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LPBF Powder Handling Safety Patent Snapshot 2026

LPBF Powder Handling Safety Patent Snapshot 2026
Evidence Snapshot
LPBF Powder Handling Safety Patent Snapshot in 2026

The LPBF powder handling safety patent space is small but accelerating, with 26 patent families on record and a recent-window growth rate of 100%. Activity is fragmented across many single-family filers, with no applicant holding more than two patent families, pointing to an early-stage field without an entrenched leader.

26
Patent families in scope
33%
Top visible applicants share
+100%
3-yr filing growth (lag-adj.)
China
Leading jurisdiction
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Published byPatsnap Insights Team··6 min readVerified by Patsnap Eureka data
Overview

A nascent, fragmented field with no dominant assignee

AMPRO INNOVATIONS PTY LTD, Materion Corporation, City University of Hong Kong, and Xian Space Engine Co., Ltd. each hold two patent families, placing them jointly at the top of the ranking — an unusually flat leaderboard that signals no single organization has staked out commanding coverage.

The top five filers together account for 33% of the combined output of the ranked applicants visible in this query, a low concentration figure consistent with an emerging discipline where entry barriers remain low and many actors are exploring independently.

Leading applicants
#ApplicantPatent familiesShare
1AMPRO INNOVATIONS PTY LTD2
2Materion Corporation2
3City University of Hong Kong2
4Xian Space Engine Co., Ltd.2
5Saveer MatrixNano Pte Ltd1
6NASA (U.S. National Aeronautics and Space Administration)1
7AECC Hunan Aviation Powerplant Research Institute1
8Lanzhou University of Technology1
9Rosatom State Atomic Energy Corporation1
10RFNC-VNIIEF (All-Russian Research Institute of Experimental Physics)1
#ApplicantPatent familiesShare
11China Academy of Machinery Science and Technology Wuhan Research Institute of Materials Protection1
12Kumaraguru College of Technology1
13MICHELIN & CO (CIE GEN DES ESTAB MICHELIN)1
14Yanshan University1
15Andhra University1
16Air Force Engineering University, PLA1
17Shaanxi Sirui Copper Alloy Innovation Center Co., Ltd.1
18Wuhan Research Institute of Materials Protection1
19Nanchang Hangkong University1
20China United Gas Turbine Technology Co., Ltd.1
↗ Hover a row · click a company to ask Eureka

The shared leadership among an Australian start-up, a U. S. advanced materials company, a Hong Kong university, and a Chinese aerospace engine maker illustrates the cross-sectoral nature of the safety challenge: process equipment designers, material suppliers, academic institutions, and aerospace OEMs are all filing, with no single route showing visible activity in.

Filing activity in the most recent 18–24 months is likely under-counted due to standard patent publication lag; the evidence snapshot should be re-evaluated as those records become public. Longer-window growth, applicant concentration, and technology-route coverage are therefore more reliable signals than the latest-year bar alone.

Source: Patsnap Eureka. Chart shows the top applicants ranked by patent families. Applicant counts can overlap where a patent family lists several applicants, so they need not sum to the total in scope. This same dataset is now available on Patsnap Open Platform via MCP.Connect via MCP →
Trends & Structure

Filing activity accelerated sharply from 2021 onward, anchored in powder metallurgy and additive manufacturing classes

The annual trend and IPC composition together reveal a field that transitioned from sporadic single-filings (2017–2022) to a sustained burst of activity peaking visibly in 2024, while the technology mix confirms that core powder-bed fusion process classes are visible in and several adjacent branches remain lightly covered.

Annual filing trend

Filings were sparse and irregular from 2017 through 2022, with a notable acceleration beginning in 2021 and a visible peak in 2024 at nine families. The 2025 and 2026 tallies are understated by publication lag and should not be read as a slowdown.

Annual filing trendAnnual values from 2017 to 2026, peaking at 9 in 2024.12017120180201912020420211202202023920248202512026↗ Hover for values · click a bar to ask Eureka

Technology composition

B22F (powder metallurgy) and B33Y (additive manufacturing) are visible in the IPC mix, reflecting core LPBF process coverage. C22C (alloys) is a secondary cluster tied to feedstock development. Branches such as A61L (sterilising and disinfecting), B25J (manipulators and robots), and B29C (shaping of plastics) each hold only two records, indicating adjacent safety-relevant applications that remain sparsely covered.

Technology compositionB22F · Powder metallurgy leads with 26; B33Y · Additive manufacturing (3D printing) 22.B22F · Powder metallurgy26B33Y · Additive manufact…22C22C · Alloys14A61L · Sterilising & dis…2B25J · Manipulators & ro…2B29C · Shaping of plastics2C22F · Non-ferrous metal…2B22D · Metal casting1↗ Hover for values · click a bar to ask Eureka
Source: Patsnap Eureka. Technology-branch counts are measured in patent records; a single patent family can carry several IPC classes, so class totals can exceed the family total in scope.Explore deeper in Eureka →
Key Patents

Highly cited patent families surfaced by the query

Citation-heavy patent families returned by the query. Use this section as citation context, not as a curated list of the most topic-specific patents.

Featured patent
US20250332639A1Published 2025-10-30

Ultrafast laser shock forging assisted laser powde…

Air Force Engineering University

Provided is an ultrafast laser shock forging assisted laser powder bed fusion (LPBF) method capable of inhibiting formation of thermal cracks in a high-strength aluminum alloy. Technical points of the present disclosure: During a LPBF process of an aluminum alloy, a molten layer is subjected to shock forging with a mechanical effect of ultra-high-pressure… (excerpt from the patent abstract)

Ultrafast laser shock forging assisted laser powde… — patent drawingUltrafast laser shock forging assisted laser powde… — patent drawing
Representative drawings from the patent document.
Open this patent in Eureka →
Highly cited patent families surfaced by this query
#PatentCitations
1A processing machine for an additive manufacturing…9
2Large-Scale Efficient Selective Laser Melting Form…9
3一种薄壁悬臂骨架类结构及激光选区熔化成形方法7
4一种冷却身部的高精度激光选区熔化成形方法6
5In situ alloying of Cu—Cr—Nb alloys using selectiv…5
6一种粉状钛基钎料及其制备方法3
7METHOD FOR MANUFACTURING Bimetallic material using…2
8Ultrafast laser shock forging assisted laser powde…1

Ranked by total forward citations. Citation counts favour older and broadly cited patent families, and broad or adjacent patents may appear when they match the search scope. Treat this section as citation context, not as a curated list of the most topic-specific patents. Some patent titles may be shown in their original, non-English language where an accurate translation could not be guaranteed.

Source: Patsnap Eureka. Citation-ranked patent families surfaced by this query.Open in Eureka →
Visible assignees

Assignee snapshot from the current evidence set

The applicants below are visible in this query result. Because the evidence set is relatively small, read this section as a directional snapshot rather than a full competitive ranking.

Leader · AMPRO INNOVATIONS PTY LTD

AMPRO INNOVATIONS PTY LTD

Holds two patent families with a distinct focus on powder metallurgy process steps (B22F 10, B22F 12) combined with manipulators and robots (B25J 21) — the only applicant in the corpus explicitly addressing automated robotic handling as a safety control measure. Momentum data does not flag AMPRO as a new entrant, suggesting an established presence relative to the other co-leaders.

families: 2
Challenger · Materion Corporation

Materion Corporation

Holds two patent families with concentration across powder metallurgy subcategories B22F 1, B22F 3, and B22F 10, reflecting a material-science-led approach to powder safety centered on feedstock characterization and handling properties. Materion is flagged as a new entrant in recent momentum data, indicating its LPBF safety IP activity is a fresh strategic move from an established advanced materials supplier.

families: 2
🔍
More assignee evidence is available in Eureka
Use Eureka to validate whether these visible assignees remain central after refining the query scope and adding related patent classes.
City University of Hong KongXian Space Engine Co., Ltd.+ more
Unlock full assignee analysis →
Source: Patsnap Eureka. Assignee evidence is drawn from the current PatSnap Eureka query. In small evidence sets, applicant counts should be treated as directional signals, not a complete competitive ranking.Explore players →
Frequently asked questions

Frequently asked questions

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This report’s underlying patent dataset — filings, assignees, technology clusters — is open for developers via MCP and REST API. Free to start, 10,000 credits, no credit card required.

Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

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