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LPBF In-Situ Sensor Integration Patent Snapshot

LPBF In-Situ Sensor Integration Patent Snapshot
Evidence Snapshot
LPBF In-Situ Sensor Integration Patent Snapshot in 2026

The LPBF in-situ sensor integration space is a nascent, highly concentrated field with 7 patent families in scope, led by Lawrence Livermore National Security LLC. Filing activity has plateaued near its 2019 peak, signaling a field at an early maturity stage with substantial open territory in sensing and image-processing branches.

7
Patent families in scope
N/A
Concentration not assessed
N/A
Growth trend not assessed
United States
Leading jurisdiction
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Published byPatsnap Insights Team··6 min readVerified by Patsnap Eureka data
Overview

Lawrence Livermore dominates a thin but concentrated field

Lawrence Livermore National Security LLC holds the leading position among all ranked filers, accounting for 3 patent records — the single largest block in a field where the top five filers together represent 40% of the ranked applicants visible in this query’ combined total.

The competitive tier is extremely compressed: the leader’s count is already at the upper boundary of what a field of this size can support, and the distance between the first-ranked applicant and the remaining filers is immediate — most hold only 1 patent record each. Nutech Ventures Ltd, with 2 patent records, is the only other entity with more than a single filing.

Leading applicants
#ApplicantPatent recordsShare
1Lawrence Livermore National Security LLC3
2Nutech Ventures Ltd2
3K Tamilselvan1
4K Sivaramakrishnan1
5U Sujan1
6V Skandhakumar1
7S Senthil Kumar1
8K Rajasuresh1
9R Elakkiyadasan1
#ApplicantPatent recordsShare
10A Sam Immanuel1
11M Shek Mubarak1
12K Venkatesan1
13Kevin D Cole1
14R Saron1
15P Vijaykannan1
16N Sathishkumar1
17Northwestern University1
↗ Hover a row · click a company to ask Eureka

Lawrence Livermore’s position, anchored in additive manufacturing process monitoring and laser-based welding and brazing subclasses, reflects its heritage in high-value defense and energy manufacturing. The breadth of individual inventors in the ranking suggests the field is still attracting exploratory filings from academic and startup ecosystems rather than systematic corporate portfolio-building.

Patent records filed within the most recent 18–24 months are subject to publication lag and are likely under-counted; the current figures should be treated as a floor rather than a ceiling for recent activity. Longer-window growth, applicant concentration, and technology-route coverage are therefore more reliable signals than the latest-year bar alone.

Source: Patsnap Eureka. Chart shows the top applicants ranked by patent records; the corpus total is measured in patent families. These figures use different units and should not be compared directly. This same dataset is now available on Patsnap Open Platform via MCP.Connect via MCP →
Trends & Structure

Filing activity has plateaued; additive manufacturing subclasses dominate the technology mix

The annual filing trend and IPC technology composition together reveal a field that peaked early and has not yet broadened its technical footprint beyond its core additive manufacturing and powder metallurgy classes.

Annual filing trend

Filings first appeared in 2019 with 2 patent records, dipped to 1 in 2020, then went quiet before returning to 2 in 2023 and 1 in 2024. The most recent data points (2024–2025) are subject to publication lag and should be read as provisional minimums. The overall pattern is consistent with a field at early maturity — annual volume has eased from its 2019 peak and recent-window growth is flat.

Annual filing trendAnnual values from 2017 to 2026, peaking at 2 in 2019.02017020182201912020020210202222023120241202502026↗ Hover for values · click a bar to ask Eureka

Technology composition

B33Y (additive manufacturing / 3D printing) accounts for the largest share of IPC coverage, followed closely by B22F (powder metallurgy), reflecting the core process focus. B23K (welding, soldering and brazing) contributes a smaller secondary cluster. G01J (radiation and light measurement) and G06T (image data processing and generation) each appear only once, marking them as structurally thin branches within this corpus.

Technology compositionB33Y · Additive manufacturing (3D printing) leads with 6; B22F · Powder metallurgy 5.B33Y · Additive manufact…6B22F · Powder metallurgy5B23K · Welding, solderin…2G01J · Radiation & light…1G06T · Image data proces…1↗ Hover for values · click a bar to ask Eureka
Source: Patsnap Eureka. Technology-branch counts are measured in patent records; a single patent family can carry several IPC classes, so class totals can exceed the family total in scope.Explore deeper in Eureka →
Key Patents

Highly cited patent families surfaced by the query

Citation-heavy patent families returned by the query. Use this section as citation context, not as a curated list of the most topic-specific patents.

Featured patent
US20260097434A1Published 2026-04-09

Feedforward control of laser powder bed fusion

Nutech Ventures

Methods, systems, and apparatus, including computer programs encoded on computer storage media, for controlled laser powder bed fusion (LPBF) metal additive manufacturing. One of the methods includes predicting thermal information of a part to be printed; analyzing the thermal information to identify one or more areas of potential heat buildup; and… (excerpt from the patent abstract)

Feedforward control of laser powder bed fusion — patent drawingFeedforward control of laser powder bed fusion — patent drawing
Representative drawings from the patent document.
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Highly cited patent families surfaced by this query
#PatentCitations
1Two-color high speed thermal imaging system for la…13
2Apparatus and system for monitoring laser power be…1

Ranked by total forward citations. Citation counts favour older and broadly cited patent families, and broad or adjacent patents may appear when they match the search scope. Treat this section as citation context, not as a curated list of the most topic-specific patents. Some patent titles may be shown in their original, non-English language where an accurate translation could not be guaranteed.

Source: Patsnap Eureka. Citation-ranked patent families surfaced by this query.Open in Eureka →
Visible assignees

Assignee snapshot from the current evidence set

The applicants below are visible in this query result. Because the evidence set is relatively small, read this section as a directional snapshot rather than a full competitive ranking.

Leader · Lawrence Livermore National Security LLC

Lawrence Livermore National Security LLC

Lawrence Livermore National Security LLC leads with 3 patent records, concentrated in B33Y 50 (additive manufacturing data and controls), B23K 26 (laser-based welding and brazing), and B33Y 10 (additive manufacturing processes). This cross-class footprint reflects a system-level approach to in-situ monitoring — covering both the sensing modality (laser interaction) and the data/control layer. No momentum trend is listed in the recent-entrant data, indicating its position predates the most recent filing window.

patent records: 3
Challenger · Nutech Ventures Ltd

Nutech Ventures Ltd

Nutech Ventures Ltd holds 2 patent records and is flagged as a new entrant in the recent filing window, with its filings focused on B22F 10 and B22F 12 (powder metallurgy process and equipment subclasses) alongside B33Y 50. Its co-filing with named inventors Yavari Reza and Riensche Alex suggests a small, specialized team. The powder-metallurgy emphasis is technically complementary to, rather than directly overlapping with, Lawrence Livermore’s laser-process focus.

patent records: 2
🔍
More assignee evidence is available in Eureka
Use Eureka to validate whether these visible assignees remain central after refining the query scope and adding related patent classes.
Northwestern UniversityCole Kevin D+ more
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Source: Patsnap Eureka. Assignee evidence is drawn from the current PatSnap Eureka query. In small evidence sets, applicant counts should be treated as directional signals, not a complete competitive ranking.Explore players →
Frequently asked questions

Frequently asked questions

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Built on Patsnap Open Platform

This report’s underlying patent dataset — filings, assignees, technology clusters — is open for developers via MCP and REST API. Free to start, 10,000 credits, no credit card required.

Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

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