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LPBF AI/ML Process Patent Landscape 2026

LPBF AI/ML Process Patent Landscape 2026
Competitive Landscape
LPBF AI/ML Process Patent Landscape in 2026

The AI/ML-driven laser powder bed fusion (LPBF) process space is in a confirmed growth stage, with annual filings expanding 78% over the recent window and the corpus reaching 190 patent families. The field is fragmented at the top — the five largest filers account for only 16% of the hundred largest filers’ combined total — with China-based institutions and a US national laboratory trading the leading positions.

190
Patent families in scope
16%
Top-5 share of top-100 filers
+78%
3-yr filing growth (lag-adj.)
China
Leading jurisdiction
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Published byPatSnap Insights Team··6 min readVerified by PatSnap Eureka data
Overview

Lawrence Livermore leads a fragmented, fast-growing field

Lawrence Livermore National Security LLC holds the top position with 10 patent families, followed by Optalysys at 6 and Nikon SLM Solutions AG at 5. The next tier — AECC Commercial Aircraft Engine, Nanjing University of Aeronautics and Astronautics, Huazhong University of Science and Technology, Tianjin University, and Taiwan Semiconductor Manufacturing — each hold 4 patent families, indicating a broadly distributed competitive base.

The top five filers together account for 16% of the hundred largest filers’ combined total, a notably low concentration figure. No single player has established dominant coverage, and the gap between rank 1 and rank 5 is narrow (10 vs. 4 patent families), signaling that the competitive hierarchy remains highly contestable.

Leading applicants
#ApplicantPatent familiesShare
1Lawrence Livermore National Security LLC10
2Optalysys6
3Nikon SLM Solutions AG5
4Bull SA4
5AECC Commercial Aircraft Engine Co. Ltd.4
6NANJING UNIV OF AERONAUTICS & ASTRONAUTICS4
7AECC Shanghai Commercial Aircraft Engine Manufacturing Co. Ltd.4
8HUAZHONG UNIV OF SCI & TECH4
9Tianjin University4
10Taiwan Semiconductor Manufacturing Co. Ltd.4
#ApplicantPatent familiesShare
11Wuhan University3
12NANJING UNIV OF AERONAUTICS & ASTRONAUTICS WUXI RE…3
13Xi’an Jiaotong University3
14PredictSpring3
15South China University of Technology3
16RTX Corporation3
17CHONGQING INST OF GREEN & INTELLIGENT TECH CHINESE…3
18Xidian University3
19Google LLC3
20Siemens AG3
↗ Hover a row · click a company to ask Eureka

Lawrence Livermore’s lead reflects a government-funded R&D mandate in process qualification and materials characterization, while the cluster of Chinese universities and aerospace engine manufacturers points to industrial adoption priorities in aviation-grade components. New entrants can still stake meaningful positions without competing against entrenched patent thickets.

Patent filings from approximately 20242026 are under-represented due to typical publication lags of 12–18 months; the most recent annual figures should be treated as floor estimates rather than final counts. Longer-window growth, applicant concentration, and technology-route coverage are therefore more reliable signals than the latest-year bar alone.

Source: PatSnap Eureka. Chart shows the top applicants ranked by patent families. Applicant counts can overlap where a patent family lists several applicants, so they need not sum to the total in scope.Explore deeper in Eureka →
Trends & Structure

Rapid growth since 2021, anchored by additive manufacturing and AI computing classes

Annual filing volume and technology class distribution together reveal a field still in active expansion, with the AI and additive manufacturing branches developing in parallel rather than sequentially.

Annual filing trend

Filings grew steadily from 2 in 2017 to a recorded high of 47 in 2025, with a 78% increase over the recent window. The 2026 figure of 4 reflects publication lag and is not a signal of slowdown. A visible dip in 2022 (9 filings) interrupted the growth trajectory before a strong rebound in 2023 (28) and continued acceleration through 2024–2025.

Annual filing trendAnnual values from 2017 to 2026, peaking at 47 in 2025.22017920181220191320202120219202228202345202447202542026↗ Hover for values · click a bar to ask Eureka

Technology composition

Three branches — B33Y (additive manufacturing/3D printing, 107 records), B22F (powder metallurgy, 106 records), and G06N (AI computing models, 105 records) — are nearly co-equal in coverage, confirming that this corpus genuinely bridges process engineering and machine learning. G06F (digital data processing, 46 records) and G06V (image/video recognition, 24 records) form a secondary tier relevant to in-situ monitoring and quality inspection applications. Lower-share branches such as G05B (control and regulating systems, 9 records) and G01N (material analysis and testing, 8 records) remain sparsely covered.

Technology compositionB33Y · Additive manufacturing (3D printing) leads with 107; B22F · Powder metallurgy 106.B33Y · Additive manufact…107B22F · Powder metallurgy106G06N · Computing based o…105G06F · Electric digital …46G06V · Image/video recog…24B29C · Shaping of plastics19G06T · Image data proces…18C22C · Alloys9↗ Hover for values · click a bar to ask Eureka
Source: PatSnap Eureka. Technology-branch counts are measured in patent records; a single patent family can carry several IPC classes, so class totals can exceed the family total in scope.Explore deeper in Eureka →
Key Patents

Highly cited patent families surfaced by the query

Citation-heavy patent families returned by the query. Use this section as citation context, not as a curated list of the most topic-specific patents.

Featured patent
US20260042147A1Published 2026-02-12

Machine learning thermal management system for add…

Virginia Tech Intellectual PROPERTIES, INC.

A thermal measurement system enables high-resolution sub-surface temperature monitoring during additive manufacturing processes through machine learning demodulation of chirped fiber Bragg grating (C-FBG) sensors. An optical sensing subsystem includes a C-FBG sensor that encodes spatial temperature information in wavelength for high-temperature operation. A… (excerpt from the patent abstract)

Machine learning thermal management system for add… — patent drawingMachine learning thermal management system for add… — patent drawing
Representative drawings from the patent document.
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Highly cited patent families surfaced by this query
#PatentCitations
1Neural processor with holographic optical paths an…88
2一种针对激光选区熔化成形缺陷的在线检测与优化系统50
3Optical processor for an artificial neural network42
4基于神经网络的ACO-OFDM系统综合PAPR抑制方法及系统35
5Method for automatically preventing defects potent…25
6Neural processor with holographic optical paths an…24
7Predicting system in additive manufacturing proces…23
8一种激光选区熔化技术原位质量综合评价方法19

Ranked by total forward citations. Citation counts favour older and broadly cited patent families, and broad or adjacent patents may appear when they match the search scope. Treat this section as citation context, not as a curated list of the most topic-specific patents. Some patent titles may be shown in their original, non-English language where an accurate translation could not be guaranteed.

Source: PatSnap Eureka. Citation-ranked patent families surfaced by this query.Open in Eureka →
Insights

What the patent structure means for R&D investment decisions

The combination of low concentration, broad geographic filing, and strong annual growth defines a field where strategic positioning is still achievable. The following cards draw out the key structural signals.

Growth

Growth stage: annual filings still rising

The lifecycle evidence classifies this field as Growth, with annual filings still rising and recent-window growth of 78%. The 2024 and 2025 cohorts are the largest on record, and the 2026 figure is artificially suppressed by publication lag. Teams entering now will face a moving frontier rather than an entrenched prior-art wall, but the window for low-cost freedom-to-operate is narrowing as institutional filers accelerate.

Growth stage
Concentration

Low concentration: top five hold 16% of the leading hundred filers

The top five applicants collectively account for 16% of the hundred largest filers’ combined total — an unusually low figure for a maturing technical field. The gap between the leader (10 patent families) and the fifth-ranked applicants (4 patent families each) is small enough that a focused filing program over 12–18 months could move a new entrant into the top tier. No participant has yet built a blocking portfolio across the full AI-LPBF stack.

Fragmented
Collaboration

Co-filing concentrated in Chinese aerospace and university pairs

The most active co-filing relationship (4 joint families) is between AECC Commercial Aircraft Engine Co. and AECC Shanghai Commercial Aircraft Engine Manufacturing Co., reflecting coordinated IP strategy within the same state enterprise group. Nanjing University of Aeronautics and Astronautics collaborates with its own Wuxi Research Institute (3 joint families), indicating intra-institution portfolio structuring. Huazhong University of Science and Technology and Xi’an Aerospace Engine Co. share 1 joint family. Cross-sector or international co-filing is not yet in evidence at scale.

Ecosystem forming
Geography

China dominates filings; US and PCT routes provide international coverage

China accounts for the largest share of patent records, followed by the United States (43 records) and WIPO PCT (22 records). Europe via the EPO (14 records) and India (11 records) form a secondary tier. The UK (5 records), South Korea (3 records), Germany (2 records), and Taiwan (2 records) are present but sparse. Japan holds only 1 record despite being a major LPBF equipment market — a gap that may reflect either licensing strategy or under-filing relative to commercial activity.

China-led
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Top collaboration links
ApplicantCollaboratorCo-filings
AECC Commercial Aircraft Engine Co. Ltd.AECC Shanghai Commercial Aircraft Engine Manufacturing Co. Ltd.4
Nanjing University of Aeronautics and AstronauticsNanjing University of Aeronautics and Astronautics Wuxi Research Institute3
Huazhong University of Science and TechnologyXi’an Aerospace Engine Co. Ltd.1

Co-filing pairs, ranked by the number of jointly-filed patent families.

Source: PatSnap Eureka. Cards are grounded in applicant ranking, lifecycle, collaboration, and jurisdiction evidence.Explore insights →
Leaders

Lawrence Livermore and Optalysys lead by distinct technology routes

The top two applicants reflect fundamentally different approaches: one anchored in physical process control for LPBF, the other in optical neural network hardware that intersects with the field. Trajectory data marks both as new entrants on a multi-year basis.

Leader · Lawrence Livermore National Security LLC

Lawrence Livermore National Security LLC

Holds 10 patent families, the largest position in the corpus. Technology emphasis is squarely on LPBF process engineering: the top focus areas are B33Y10 (additive manufacturing process, 9 records), B22F10 (powder metallurgy process, 7 records), and B33Y30 (additive manufacturing apparatus, 7 records). Momentum is flagged as a new entrant on a multi-year basis, meaning its current lead has been built recently rather than over a long filing history — suggesting the portfolio is concentrated in a short, intensive campaign rather than compounded over years.

patent families: 10
Challenger · Optalysys

Optalysys

Holds 6 patent families, ranked second. Its technology emphasis diverges sharply from the process-control mainstream: top focus areas are G06N3 (neural network computing, 6 records), G06V10 (image/video recognition, 6 records), and G06K9 (data recognition, 3 records) — indicating a positioning around optical computing hardware for AI inference rather than LPBF process control per se. This makes Optalysys a potential enabler or supplier to LPBF AI systems rather than a direct process IP competitor. Momentum is also flagged as a new entrant.

patent families: 6
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Nikon SLM Solutions AGNanjing University of Aeronautics and Astronautics+ more
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Leading-applicant momentum (recent 3 yrs, lag-adjusted)
ApplicantRecent (3 yrs)Trend
Lawrence Livermore National Security LLC2▲ new entrant
Hunan Luojia Intelligent Technology Co. Ltd.4▲ new entrant
Tianjin University4▲ new entrant
Taiwan Semiconductor Manufacturing Co. Ltd.3▲ new entrant
Nanjing University of Aeronautics and Astronautics4▲ new entrant
Huazhong University of Science and Technology1▲ new entrant
Source: PatSnap Eureka. Rankings and technology emphasis derived from applicant family counts and IPC focus data.Explore players →
Adjacent Branches

Under-served branches adjacent to the LPBF AI/ML core

Several IPC classes appear at the margins of the dominant B33Y/B22F/G06N core. These represent areas of relative sparsity and, in two cases, plausible technical value and realistic entry paths.

G05B · Control and regulating systems

With only 9 patent records, closed-loop real-time control systems — linking AI inference output directly to laser power, scan speed, or layer parameters — are sparsely covered relative to the field’s size. The technical case is strong: LPBF process quality is highly sensitive to moment-to-moment parameter adjustment, and AI models are increasingly capable of providing control signals in near-real-time. Existing work in G06N and G06V provides a platform from which a team with controls expertise could extend into G05B filings with limited prior-art overlap.

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G01N · Material analysis and testing

Only 8 patent records touch material analysis and testing (G01N), despite in-situ melt-pool characterization and post-build microstructure analysis being active research areas for AI-assisted LPBF qualification. The sparse coverage may reflect that most current work frames monitoring as image processing (G06V, G06T) rather than material science. A filing strategy that explicitly claims AI-driven methods for material property prediction or non-destructive evaluation of LPBF parts could occupy a relatively open adjacent space, particularly for aerospace and medical implant qualification workflows.

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See all sparse IPC branches with filing counts, share of corpus, and suggested search strategies across the LPBF AI/ML landscape.
C22C · AlloysG06T · Image data processing and generation+ more
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Source: PatSnap Eureka. Branch counts are at the patent-record level; a family can be tagged to multiple branches.Explore emerging →
Route Matrix

How leading applicants differ across technology routes

Route coverage across the main technology branches in the current evidence set.

PlayerG06N 3 · Computing based on AI modelsB22F 10 · Powder metallurgyB33Y 50 · Additive manufacturing (3D printing)B33Y 10 · Additive manufacturing (3D printing)B22F 12 · Powder metallurgy
Lawrence Livermore National Security LLCAbsentStrong · 7Strong · 7Strong · 9Strong · 6
Nanjing University of Aeronautics and AstronauticsStrong · 3Strong · 3Strong · 3Strong · 2Absent
Tianjin UniversityAbsentStrong · 4Strong · 4Strong · 3Absent
Hunan Luojia Intelligent Technology Co. Ltd.AbsentStrong · 4Strong · 4AbsentModerate · 2
Nikon SLM Solutions AGAbsentStrong · 5Strong · 4AbsentAbsent
OptalysysStrong · 6AbsentAbsentAbsentAbsent
AECC Shanghai Commercial Aircraft Engine Manufacturing Co. Ltd.AbsentAbsentStrong · 3Strong · 3Absent
Source: PatSnap Eureka. Matrix values are measured in patent records and should not be compared directly with family-level applicant totals.Compare in Eureka →
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Disclaimer. This page is generated from PatSnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

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