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LPBF In-Process Quality Control Patent Snapshot 2026

LPBF In-Process Quality Control Patent Snapshot 2026
Evidence Snapshot
LPBF In-Process Quality Control Patent Snapshot in 2026

The LPBF in-process quality control patent space is small and concentrated, with Nikon SLM Solutions AG and Lawrence Livermore National Security LLC jointly dominating the leading positions. Activity peaked in 2021 and annual volume has eased since, leaving a field where a focused entrant can still establish differentiated positions in under-served branches.

12
Patent families in scope
N/A
Concentration not assessed
N/A
Growth trend not assessed
United States
Leading jurisdiction
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Published byPatsnap Insights Team··6 min readVerified by Patsnap Eureka data
Overview

A tightly held niche co-led by an industrial OEM and a national laboratory

The LPBF in-process quality control patent space is led by Nikon SLM Solutions AG and Lawrence Livermore National Security LLC, each holding 4 patent records — a shared top position that is unusual and signals different but complementary innovation pathways: one commercial, one government-funded.

The top five filers account for 46% of the combined patent records held by the ranked applicants visible in this query, indicating moderate-to-high concentration for a niche field of this size. Below the co-leaders, nearly every other applicant holds a single patent record, pointing to a long, flat tail with minimal challenger depth.

Leading applicants
#ApplicantPatent recordsShare
1Nikon SLM Solutions AG4
2Lawrence Livermore National Security LLC4
3K Tamilselvan1
4K Sivaramakrishnan1
5U Sujan1
6V Skandhakumar1
7S Senthil Kumar1
8K Rajasuresh1
9R Elakkiyadasan1
#ApplicantPatent recordsShare
10A Sam Immanuel1
11M Shek Mubarak1
12Siemens AG1
13K Venkatesan1
14DMG Mori Additive GmbH1
15Virginia Tech Intellectual Properties Inc1
16R Saron1
17P Vijaykannan1
18N Sathishkumar1
↗ Hover a row · click a company to ask Eureka

The co-leaders’ positions imply that any entrant seeking freedom-to-operate or licensing leverage must contend primarily with two distinct institutional types — a machine builder with process IP and a national lab with federally funded research — each of which may have different licensing postures and enforcement behaviors.

Filings from approximately the last 18–24 months are likely under-represented due to standard patent publication lag and should not be read as evidence of continued decline. Longer-window growth, applicant concentration, and technology-route coverage are therefore more reliable signals than the latest-year bar alone.

Source: Patsnap Eureka. Chart shows the top applicants ranked by patent records; the corpus total is measured in patent families. These figures use different units and should not be compared directly. This same dataset is now available on Patsnap Open Platform via MCP.Connect via MCP →
Trends & Structure

A 2021 activity peak followed by a quieter filing environment, anchored in powder-metallurgy and additive-manufacturing classes

The annual filing trend reveals a clear spike in 2021 before volume fell back, while the technology composition shows that B22F and B33Y classes are visible in, with a handful of adjacent branches receiving very sparse coverage.

Annual filing trend

Filings were negligible before 2018, rose to a peak of 5 records in 2021, then dropped sharply. Years 2024–2026 show very low counts that are likely incomplete due to publication lag and should not be interpreted as structural decline beyond the post-2021 easing already evident.

Annual filing trendAnnual values from 2017 to 2026, peaking at 5 in 2021.02017220180201922020520210202212023220240202502026↗ Hover for values · click a bar to ask Eureka

Technology composition

B22F (powder metallurgy) and B33Y (additive manufacturing) are the visible IPC classes, each with 13 patent records, confirming that core process and machine IP anchors this space. B29C, B28B, G06F, B01D, and G01N appear at much lower counts, representing adjacent technical territory that remains comparatively open.

Technology compositionB22F · Powder metallurgy leads with 13; B33Y · Additive manufacturing (3D printing) 13.B22F · Powder metallurgy13B33Y · Additive manufact…13B29C · Shaping of plastics3B28B · Shaping clay & ce…2G06F · Electric digital …2B01D · Separation proces…1G01N · Material analysis…1↗ Hover for values · click a bar to ask Eureka
Source: Patsnap Eureka. Technology-branch counts are measured in patent records; a single patent family can carry several IPC classes, so class totals can exceed the family total in scope.Explore deeper in Eureka →
Key Patents

Highly cited patent families surfaced by the query

Citation-heavy patent families returned by the query. Use this section as citation context, not as a curated list of the most topic-specific patents.

Featured patent
US20240300020A1Published 2024-09-12

Real-time control of laser power for laser powder …

Virginia Tech Intellectual PROPERTIES, INC.

An example feedback control system includes a laser powder bed fusion (L-PBF) platform including a laser. The L-BPF platform is configured to print a target object with the laser. The feedback control system includes a sensing system configured to measure an operative thermal emission index (TEI) emitted during print of the target object by the L-PBF… (excerpt from the patent abstract)

Real-time control of laser power for laser powder … — patent drawingReal-time control of laser power for laser powder … — patent drawing
Representative drawings from the patent document.
Open this patent in Eureka →
Highly cited patent families surfaced by this query
#PatentCitations
1Production system for the simultaneous, rapid manu…31
2Method for automatic identification of material de…15
3Laser powder bed fusion additive manufacturing in-…13
4Systems and methods9
5Systems and Methods6
6Laser powder bed fusion additive manufacturing in-…3
7Production system for the simultaneous, rapid manu…2
8Laser powder bed fusion additive manufacturing in-…1

Ranked by total forward citations. Citation counts favour older and broadly cited patent families, and broad or adjacent patents may appear when they match the search scope. Treat this section as citation context, not as a curated list of the most topic-specific patents. Some patent titles may be shown in their original, non-English language where an accurate translation could not be guaranteed.

Source: Patsnap Eureka. Citation-ranked patent families surfaced by this query.Open in Eureka →
Visible assignees

Assignee snapshot from the current evidence set

The applicants below are visible in this query result. Because the evidence set is relatively small, read this section as a directional snapshot rather than a full competitive ranking.

Leader · Nikon SLM Solutions AG

Nikon SLM Solutions AG

Holding 4 patent records, Nikon SLM Solutions AG focuses on B22F powder-metallurgy process classes, B33Y additive-manufacturing monitoring, and G06F digital data processing — a combination that reflects integration of sensor and data-analytics IP directly into machine-level quality control. No recent momentum trend data is available for this applicant beyond their established position.

patent records: 4
Challenger · Lawrence Livermore National Security LLC

Lawrence Livermore National Security LLC

Also holding 4 patent records, Lawrence Livermore National Security LLC concentrates exclusively across multiple B33Y additive-manufacturing subclasses — covering process method, apparatus, and data/control dimensions — reflecting a government-lab approach that spans the full system stack rather than focusing on a single layer. No recent momentum trend is listed for this applicant, consistent with their established rather than newly entering status.

patent records: 4
🔍
More assignee evidence is available in Eureka
Use Eureka to validate whether these visible assignees remain central after refining the query scope and adding related patent classes.
Siemens AGDMG Mori Additive GmbH+ more
Unlock full assignee analysis →
Source: Patsnap Eureka. Assignee evidence is drawn from the current PatSnap Eureka query. In small evidence sets, applicant counts should be treated as directional signals, not a complete competitive ranking.Explore players →
Frequently asked questions

Frequently asked questions

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Built on Patsnap Open Platform

This report’s underlying patent dataset — filings, assignees, technology clusters — is open for developers via MCP and REST API. Free to start, 10,000 credits, no credit card required.

Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

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