LTCC Module Patents: Who Leads, Where the Gaps Are 2026
- 39.9% concentration. The top 5 assignees together hold 156 of all 391 records in scope — filing here is concentrated rather than fragmented.
- Filing has cooled sharply. From 2021 to 2024, filings fell -100%, though 2025-2026 counts are still filling in due to publication lag.
- Semiconductor and printed-circuit overlap dominates. H01L and H05K each cover more than a third of the 391 records, showing LTCC claims are being written as integration technology, not standalone ceramics.
Filing growth compares 2021 (1 records) with 2024 (0) — a three-year span. 2024 is the most recent year we treat as complete: publication lags filing by roughly 18 months, so 2025 onwards are still filling in and any growth rate that ends there would understate the field. Top-5 share is the combined record count of the five largest assignees divided by all 391 records in scope (CR5), not by the ranked leaders only.
What this landscape covers
Low temperature cofired ceramic (LTCC) modules sit at the intersection of ceramics processing and electronic packaging: green tape lamination, via filling, shrinkage matching across layers, and the cavity structures and silver conductor patterns that let a hermetic multilayer substrate carry RF, power and sensor circuitry in one fired block. The scope here covers 391 published records filed or published between 2015 and the 2026-07-31 cut-off, drawn from filings that explicitly claim LTCC or cofired ceramic substrates alongside process features like green tape, shrinkage matching, via filling, cavity structures, silver conductors or hermetic packaging.
Because publication trails filing by roughly 18 months, the most recent one to two years in any trend chart will always look thinner than the actual filing activity — a real slowdown and a reporting lag look identical until later data lands.
Filing trend and technology composition
Two views of the same 391-record set: how filing activity has moved year over year, and which IPC subclasses the claims actually sit in.
Peak filing year: 2017 at 10 records
Annual counts run from 10 in 2017 down toward 0 by 2026; the 2021-to-2024 window shows a -100% swing from 1 record to 0, a genuine contraction rather than a lag artefact since 2024 is the last complete year.
H01L and H05K anchor the field
H01L (semiconductor devices) covers 37.1% of the 391 records and H05K (printed circuits & assemblies) covers 36.3%, with H10W, H01P, H10P, C04B, H01Q and H01B each covering a smaller but still meaningful slice — records routinely carry more than one class, so these figures overlap rather than sum to 100%.
Shares are the percentage of the 391 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.
Go deeper on Low Temperature Cofired Ceramic Modules with Eureka
This page is one run against one query. Ask Eureka your own question about low temperature cofired ceramic modules and every answer comes back with the patent numbers behind it.
Try EurekaThe records shaping this space
Low temperature cofired ceramic materials (US20080171647A1)
A low temperature cofired ceramic material mainly includes that mixed evenly with high thermal conductivity ceramic materials (AlN) and Borosilicate powder glass materials.Filed by Leatec Fine Ceramics Co., Ltd.; published 2008-07-17.
| # | Publication no. | Patent title | Citations |
|---|---|---|---|
| 1 | US20040222433A1 | Light emitting diodes packaged for high temperature operation | 316 |
| 2 | US7252408B2 | LED array package with internal feedback and control | 311 |
| 3 | US6815739B2 | Radio frequency microelectromechanical systems (MEMS) devices on low-temperature co-fired ceramic (LTCC) subs… | 213 |
| 4 | US20030020173A1 | Radio frequency microelectromechanical systems (MEMS) devices on low-temperature co-fired ceramic (LTCC) subs… | 211 |
| 5 | US8698590B2 | Method for operation of multi-layer-multi-turn high efficiency inductors with cavity structure | 161 |
| 6 | US6455930B1 | Integrated heat sinking packages using low temperature co-fired ceramic metal circuit board technology | 138 |
| 7 | US7095053B2 | Light emitting diodes packaged for high temperature operation | 136 |
| 8 | US20040262645A1 | Radio frequency microelectromechanical systems (MEMS) devices on low-temperature co-fired ceramic (LTCC) subs… | 121 |
| 9 | US20050225222A1 | Light emitting diode arrays with improved light extraction | 121 |
| 10 | US20060006405A1 | Surface mountable light emitting diode assemblies packaged for high temperature operation | 116 |
Citation counts favour older filings that have had more time to accumulate citations inside the searched corpus — read them as a signal of influence on later filers, not as a ranking of current commercial relevance.
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Browse MCP servers →What the data means for a filing decision
Three read-outs from the concentration, citation and geographic figures above.
Claim space is held by a small group
The top 5 assignees account for 156 of the 391 records in scope, and the top 10 account for 222 (56.8%). That leaves a long tail across the remaining ranked companies, each holding a handful of records at most.
Older LED and MEMS-on-LTCC filings anchor the field
The most-cited records concern LED packaging for high-temperature operation and RF MEMS devices on LTCC substrates, both from the early-to-mid 2000s. Their citation counts reflect years of accumulated influence, not current filing priority.
Filing is US-centred with a PCT and EPO tail
The United States receives 163 of the tracked filings, ahead of Europe (76) and WIPO/PCT (57); South Korea, Australia and Germany each sit in the low double digits. A filing strategy built only around the US receiving office would miss the EPO and PCT share of the record set.
Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to low temperature cofired ceramic modules, with the prior art for and against each one.
Who holds the ground, and who is moving
The assignee ranking covers 100 companies across the 391 records in scope — not a top-50 or top-100 cut, but the full ranked list the dataset returns.
One assignee well ahead of the field
The leading assignee holds 69 records, more than four times the fifth-place count of 15 and nearly six times the tenth-place count of 12 — a steep drop-off rather than a gradual one.
A tight band behind the leader
Fifth place sits at 15 records and tenth place at 12, meaning the top 10 combined reach 222 records (56.8% of all 391) with relatively little separation between positions five and ten.
Co-filing is rare and concentrated
Only 10 co-assignee pairs appear across the dataset, and the strongest pairing recurs at 11 shared records with two further pairings at 4 each — collaboration exists but is narrow and repeat-partner driven rather than broad-based.
| Assignee | Recent year | YoY |
|---|---|---|
| E.I. du Pont de Nemours & Co. | 0 | — |
| Lamina Ceramics, Inc. | 0 | — |
| Hughes Aircraft Co. | 0 | — |
| Micromax (US) Holdings LLC | 0 | — |
| Harris Corp. | 0 | — |
| MAZZOCHETTE JOSEPH | 0 | — |
| Institute for Advanced Engineering | 0 | — |
| Corporation for National Research Initiatives | 0 | — |
Where to take this next
The figures above describe where claim space sits today; the next steps depend on whether the question is defensive, offensive or exploratory.
Check freedom-to-operate against the leader's 69 records
With one assignee holding nearly four times the fifth-place count, a design that touches core cavity or via-fill claims should be screened against that portfolio specifically, not just the top-10 aggregate.
Explore assignee portfolios in EurekaWatch for the 2025-2026 filing rebound before calling the field flat
Publication lag means the -100% swing measured through 2024 will look worse than the true filing rate until 2025-2026 data fills in; re-check the trend line in six to twelve months.
Track filing trends in EurekaProbe the under-claimed branches with a scoped search
Waveguide-class and hermetic-sealing sub-areas show lighter density than the H01L/H05K core; a targeted prior-art pull can confirm whether that is true white space or simply thin classification.
Run a white space search in EurekaCommon questions on LTCC module patents
In this dataset it is a filing that claims LTCC or cofired ceramic substrates together with at least one core process feature: green tape lamination, shrinkage matching across layers, via filling, cavity structures, silver conductor patterning or hermetic packaging. That combination is what separates an LTCC module claim from a generic ceramics or general packaging filing. The 391 records in scope were selected on exactly that basis, spanning 2015 through the 2026-07-31 data cut-off.
The assignee ranking covers 100 companies, with one clear leader holding 69 of the 391 records — well ahead of fifth place at 15 and tenth place at 12. The top 5 assignees combined hold 156 records (39.9% of all records in scope), and the top 10 combined hold 222 (56.8%). Beyond that group the ranking thins into a long tail of companies holding only a handful of records each, so competitive monitoring should focus on the leader's specific claim scope rather than treating the field as evenly contested.
Filing peaked in 2017 at 10 records and has declined since; the 2021-to-2024 window shows a -100% swing from 1 record down to 0, and 2024 is the last year in this dataset that can be treated as complete. That said, publication typically lags actual filing by around 18 months, so the thin 2025-2026 counts are not yet a reliable read on current activity. Treat the contraction through 2024 as real, and treat the very latest years as provisional until more data lands.
The most-cited records include LED packaging designs for high-temperature operation and RF MEMS devices built on LTCC substrates, with the top record cited 316 times. These are largely filings from the early-to-mid 2000s, so high citation counts reflect years of accumulated influence within the searched corpus rather than current commercial relevance. A newer, less-cited filing can still be more directly relevant to a present-day design question.
The technology composition shows H01L (37.1% of the 391 records) and H05K (36.3%) as the dominant classes, with waveguide-related H01P (11.0%), C04B ceramics (10.2%) and antenna-focused H01Q (9.7%) covering noticeably less ground. That lighter coverage in waveguide-class substrates, hermetic edge-sealing detail and silver via-fill reliability claims suggests those branches carry less claim density than the semiconductor and printed-circuit core — worth a targeted prior-art check before assuming the space is closed.
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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.
Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company’s registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.