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LPBF Powder Supply & Recycled Powder Patent Landscape

LPBF Powder Supply & Recycled Powder Patent Landscape
Competitive Landscape
LPBF Powder Supply & Recycled Powder Patent Landscape in 2026

The LPBF powder supply and recycled powder space comprises 105 patent families, with China accounting for the dominant share of filings and no single applicant holding more than 5 patent families. Annual volume plateaued near its 2020 peak, indicating a maturing but still active field where incremental positioning remains feasible.

105
Patent families in scope
18%
Top-5 share of top-100 filers
+15%
3-yr filing growth (lag-adj.)
China
Leading jurisdiction
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Published byPatsnap Insights Team··6 min readVerified by Patsnap Eureka data
Overview

A fragmented field with Chinese institutions and global challengers sharing the lead

The competitive structure is highly fragmented: the top-ranked applicant, Suzhou Zhongke Innovation Institute of Laser Intelligent Technology, holds only 5 patent families, tied with Russia’s Moscow State Technological University STANKIN. No organization has established a dominant blocking position.

The top five filers account for 18% of the combined total of the hundred largest filers, confirming a flat competitive hierarchy with no decisive tier gap between leader and challenger positions. Chinese universities, state-backed research institutes, and specialist equipment companies occupy most of the top-20 slots.

Leading applicants
#ApplicantPatent familiesShare
1Suzhou Zhongke Innovation Institute of Laser Intelligent Technology Co., Ltd.5
2Moscow State Technological University STANKIN (MGTU Stankin)5
3Nanjing Zhongke Raycham Laser Technology Co., Ltd.4
4Realizer GmbH4
5The Government of the United States of America (U.S. Naval Research Laboratory)3
6Federal State Autonomous Educational Institution of Higher Education (Russian Federation)3
7NANJING UNIV OF AERONAUTICS & ASTRONAUTICS3
8Beijing Longyuan Automated Fabrication System Co., Ltd.3
9Guangzhou Leijia Technology Co., Ltd.2
10Shanghai Hanbang United 3D Technology Co., Ltd.2
#ApplicantPatent familiesShare
11Xi’an Jiaotong University2
12Centre National d’Études Spatiales (CNES)2
13Centre National de la Recherche Scientifique (CNRS)2
14Thales SA2
15Jianghan University2
16Shanghai University of Engineering Science2
17Zhejiang Yidong Technology Co., Ltd.2
18Xi’an University of Technology2
19KUNMING UNIV OF SCI & TECH2
20North University of China (Zhongbei University)2
↗ Hover a row · click a company to ask Eureka

The distributed ownership means that freedom-to-operate risks are spread across many small portfolios rather than concentrated in one or two large holders — an unusually open environment for a manufacturing-process technology at this stage of development.

Filing counts for 2025 and 2026 are under-counted due to the standard 18–24 month patent publication lag and should not be read as a slowdown. Longer-window growth, applicant concentration, and technology-route coverage are therefore more reliable signals than the latest-year bar alone.

Source: Patsnap Eureka. Chart shows the top applicants ranked by patent families. Applicant counts can overlap where a patent family lists several applicants, so they need not sum to the total in scope. This same dataset is now available on Patsnap Open Platform via MCP.Connect via MCP →
Trends & Structure

Annual volume plateaued after 2020; core IPC classes dominate with sparse adjacent branches

Two views — the annual filing trend and the IPC technology composition — together show a field that surged in 2020 and has since stabilised, with patent activity tightly clustered in powder metallurgy and additive manufacturing process classes.

Annual filing trend

Filings jumped sharply in 2020 and have since oscillated in a narrower band through 2024, consistent with a maturing field. The 2025 and 2026 bars are incomplete due to publication lag and understate true activity.

Annual filing trendAnnual values from 2017 to 2026, peaking at 23 in 2020.12017320181201923202015202119202213202313202414202532026↗ Hover for values · click a bar to ask Eureka

Technology composition

B22F (powder metallurgy) and B33Y (additive manufacturing) together account for the vast majority of IPC classifications, confirming that work is concentrated on process and machine design. Alloy composition (C22C), sieving and sorting (B07B), and material analysis (G01N) appear as thin adjacent branches, signalling limited formal patent activity in powder qualification and characterisation workflows.

Technology compositionB22F · Powder metallurgy leads with 106; B33Y · Additive manufacturing (3D printing) 100.B22F · Powder metallurgy106B33Y · Additive manufact…100C22C · Alloys17B29C · Shaping of plastics9B07B · Sieving & sorting5B23K · Welding, solderin…3G01N · Material analysis…2B23P · Metal working (ge…1↗ Hover for values · click a bar to ask Eureka
Source: Patsnap Eureka. Technology-branch counts are measured in patent records; a single patent family can carry several IPC classes, so class totals can exceed the family total in scope.Explore deeper in Eureka →
Key Patents

Highly cited patent families surfaced by the query

Citation-heavy patent families returned by the query. Use this section as citation context, not as a curated list of the most topic-specific patents.

Featured patent
US11667075B2Published 2023-06-06

Apparatus and method for selective laser melting a…

LAMPALZER, Ralf

In an apparatus for selective laser melting and/or laser sintering with a mounting base, that has at least one chamber, wherein the at least one chamber is a building chamber and/or a powder reservoir chamber for a powder, the saving of powder results in an increase in the possible uses of the apparatus, in that the apparatus further comprises at least one… (excerpt from the patent abstract)

Apparatus and method for selective laser melting a… — patent drawingApparatus and method for selective laser melting a… — patent drawing
Representative drawings from the patent document.
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Highly cited patent families surfaced by this query
#PatentCitations
1一种粉末床五轴增减材复合制造装备19
2复合结构金属构件选区激光熔化增材制造装置及工作方法16
3Method for forming a multi-material part by select…15
4一种基于SLM设备实现多材料增材制造成型的装置及方法14
5一种304/304L不锈钢的选区激光熔化成型方法12
6Aluminum alloy workpiece and preparation method th…9
7Device for producing products by selective laser m…9
8Controlling AM spatter and conduction9

Ranked by total forward citations. Citation counts favour older and broadly cited patent families, and broad or adjacent patents may appear when they match the search scope. Treat this section as citation context, not as a curated list of the most topic-specific patents. Some patent titles may be shown in their original, non-English language where an accurate translation could not be guaranteed.

Source: Patsnap Eureka. Citation-ranked patent families surfaced by this query.Open in Eureka →
Insights

What the competitive structure means for R&D investment decisions

The combination of a maturing filing pace, fragmented ownership, limited cross-border filings, and sparse powder-qualification coverage points to specific areas where positioning is still achievable.

Maturity

Field is maturing: annual volume has plateaued near the 2020 peak

The lifecycle evidence classifies this field as Maturity, with annual filings having plateaued near the 2020 peak of 23 families per year. The multi-year window still shows positive growth of 15%, meaning the field is not in decline, but the era of rapid expansion has passed. New entrants should target differentiated sub-problems rather than replicate existing process-patent approaches.

Lifecycle: Maturity
Concentration

Flat hierarchy: no applicant holds more than 5 patent families

With the top five filers accounting for 18% of the hundred largest filers’ combined total, and the absolute leader holding only 5 patent families, there is no portfolio cliff to navigate. This low concentration level means that a focused filing programme of even modest scale could place a new entrant within the visible top tier.

Low concentration
Collaboration

Two documented co-filing pairs; ecosystem is largely siloed

Evidence shows two active co-applicant relationships: Suzhou Zhongke Innovation Institute of Laser Intelligent Technology filing jointly with Nanjing Chenguang Group, and Nanjing University of Aeronautics and Astronautics filing with Hunan Hangtian Chengyuan Precision Machinery. Both pairings combine research institutes with industrial partners, suggesting the dominant collaboration model is academy–industry rather than cross-company. The broader applicant list shows limited evidence of consortium-scale cooperation.

Limited co-filing
Geography

China-centric filing; United States and Russia are secondary markets

China is the lead jurisdiction by a substantial margin, followed by the United States and Russia as secondary markets. PCT and EPO filings are minimal, indicating that most applicants have not pursued broad international protection. This geographic skew creates an asymmetry: non-Chinese organisations face less prior-art competition in their home jurisdictions, and global filing of well-scoped claims in the adjacent powder-qualification and sorting branches would face sparse opposition.

China-dominant
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Top collaboration links
ApplicantCollaboratorCo-filings
Suzhou Zhongke Innovation Institute of Laser Intelligent Technology Co., Ltd.Nanjing Chenguang Group Co., Ltd.1
Nanjing University of Aeronautics and AstronauticsHunan Hangtian Chengyuan Precision Machinery Co., Ltd.1

Co-filing pairs, ranked by the number of jointly-filed patent families.

Source: Patsnap Eureka. Cards derived from lifecycle, collaboration, jurisdiction, and applicant-ranking evidence.Explore insights →
Leaders

Suzhou Zhongke and MGTU Stankin lead on volume; US Navy enters on powder-process fundamentals

The two co-leaders differ in orientation: the Chinese institute focuses on machine and process integration, while the Russian university emphasises powder metallurgy consolidation. Both are recorded as new entrants in the recent period, reflecting a field where the leaderboard is still forming.

Leader · Suzhou Zhongke Innovation Institute of Laser Intelligent Technology

Suzhou Zhongke Innovation Inst.

Holds 5 patent families, tied for first place, with technology emphasis on B22F 12 (machine design in powder metallurgy), B22F 10 (LPBF process steps), and B33Y 40 (post-processing in additive manufacturing). Momentum is flagged as a new entrant, indicating this position has been built entirely in the recent filing window — a recent and concentrated push rather than a long-standing portfolio.

patent families: 5
Challenger · Moscow State Technological University STANKIN (MGTU STANKIN)

MGTU Stankin

Also holds 5 patent families, with focus split evenly across B22F 12, B22F 3 (powder compaction and sintering), and B33Y 30 (apparatus for additive manufacturing). The co-equal focus on traditional powder metallurgy consolidation (B22F 3) distinguishes this portfolio from the Chinese leaders, which concentrate more narrowly on LPBF-specific process and machine classes. Also flagged as a new entrant in the recent window.

patent families: 5
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Nanjing Zhongke Raycham TechnologyRealizer GmbH+ more
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Leading-applicant momentum (recent 3 yrs, lag-adjusted)
ApplicantRecent (3 yrs)Trend
Suzhou Zhongke Innovation Institute of Laser Intelligent Technology Co., Ltd.5▲ new entrant
Moscow State Technological University STANKIN (MGTU Stankin)4▲ new entrant
U.S. Naval Research Laboratory3▲ new entrant
Beijing Longyuan Automated Fabrication System Co., Ltd.1▲ new entrant
Shaanxi Xinghuaye 3D Technology Co., Ltd.2▲ new entrant
Source: Patsnap Eureka. Player cards based on applicant ranking, technology focus, and momentum data.Explore players →
Adjacent Branches

Powder sorting, qualification testing, and alloy-specific recycling are under-served adjacent branches

The dominant B22F and B33Y classes crowd out several technically adjacent areas where patent density is low relative to their engineering relevance to LPBF powder re-use workflows.

B07B · Sieving & Sorting

With only 5 patent records in this branch, formal IP coverage of powder sieving, screening, and classification — processes central to qualifying and re-certifying recycled LPBF powder — is sparse. Any organisation developing inline or automated sieving hardware or flowability-monitoring systems for recycled powder streams could establish a defensible position with limited prior-art conflict. Entry path is hardware-oriented and integrable with existing LPBF machine architectures.

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G01N · Material Analysis & Testing

Only 2 patent records appear under G01N (material analysis and testing), despite powder characterisation — particle size distribution, morphology, oxygen content, flowability — being a critical quality gate in recycled-powder workflows. This sparsity is notable given the engineering importance of in-process or post-recycle qualification. Organisations developing sensor-based or AI-assisted powder-quality monitoring methods face a largely open landscape in formal IP terms.

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🔒
Unlock the full white-space map
See all adjacent IPC branches with low filing density and their technical overlap with LPBF powder re-use.
B23K · Welding, soldering & brazingC22C · Alloys+ more
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Source: Patsnap Eureka. Adjacent branches identified by low IPC record counts relative to dominant classes in the corpus.Explore emerging →
Route Matrix

How leading applicants differ across powder metallurgy and additive manufacturing sub-classes

Route coverage across the main technology branches in the current evidence set.

PlayerB22F 10 · Powder metallurgyB22F 12 · Powder metallurgyB33Y 30 · Additive manufacturing (3D printing)B33Y 10 · Additive manufacturing (3D printing)B33Y 40 · Additive manufacturing (3D printing)
Zhejiang Yidong Technology Co., Ltd.Strong · 6Strong · 7Strong · 6AbsentStrong · 5
Nanjing Zhongke Raycham Laser Technology Co., Ltd.Strong · 4Strong · 4Strong · 3Moderate · 2Absent
Suzhou Zhongke Innovation Institute of Laser Intelligent Technology Co., Ltd.Strong · 4Strong · 5AbsentAbsentStrong · 3
Realizer GmbHStrong · 4Strong · 3Strong · 3AbsentAbsent
Moscow State Technological University STANKIN (MGTU Stankin)AbsentStrong · 5Strong · 3AbsentModerate · 2
Beijing Longyuan Automated Fabrication System Co., Ltd.Strong · 3Strong · 3Strong · 3AbsentAbsent
Shanghai University of Engineering ScienceStrong · 2Strong · 2Strong · 2AbsentStrong · 2
Source: Patsnap Eureka. Matrix values are measured in patent records and should not be compared directly with family-level applicant totals.Compare in Eureka →
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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

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