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LPBF In-situ Process Monitoring Patent Landscape 2026

LPBF In-situ Process Monitoring Patent Landscape 2026
Competitive Landscape
LPBF In-situ Process Monitoring Patent Landscape in 2026

The LPBF in-situ process monitoring patent field is in a Growth stage, with 57 patent families in scope and a 38% increase in the most recent filing window; activity is spread across national labs, machine OEMs, aerospace primes, and universities. Lawrence Livermore National Security LLC holds the largest single portfolio, though the field remains fragmented enough that no single applicant commands a dominant share.

57
Patent families in scope
24%
Top-5 share of top-100 filers
+38%
3-yr filing growth (lag-adj.)
China
Leading jurisdiction
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Published byPatSnap Insights Team··6 min readVerified by PatSnap Eureka data
Overview

Lawrence Livermore leads a fragmented, fast-growing field

Lawrence Livermore National Security LLC ranks first with 9 patent records, followed by Nikon SLM Solutions AG with 4 and three applicants — AECC Commercial Aircraft Engine Co. Ltd., AECC Shanghai Commercial Aircraft Engine Manufacturing Co. Ltd., and Siemens AG — each holding 3 patent records.

The top five filers account for 24% of the hundred largest filers’ combined total, a relatively low concentration ratio that signals a genuinely fragmented competitive field with no entrenched dominant block.

Leading applicants
#ApplicantPatent recordsShare
1Lawrence Livermore National Security LLC9
2Nikon SLM Solutions AG4
3AECC Commercial Aircraft Engine Co. Ltd.3
4AECC Shanghai Commercial Aircraft Engine Manufacturing Co. Ltd.3
5Siemens AG3
6South China University of Technology2
7Peridot Print LLC2
8Virginia Tech Intellectual Properties Inc.2
9Beihang University2
10Hunan Luojia Intelligent Technology Co. Ltd.2
#ApplicantPatent recordsShare
11Alfonso Ruiz Rodríguez1
12Jentek Sensors Inc.1
13Graphic Era Deemed to be University1
14Dr. Hari Kumar Singh1
15Wuhan University1
16Inner Mongolia Power Machinery Research Institute1
17Dr. Bijaya Bijeta Nayak1
18Queen’s University1
19Jihua Laboratory1
20Guangzhou Ante Laser Technology Co. Ltd.1
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The presence of a US national laboratory at the top, flanked by a European machine OEM and Chinese aerospace state-owned enterprises, suggests that LPBF in-situ monitoring is simultaneously a government-funded research priority and an industrially strategic capability — conditions that typically produce rapid diversification of approaches.

Filing counts for 2024 onward are understated due to the typical 18–24 month patent publication lag and should not be treated as a ceiling on recent activity. Longer-window growth, applicant concentration, and technology-route coverage are therefore more reliable signals than the latest-year bar alone.

Source: PatSnap Eureka. Chart shows the top applicants ranked by patent records; the corpus total is measured in patent families. These figures use different units and should not be compared directly.Explore deeper in Eureka →
Trends & Structure

Filings accelerating; core IPC classes dominate but AI and imaging branches are emerging

The annual trend chart and the IPC composition chart together show a field that is growing in volume while beginning to diversify its technical approach beyond traditional additive-manufacturing and powder-metallurgy classes.

Annual filing trend

Annual filings were modest from 2017 through 2023, then jumped sharply — 2024 recorded 13 filings and 2025 shows 10, though both years are subject to publication lag and likely understate true activity. The 38% recent-window growth rate confirms the field is in an active expansion phase.

Annual filing trendAnnual values from 2017 to 2026, peaking at 13 in 2024.1201772018220197202072021520224202313202410202512026↗ Hover for values · click a bar to ask Eureka

Technology composition

B33Y (additive manufacturing) and B22F (powder metallurgy) dominate with 55 and 53 patent records respectively, reflecting the core process focus. Emerging adjacent branches — G06N (AI/ML models), G06T (image data processing), G01N (material analysis), and B23K (laser/welding process control) — each hold single-digit counts, signalling that sensing, data-analytics, and closed-loop control layers are beginning to attract dedicated filings.

Technology compositionB33Y · Additive manufacturing (3D printing) leads with 55; B22F · Powder metallurgy 53.B33Y · Additive manufact…55B22F · Powder metallurgy53B29C · Shaping of plastics8G06N · Computing based o…7G06T · Image data proces…7B23K · Welding, solderin…6G01N · Material analysis…6G05B · Control & regulat…2↗ Hover for values · click a bar to ask Eureka
Source: PatSnap Eureka. Technology-branch counts are measured in patent records; a single patent family can carry several IPC classes, so class totals can exceed the family total in scope.Explore deeper in Eureka →
Key Patents

Highly cited patent families surfaced by the query

Citation-heavy patent families returned by the query. Use this section as citation context, not as a curated list of the most topic-specific patents.

Featured patent
US12594602B2Published 2026-04-07

Systems and methods for simulating process monitor…

Nikon Slm Solutions AG

We describe a system for simulating process monitoring by a sensor system in an additive layer manufacturing, in particular selective laser melting, process used to solidify material from which a three-dimensional workpiece is to be produced, wherein the system comprises: a data input coupleable to a data output of the sensor system and configured to… (excerpt from the patent abstract)

Systems and methods for simulating process monitor… — patent drawingSystems and methods for simulating process monitor… — patent drawing
Representative drawings from the patent document.
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Highly cited patent families surfaced by this query
#PatentCitations
1一种针对激光选区熔化成形缺陷的在线检测与优化系统50
2Method for automatically preventing defects potent…25
3Method for automatic identification of material de…15
4Deep-learning-based SLM online quality monitoring …14
5Laser powder bed fusion additive manufacturing in-…13
6Two-color high speed thermal imaging system for la…13
7一种钛合金横孔的激光选区熔化无支撑成形方法12
83d-printing method and manufacturing device12

Ranked by total forward citations. Citation counts favour older and broadly cited patent families, and broad or adjacent patents may appear when they match the search scope. Treat this section as citation context, not as a curated list of the most topic-specific patents. Some patent titles may be shown in their original, non-English language where an accurate translation could not be guaranteed.

Source: PatSnap Eureka. Citation-ranked patent families surfaced by this query.Open in Eureka →
Insights

What the portfolio structure means for R&D investment decisions

Four structural signals stand out from the evidence: the life-cycle stage, concentration dynamics, collaboration patterns, and geographic filing distribution.

Growth

Growth stage — annual filings still rising

The field is classified in the Growth stage, with annual filings still rising and a 38% uplift in the recent window. Entry barriers from existing portfolios are still moderate, but the pace of new filings means the window for establishing foundational positions is narrowing. Teams that delay R&D investment risk finding key monitoring modalities already covered.

Growth
Concentration

Low concentration — fragmented across institution types

With the top five filers holding just 24% of the hundred largest filers’ combined total, no applicant has locked up the space. The field is split across a national lab (Lawrence Livermore), a machine OEM (Nikon SLM Solutions AG), aerospace state-owned enterprises (AECC entities), a European industrial conglomerate (Siemens AG), and multiple universities. This fragmentation leaves room for focused entrants with differentiated sensor or algorithm approaches.

Fragmented
Collaboration

One confirmed co-filing pair within the aerospace sector

The only co-applicant relationship in evidence is between AECC Commercial Aircraft Engine Co. Ltd. and AECC Shanghai Commercial Aircraft Engine Manufacturing Co. Ltd., which share 3 jointly filed patent records. This pairing reflects a parent-subsidiary coordination model within China’s aero-engine industry. No cross-sector or international co-filing partnerships are visible in the current evidence.

Intra-sector
Geography

China leads filings; US and PCT routes provide international reach

China accounts for 22 patent records — the largest single jurisdiction — followed by the United States with 16. WIPO PCT filings total 7, Europe (EPO) 6, and India 6. The India count is notable relative to the overall corpus size and likely reflects university and individual inventor activity. Organizations seeking global freedom-to-operate should monitor PCT and EPO prosecution closely given the international spread of key assignees.

China-led
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Top collaboration links
ApplicantCollaboratorCo-filings
AECC Commercial Aircraft Engine Co. Ltd.AECC Shanghai Commercial Aircraft Engine Manufacturing Co. Ltd.3

Co-filing pairs, ranked by the number of jointly-filed patent families.

Source: PatSnap Eureka. Jurisdiction counts are at the patent-record level across the corpus.Explore insights →
Leaders

Lawrence Livermore anchors R&D; Nikon SLM Solutions leads among OEMs

The top two filers represent distinct strategic archetypes — a government-funded research institution focused on additive-manufacturing process science, and a commercial machine builder integrating monitoring into hardware.

Leader · Lawrence Livermore National Security LLC

Lawrence Livermore National Security LLC

Lawrence Livermore National Security LLC leads with 9 patent records, concentrated heavily in B33Y additive-manufacturing subclasses (B33Y10, B33Y50, B33Y30 each with 7–8 records), indicating broad coverage of process design, monitoring data, and equipment configurations. Momentum is flagged as a new entrant in the recent filing window with 2 recent records, suggesting the portfolio is actively expanding rather than legacy-only.

9 patent records
Challenger · Nikon SLM Solutions AG

Nikon SLM Solutions AG

Nikon SLM Solutions AG holds 4 patent records, split between B22F powder-metallurgy process steps and B33Y50 monitoring/data subclasses, reflecting an OEM strategy of embedding in-situ monitoring directly into machine architecture. Momentum data for this applicant is not present in the recent-window evidence, so trajectory is pending further data.

4 patent records
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Siemens AGVirginia Tech Intellectual Properties Inc.+ more
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Leading-applicant momentum (recent 3 yrs, lag-adjusted)
ApplicantRecent (3 yrs)Trend
Lawrence Livermore National Security LLC2▲ new entrant
Hunan Luojia Intelligent Technology Co. Ltd.3▲ new entrant
Virginia Tech Intellectual Properties Inc.1▲ new entrant
Source: PatSnap Eureka. Player counts reflect patent records in the ranked applicant list.Explore players →
Adjacent Branches

AI/ML, image processing, and materials analysis are under-served relative to core classes

Five IPC branches show low absolute counts and share relative to the dominant B33Y and B22F classes; two carry the clearest combination of technical relevance and plausible entry path for focused R&D.

G06N · AI and machine-learning models

G06N holds only 7 patent records and a 5% share among the top branches — sparse for a field where melt-pool anomaly detection and defect classification are active research problems. The most-cited patent in the corpus already references deep-learning-based SLM quality monitoring, confirming technical value. Entry paths include transformer-based or physics-informed neural network architectures applied to thermal or acoustic sensor streams, areas where the current filing density leaves room for foundational claims.

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G01N · Material analysis and testing

G01N accumulates only 6 patent records at a 4% share, despite in-situ material characterization — porosity detection, microstructure inference from pyrometer or camera data — being a core value proposition of real-time monitoring. The sparsity may reflect that most current work embeds sensing in machine or process claims rather than dedicating claims to the characterization method itself. Applicants with novel non-destructive evaluation or spectroscopic sensing modalities could find the G01N branch relatively open.

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G06T · Image data processing for melt-pool imagingB23K · Laser process control and closed-loop feedback+ more
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Source: PatSnap Eureka. Branch counts and shares are derived from the IPC composition of the patent-record corpus.Explore emerging →
Route Matrix

How leading filers differ across technology routes

Route coverage across the main technology branches in the current evidence set.

PlayerB33Y 50 · Additive manufacturing (3D printing)B22F 10 · Powder metallurgyB33Y 10 · Additive manufacturing (3D printing)B22F 12 · Powder metallurgyB33Y 30 · Additive manufacturing (3D printing)
Lawrence Livermore National Security LLCStrong · 8Strong · 5Strong · 8Strong · 5Strong · 7
Nikon SLM Solutions AGStrong · 4Strong · 4AbsentAbsentModerate · 1
Siemens AGStrong · 3AbsentStrong · 2AbsentStrong · 2
AECC Shanghai Commercial Aircraft Engine Manufacturing Co. Ltd.Strong · 3AbsentStrong · 3AbsentAbsent
AECC Commercial Aircraft Engine Co. Ltd.Strong · 3AbsentStrong · 3AbsentAbsent
Hunan Luojia Intelligent Technology Co. Ltd.Strong · 3Strong · 3AbsentAbsentAbsent
Virginia Tech Intellectual Properties Inc.Strong · 2Strong · 2AbsentStrong · 2Absent
Source: PatSnap Eureka. Matrix values are measured in patent records and should not be compared directly with family-level applicant totals.Compare in Eureka →
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Disclaimer. This page is generated from PatSnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. PatSnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

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