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LPBF CT & In-situ Inspection Patent Snapshot 2026

LPBF CT & In-situ Inspection Patent Snapshot 2026
Evidence Snapshot
LPBF CT & In-situ Inspection Patent Snapshot in 2026

The LPBF CT and in-situ inspection space comprises 38 patent families, led by Lawrence Livermore National Security LLC with the largest single-filer position; activity has plateaued near its 2024 peak with filings spread across a fragmented mix of national labs, OEMs, and aerospace primes. China and the United States share the lead jurisdiction, and AI-assisted quality monitoring represents the most active frontier for new entrants.

38
Patent families in scope
31%
Top visible applicants share
0%
3-yr filing growth (lag-adj.)
China
Leading jurisdiction
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Published byPatSnap Insights Team··6 min readVerified by PatSnap Eureka data
Overview

Lawrence Livermore leads a fragmented, early-plateau field

Lawrence Livermore National Security LLC holds the top position with 5 patent records, followed by Nikon SLM Solutions AG with 4 and two AECC aerospace entities and Siemens AG each with 3 — a ranking that reflects the field’s roots in federally funded research and industrial machine-builder development.

The top five filers account for 31% of the combined total across the ranked applicants visible in this query, a moderate concentration level indicating no single entity has locked up the space. The gap between the leader (5 records) and the second tier (3–4 records) is narrow, leaving the competitive order contestable.

Leading applicants
#ApplicantPatent recordsShare
1Lawrence Livermore National Security LLC5
2Nikon SLM Solutions AG4
3AECC Commercial Aircraft Engine Co. Ltd.3
4AECC Shanghai Commercial Aircraft Engine Manufacturing Co. Ltd.3
5Siemens AG3
6Peridot Print LLC2
7Hunan Luojia Intelligent Technology Co. Ltd.2
8Alfonso Ruiz Rodríguez1
9Jentek Sensors Inc.1
10Graphic Era Deemed University1
#ApplicantPatent recordsShare
11Dr. Hari Kumar Singh1
12Dr. Bijaya Bijeta Nayak1
13Queen’s University1
14Jihua Laboratory1
15Guangzhou Ante Laser Technology Co. Ltd.1
16Xi’an Jiaotong University1
17Dr. Brajesh Kumar1
18K. Tamilselvan1
19Beijing Institute of Aerospace Control Devices1
20NANJING UNIV OF AERONAUTICS & ASTRONAUTICS1
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The leader’s position, grounded in national-lab process-control research, and the challengers’ positions in machine integration and aerospace qualification suggest that IP strategy is currently driven by distinct use-case priorities rather than head-on competition on a single claim set.

Patent records filed in the most recent 18–24 months are subject to publication lag and likely under-represent actual recent activity; the plateau read should be treated as provisional for that window. Longer-window growth, applicant concentration, and technology-route coverage are therefore more reliable signals than the latest-year bar alone.

Source: PatSnap Eureka. Chart shows the top applicants ranked by patent records; the corpus total is measured in patent families. These figures use different units and should not be compared directly.Explore deeper in Eureka →
Trends & Structure

Annual filings have plateaued; additive manufacturing and powder metallurgy dominate the technology mix

The trend chart reveals an irregular but generally upward trajectory since 2017, peaking around 2024, while the technology composition chart shows B33Y and B22F classes together account for nearly the entire corpus, with AI and inspection branches as secondary but growing contributors.

Annual filing trend

Filings were sparse through 2017, rose to a band of 6 per year in 2018, 2020, and 2021, then eased briefly in 2022–2023 before reaching a recorded high of 8 in 2024 and 7 in 2025. The 2025 and 2026 bars are subject to publication lag and should not be read as declines; the field has plateaued near its peak rather than falling.

Annual filing trendAnnual values from 2017 to 2026, peaking at 8 in 2024.12017620180201962020620212202222023820247202502026↗ Hover for values · click a bar to ask Eureka

Technology composition

B33Y (Additive manufacturing) and B22F (Powder metallurgy) together saturate the corpus, confirming that most filings are anchored in the core LPBF process. G06N (AI/computing models), G01N (material analysis and testing), and G06T (image data processing) each hold smaller but meaningful shares, signalling that algorithmic quality control and sensor-based inspection are emerging sub-themes within an otherwise process-centric field.

Technology compositionB33Y · Additive manufacturing (3D printing) leads with 38; B22F · Powder metallurgy 36.B33Y · Additive manufact…38B22F · Powder metallurgy36B29C · Shaping of plastics7G06N · Computing based o…6G01N · Material analysis…5G06T · Image data proces…5B23K · Welding, solderin…3G05B · Control & regulat…2↗ Hover for values · click a bar to ask Eureka
Source: PatSnap Eureka. Technology-branch counts are measured in patent records; a single patent family can carry several IPC classes, so class totals can exceed the family total in scope.Explore deeper in Eureka →
Key Patents

Highly cited patent families surfaced by the query

Citation-heavy patent families returned by the query. Use this section as citation context, not as a curated list of the most topic-specific patents.

Featured patent
US20210331271A1Published 2021-10-28

Selective laser melting (SLM) additive manufacturing

Peridot Print LLC

An in-situ monitoring device for selective laser melting (SLM) additive manufacturing may include at least one coherent electromagnetic wave source to produce a detection beam, an interferometer interposed between the electromagnetic wave source and a target detection area, a photodetector to detect displacement measuring interference between… (excerpt from the patent abstract)

Selective laser melting (SLM) additive manufacturing — patent drawingSelective laser melting (SLM) additive manufacturing — patent drawing
Representative drawings from the patent document.
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Highly cited patent families surfaced by this query
#PatentCitations
1一种针对激光选区熔化成形缺陷的在线检测与优化系统50
2Method for automatically preventing defects potent…25
3Method for automatic identification of material de…15
4Deep-learning-based SLM online quality monitoring …14
5Laser powder bed fusion additive manufacturing in-…13
6一种钛合金横孔的激光选区熔化无支撑成形方法12
73d-printing method and manufacturing device12
8一种具有原位监测功能的LPBF增材制造装置及方法9

Ranked by total forward citations. Citation counts favour older and broadly cited patent families, and broad or adjacent patents may appear when they match the search scope. Treat this section as citation context, not as a curated list of the most topic-specific patents. Some patent titles may be shown in their original, non-English language where an accurate translation could not be guaranteed.

Source: PatSnap Eureka. Citation-ranked patent families surfaced by this query.Open in Eureka →
Visible assignees

Assignee snapshot from the current evidence set

The applicants below are visible in this query result. Because the evidence set is relatively small, read this section as a directional snapshot rather than a full competitive ranking.

Leader · Lawrence Livermore National Security LLC

Lawrence Livermore National Security LLC

Holds 5 patent records, the largest single-entity position in the corpus, with technology focus spanning B33Y10 (process), B33Y30 (apparatus), and B33Y50 (quality and data) — indicating broad coverage of the LPBF in-situ monitoring workflow rather than a narrow claim set. Applicant momentum is flagged as a new entrant in the recent period, suggesting the bulk of its portfolio was established earlier and recent filings represent a fresh filing tranche rather than sustained long-term volume.

patent records: 5
Challenger · Nikon SLM Solutions AG

Nikon SLM Solutions AG

Holds 4 patent records, with technology focus concentrated in B22F10 (powder metallurgy process) and B33Y50 (quality and data), plus B22F12 (apparatus). This positioning reflects a machine-builder approach — tying in-situ inspection IP directly to powder-bed fusion process control — which complements the company’s hardware platform strategy. No momentum data is available in the recent period beyond the existing record count.

patent records: 4
🔍
More assignee evidence is available in Eureka
Use Eureka to validate whether these visible assignees remain central after refining the query scope and adding related patent classes.
Siemens AGHunan Luojia Intelligent Technology Co. Ltd.+ more
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Source: PatSnap Eureka. Assignee evidence is drawn from the current PatSnap Eureka query. In small evidence sets, applicant counts should be treated as directional signals, not a complete competitive ranking.Explore players →
Frequently asked questions

Frequently asked questions

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Disclaimer. This page is generated from PatSnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. PatSnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

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