom, Ericsson and Motorola all show zero filings in the latest year despite substantial filing histories in the broader corpus, which may reflect either portfolio consolidation elsewhere or a view that the core design space is already adequately covered.
| Assignee | Recent year | YoY |
|---|---|---|
| Qualcomm Incorporated | 4 | -50% |
| Skyworks Solutions, Inc. | 1 | -90% |
| Samsung Electronics Co., Ltd. (Korea) | 1 | -50% |
| Broadcom Inc. | 0 | — |
| Telefonaktiebolaget LM Ericsson (Sweden) | 0 | — |
| Motorola, Inc. | 0 | — |
| Koninklijke Philips N.V. (Royal Philips) | 0 | — |
| PSemi Corporation | 0 | -100% |
The dataset points to specific next steps depending on whether the goal is freedom-to-operate, portfolio strategy, or identifying open filing territory.
With core H03F claim territory dense and recent filings like the Nanjing Milewei record staking out inter-stage matching and feedback-node architecture, any new cascaded-LNA design should be checked against this specific claim family before finalising a topology.
Explore in EurekaQualcomm's declining filing rate and the zero-filing status of Broadcom, Ericsson and Motorola in the latest year is worth monitoring quarter over quarter — a resumption in filing from any of these would signal renewed investment in the core architecture.
Explore in EurekaGain-flatness compensation and bias-network temperature stabilization show comparatively thin filing density relative to the core amplifier codes — worth a deeper prior-art pull before committing R&D budget to either.
Explore in EurekaQualcomm is the most active recent filer in this dataset, though its filing rate is down 50% year over year in the latest period. Historically prolific filers also include major semiconductor and telecom-equipment firms, several of which — including Broadcom, Ericsson and Motorola — show zero filings in the most recent year. The overall pattern is concentration among a handful of large filers with a long tail of smaller or single-filing entrants behind them.
Filing volume peaked so far in 2023 at 174 records and has not climbed meaningfully since, with 2022 already close to that peak at 171. This suggests the field has moved from active growth into a mature, contested phase where new filings are more likely to refine existing architectures than open new claim territory. Publication lag of roughly 18 months means the most recent year or two will always look thinner than the true filing rate, but the flattening trend predates that lag.
Core amplifier claims under IPC class H03F account for 3,199 of the 4,482 records, with general transmission claims under H04B present in 1,942. Secondary clusters appear in gain and level control (H03G), impedance networks and filters (H03H), and semiconductor device integration (H01L), which is where more specific circuit-level and device-level claims tend to sit. A search or FTO review limited to H03F alone would miss a substantial share of relevant claims in these adjacent codes.
The IPC composition suggests thinner filing density in sub-areas such as gain-flatness compensation networks, bias-network temperature stabilization, and the overlap between amplifier design and impedance-network filtering (H03H). These are not guaranteed to be open — thin filing density in a search corpus can also reflect narrower search coverage — but they are worth a dedicated prior-art pull before investing in a design direction assumed to be crowded based on H03F volume alone.
The United States dominates with 1,940 records, more than three times the next office. Europe (EPO) follows with 586, then WIPO/PCT filings at 434, China at 433, Japan at 187 and South Korea at 160. A freedom-to-operate search focused only on the US and Europe would miss a meaningful share of filings routed through China, PCT or Korea, particularly for firms with Asia-Pacific manufacturing or sales exposure.
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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.
Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company's registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.