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LPBF Build Efficiency Patent Snapshot 2026

LPBF Build Efficiency Patent Snapshot 2026
Evidence Snapshot
LPBF Build Efficiency Patent Snapshot in 2026

The LPBF build efficiency patent space is nascent but accelerating, with academic and research institutions dominating a corpus that grew 600% in the recent three-year window versus the prior period. KU Leuven holds the clearest lead, while WIPO (PCT) filings signal early cross-border commercialization intent from a field still largely shaped by university research.

11
Patent families in scope
N/A
Concentration not assessed
N/A
Growth trend not assessed
WIPO (PCT)
Leading jurisdiction
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Published byPatsnap Insights Team··6 min readVerified by Patsnap Eureka data
Overview

Academic institutions lead a nascent, fast-growing field

KU Leuven ranks first with 2 patent records, ahead of a field where every other named filer holds a single record — a flat, wide competitive tier reflecting the technology’s early-stage character rather than consolidated corporate dominance.

The top five filers account for 40% of the ranked applicants visible in this query’ combined total, a moderate concentration figure for a corpus this small, suggesting no single incumbent has yet established a decisive portfolio advantage.

Leading applicants
#ApplicantPatent recordsShare
1KU Leuven (Katholieke Universiteit Leuven)2
2Guangdong Industry Technical College1
3Nanyang Technological University1
4Changsha Lubang Optoelectronics Technology Co., Ltd.1
5Shenzhen Lubang Optical Technology Co., Ltd.1
6Carnegie Mellon University1
7South China University of Technology1
#ApplicantPatent recordsShare
8Purdue Research Foundation1
9SEC Co., Ltd.1
10HONEYWELL FEDERAL MANUFACTURING & TECHNOLOGIES LLC1
11Wisconsin Alumni Research Foundation1
12KU Leuven (Katholieke Universiteit Leuven) KU LEUVEN RES & DEV1
13University of Virginia Patent Foundation1
14Xi’an Intai Additive Manufacturing Technology Co., Ltd.1
↗ Hover a row · click a company to ask Eureka

The leaders’ positions imply that first-mover advantages remain largely unclaimed: universities and government-linked foundations rather than industrial manufacturers hold most records, leaving room for corporate entrants to build meaningful positions quickly.

The most recent filing years are further understated by standard patent publication lag; apparent 20252026 activity should be treated as a floor, not a ceiling. Longer-window growth, applicant concentration, and technology-route coverage are therefore more reliable signals than the latest-year bar alone.

Source: Patsnap Eureka. Chart shows the top applicants ranked by patent records; the corpus total is measured in patent families. These figures use different units and should not be compared directly. This same dataset is now available on Patsnap Open Platform via MCP.Connect via MCP →
Trends & Structure

A 2023 surge anchors multi-year growth; powder metallurgy dominates the technology mix

Filing activity was absent through 2020 before a measurable pulse appeared in 2021, and the field is still expanding on a multi-year basis (recent-window growth 600% vs the prior three-year window), though annual volume has eased from its 2023 peak. B22F (powder metallurgy) and B33Y (additive manufacturing) together cover virtually the entire corpus, confirming that LPBF build efficiency is being prosecuted through its direct process and AM classification pathways.

Annual filing trend

Activity was zero from 2017 through 2020, spiked in 2023, and remains elevated in 2024–2025; treat the two most recent years as understated due to publication lag — the apparent plateau should not be read as stagnation.

Annual filing trendAnnual values from 2017 to 2026, peaking at 4 in 2023.02017020180201902020120210202242023320243202502026↗ Hover for values · click a bar to ask Eureka

Technology composition

B22F and B33Y each cover nearly the full corpus, reflecting overlapping IPC classification; lower-share branches — C22C (alloys), B29C (plastics shaping), G01N (material analysis), G06T (image processing), and H01M (batteries/cells) — appear at single-record counts, marking the boundaries of adjacent technical territory.

Technology compositionB22F · Powder metallurgy leads with 11; B33Y · Additive manufacturing (3D printing) 10.B22F · Powder metallurgy11B33Y · Additive manufact…10B29C · Shaping of plastics3C22C · Alloys2B29D · Specific plastic …1C23C · Coating & surface…1G01N · Material analysis…1G06T · Image data proces…1↗ Hover for values · click a bar to ask Eureka
Source: Patsnap Eureka. Technology-branch counts are measured in patent records; a single patent family can carry several IPC classes, so class totals can exceed the family total in scope.Explore deeper in Eureka →
Key Patents

Highly cited patent families surfaced by the query

Citation-heavy patent families returned by the query. Use this section as citation context, not as a curated list of the most topic-specific patents.

Featured patent
WO2022035374A1Published 2022-02-17

In-SITU alloying via laser powder bed fusion

Nanyang Technological University

A laser powder bed fusion additive manufacturing method for in-situ alloying. The Laser Induced Melt pool Enhancement (LIME) method includes using a laser to scan at a scanning speed in scan direction along a plurality of scan paths, and forming a sustained melt pool in a mixture of powders deposited in the powder bed. The sustained melt pool has a net melt… (excerpt from the patent abstract)

In-SITU alloying via laser powder bed fusion — patent drawingIn-SITU alloying via laser powder bed fusion — patent drawing
Representative drawings from the patent document.
Open this patent in Eureka →
Highly cited patent families surfaced by this query
#PatentCitations
1In-SITU alloying via laser powder bed fusion3
2System and method for local PORE detection in lase…2
3Method of determining process parameters for laser…2
4一种适用于有机液流电池的电极及其制备方法1
5一种激光粉末床熔融热扫描层析质量评价方法、系统1
6Method of additive manufacturing of refractory all…1

Ranked by total forward citations. Citation counts favour older and broadly cited patent families, and broad or adjacent patents may appear when they match the search scope. Treat this section as citation context, not as a curated list of the most topic-specific patents. Some patent titles may be shown in their original, non-English language where an accurate translation could not be guaranteed.

Source: Patsnap Eureka. Citation-ranked patent families surfaced by this query.Open in Eureka →
Visible assignees

Assignee snapshot from the current evidence set

The applicants below are visible in this query result. Because the evidence set is relatively small, read this section as a directional snapshot rather than a full competitive ranking.

Leader · KU Leuven

KU Leuven

KU Leuven holds 2 patent records — the largest single portfolio in the corpus — with technology emphasis on B22F 10 (powder metallurgy process control), B33Y 10, and B33Y 50 (additive manufacturing process and control/monitoring). Both its main entity and its KU Leuven Research & Development arm entered as new entrants in the recent window, suggesting coordinated institutional filing activity rather than a legacy portfolio.

patent records: 2
Challenger · Honeywell Federal Manufacturing & Technologies

Honeywell Federal Manufacturing & Technologies

Honeywell Federal Manufacturing & Technologies holds 1 patent record and entered as a new entrant in the recent window, with technology emphasis spanning B22F 10, B22F 3 (powder metallurgy compaction/sintering), and B29C 64 (additive manufacturing of plastics). It is the most networked industrial filer in the corpus, co-filing with the University of Virginia Patent Foundation, Wisconsin Alumni Research Foundation, and Carnegie Mellon University — positioning it as the primary bridge between industrial manufacturing capability and university research in this space.

patent records: 1
🔍
More assignee evidence is available in Eureka
Use Eureka to validate whether these visible assignees remain central after refining the query scope and adding related patent classes.
Purdue Research FoundationNanyang Technological University+ more
Unlock full assignee analysis →
Source: Patsnap Eureka. Assignee evidence is drawn from the current PatSnap Eureka query. In small evidence sets, applicant counts should be treated as directional signals, not a complete competitive ranking.Explore players →
Frequently asked questions

Frequently asked questions

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Built on Patsnap Open Platform

This report’s underlying patent dataset — filings, assignees, technology clusters — is open for developers via MCP and REST API. Free to start, 10,000 credits, no credit card required.

Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

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