LPBF Process Simulation Patent Landscape 2026
The LPBF process simulation patent landscape is in a clear growth phase, with annual filings rising consistently since 2018 and a 153% expansion in the recent window; RTX Corp holds the top position among a moderately fragmented field dominated by aerospace primes and Chinese academic institutions. China accounts for the largest share of filed records, while AI-model and computational-chemistry simulation branches remain sparse relative to the core powder-metallurgy and additive-manufacturing classes.
RTX Corp leads a field where academic institutions fill the top tier
RTX Corp is the single largest filer, ahead of Nanjing University of Aeronautics and Astronautics and Shenyang Research Institute of Foundry, which are tied for second. The top five filers collectively account for 22% of the hundred largest filers’ combined patent records, indicating a moderately concentrated upper tier without overwhelming dominance by any one player.
The tier gap between RTX Corp and the second-ranked institutions is narrow — a single patent record separates first from second — which means the leader’s position is contestable. Below the top five, the field fragments quickly into a long tail of single- and two-record filers, most of them universities and research institutes.
| # | Applicant | Patent records | Share |
|---|---|---|---|
| 1 | RTX Corp | 8 | |
| 2 | NANJING UNIV OF AERONAUTICS & ASTRONAUTICS | 5 | |
| 3 | Shenyang Research Institute of Foundry | 5 | |
| 4 | NANJING UNIV OF AERONAUTICS & ASTRONAUTICS WUXI RE… | 4 | |
| 5 | Northwestern Polytechnical University | 4 | |
| 6 | Dassault Systemes Americas Corp | 4 | |
| 7 | AVIC Research Institute (Yangzhou) Science and Innovation Center | 2 | |
| 8 | Beijing Hangxing Machinery Manufacturing Co Ltd | 2 | |
| 9 | NuTech Ventures Ltd | 2 | |
| 10 | Xi’an Jiaotong University | 2 |
| # | Applicant | Patent records | Share |
|---|---|---|---|
| 11 | Indian Space Research Organisation | 2 | |
| 12 | RES & DEV INST OF Northwestern Polytechnical University … | 2 | |
| 13 | Lawrence Livermore National Security LLC | 2 | |
| 14 | The Research Foundation for the State University of New York | 2 | |
| 15 | Jiangsu XCMG Construction Machinery Research Institute | 2 | |
| 16 | Commercial Aircraft Corporation of China Ltd (COMAC) | 2 | |
| 17 | Nanchang Hangkong University | 2 | |
| 18 | Shenyang University of Technology | 2 | |
| 19 | National Cheng Kung University | 2 | |
| 20 | Saveer Matrixnano Pte Ltd | 1 |
RTX Corp’s lead signals that at least one aerospace prime views simulation-validated LPBF processing as a protectable capability, while the clustering of Chinese aerospace universities and foundry institutes at the top suggests that state-linked R&D programs are the primary growth engine outside the US.
The most recent 18–24 months of filings are under-counted due to patent publication lag; the apparent softening of 2025–2026 data does not reflect actual activity levels. Longer-window growth, applicant concentration, and technology-route coverage are therefore more reliable signals than the latest-year bar alone.
Consistent annual growth and a simulation-heavy technology mix
Annual filings have climbed every year from 2018 through 2024, confirming a growth-stage trajectory. The technology composition reflects the dual nature of the field: physical process (powder metallurgy, additive manufacturing) and digital simulation (digital data processing, AI models).
Annual filing trend
Filings rose from 2 records in 2018 to a visible run-rate of 19–20 records in 2024–2025 before the publication-lag cut-off compresses the 2026 count to 4. The uninterrupted upward trajectory through 2024 is the reliable signal; 2025–2026 data should be treated as provisional.
↗ Hover for values · click a bar to ask EurekaTechnology composition
B22F (powder metallurgy) and B33Y (additive manufacturing) dominate at roughly equal weight, reflecting the physical-process foundation of LPBF. G06F (digital data processing) is nearly as prominent, confirming that computational simulation is a core, not peripheral, focus. G06N (AI models) and G06T (image processing) are present but at roughly one-fifth the volume of the dominant classes, marking them as emerging rather than established routes.
↗ Hover for values · click a bar to ask EurekaHighly cited patent families surfaced by the query
Citation-heavy patent families returned by the query. Use this section as citation context, not as a curated list of the most topic-specific patents.
Feedforward control of laser powder bed fusion
Methods, systems, and apparatus, including computer programs encoded on computer storage media, for controlled laser powder bed fusion (LPBF) metal additive manufacturing. One of the methods includes predicting thermal information of a part to be printed; analyzing the thermal information to identify one or more areas of potential heat buildup; and… (excerpt from the patent abstract)
| # | Patent | Citations |
|---|---|---|
| 1 | Machine learning with fast feature generation for … | 22 |
| 2 | 一种高性能合金钢选区激光熔化热力耦合行为预测方法 | 18 |
| 3 | 一种基于选区激光熔化工艺的航空叶片拓扑优化设计方法 | 17 |
| 4 | 整流罩零件及激光选区熔化成形薄壁整流罩零件的方法 | 16 |
| 5 | 一种SLM原位合金化制备合金块体的方法 | 13 |
| 6 | 选区激光熔化成形结构残余变形的跨尺度控制方法及系统 | 13 |
| 7 | 一种基于残余应力修正的3D打印管道补偿设计方法 | 13 |
| 8 | 增材制造金属材料组织-性能-寿命一体化集成计算方法 | 10 |
Ranked by total forward citations. Citation counts favour older and broadly cited patent families, and broad or adjacent patents may appear when they match the search scope. Treat this section as citation context, not as a curated list of the most topic-specific patents. Some patent titles may be shown in their original, non-English language where an accurate translation could not be guaranteed.
What the patent structure means for R&D investment decisions
Four structural observations — maturity, concentration, collaboration, and geography — shape where defensible positions can still be built in LPBF process simulation.
Growth stage: annual volume still rising
The field is classified at the Growth stage, with annual filing volume rising consistently and the recent window showing 153% growth. This means foundational positions are still being staked; early movers who file now can build blocking portfolios before the field matures. Patent quality and breadth of claim scope still matter more than sheer volume at this stage.
Growth stageModerately concentrated top tier, fragmented tail
The top five filers hold 22% of the hundred largest filers’ combined records — moderate concentration that leaves meaningful room for new entrants. The narrow gap between RTX Corp’s 8 records and the second-tier institutions’ 5 records means no single player has built an insurmountable lead. Focused filing in a specific alloy system or simulation method could quickly move a new entrant into the visible top tier.
Moderate concentrationNanjing Aeronautics–Wuxi Institute pair is the most active co-filer
The most active co-filing relationship is between Nanjing University of Aeronautics and Astronautics and its Wuxi Research Institute, with 4 joint patent records. Shenyang University of Technology and Liaoning Institute of Science and Technology share 1 joint record. Both pairings are intra-Chinese-academia, suggesting that cross-sector or international co-development arrangements — between simulation software vendors, materials suppliers, and OEMs — remain largely unexploited.
Intra-academia collaborationChina dominant; US and Europe active but distant seconds
China accounts for 52 of the patent records in the corpus, the United States for 16, and Europe (EPO) for 9. India, with 8 records — driven in part by Indian Space Research Organisation activity — is a notable third-tier presence. WIPO PCT filings (7 records) suggest some applicants are pursuing international coverage, but the volume is low relative to the Chinese domestic total, pointing to a risk that Chinese-origin IP remains less protected in Western markets.
China-led geographyGo beyond the landscape: Eureka’s TRIZ Solution agent breaks down an R&D problem and returns patented concept solutions, each with a technical approach and cited patent & literature evidence.
| Applicant | Collaborator | Co-filings |
|---|---|---|
| Nanjing University of Aeronautics and Astronautics | Nanjing University of Aeronautics and Astronautics Wuxi Research Institute | 4 |
| Shenyang University of Technology | Liaoning Institute of Science and Technology | 1 |
Co-filing pairs, ranked by the number of jointly-filed patent families.
RTX Corp emphasises process and build parameters; Chinese institutions focus on simulation and digital twins
The two leading applicants occupy distinct technical positions: RTX Corp concentrates on additive manufacturing execution and powder metallurgy process patents, while Nanjing University of Aeronautics and Astronautics centres its portfolio on digital data processing and computational simulation methods.
RTX Corp
RTX Corp holds 8 patent records, the largest count in the corpus, with a technology focus concentrated in B33Y (additive manufacturing data and process) and B22F (powder metallurgy process methods). All recent filings are classified as a new entrant trend, indicating the company entered this specific simulation sub-field recently rather than building on a long prior base. The aerospace-defence context makes process-parameter simulation a natural R&D priority for qualification of flight-critical parts.
8 patent recordsNanjing Univ. of Aeronautics and Astronautics
Nanjing University of Aeronautics and Astronautics holds 5 patent records, tied for second, with its portfolio almost entirely in G06F (electric digital data processing and simulation modelling). Its affiliated Wuxi Research Institute adds a further 4 records in the same G06F cluster, giving the combined institutional group an effective presence of 9 records — rivalling RTX Corp in volume when aggregated. The new-entrant momentum flag signals recent, concentrated filing rather than a long-standing programme.
5 patent records| Applicant | Recent (3 yrs) | Trend |
|---|---|---|
| RTX Corp (Raytheon Technologies) | 8 | ▲ new entrant |
| Nanjing University of Aeronautics and Astronautics | 5 | ▲ new entrant |
| Shenyang Research Institute of Foundry, China Academy of Machinery Science and Technology Group | 5 | ▲ new entrant |
| Northwestern Polytechnical University | 2 | ▲ new entrant |
| Nanjing University of Aeronautics and Astronautics Wuxi Research Institute | 4 | ▲ new entrant |
| Xi’an Jiaotong University | 1 | ▲ new entrant |
| NuTech Ventures Ltd | 2 | ▲ new entrant |
Under-served branches adjacent to the LPBF simulation core
Several IPC classes appear in the corpus at low relative counts, sitting at the periphery of the dominant B22F/B33Y/G06F cluster. These branches are observations of sparsity; where a plausible technical rationale and realistic entry path exist, they are noted.
G06N · AI and machine-learning models for simulation
G06N accounts for only 11 patent records — roughly one-fifth the volume of the dominant B22F and B33Y classes — despite the growing role of machine-learning surrogates for finite-element and melt-pool simulation. The most-cited record in the corpus is an ML-with-fast-feature-generation paper, confirming technical demand. An entrant combining physics-informed neural networks with LPBF thermal modelling could file in this branch with low incumbent density and clear differentiation from the existing G06F-heavy portfolios.
Search this in Eureka →G16C · Computational chemistry for alloy and microstructure prediction
G16C (computational chemistry and materials informatics) appears only 4 times in the corpus, the lowest count among branches with more than 2 records. LPBF alloy development increasingly relies on CALPHAD-type thermodynamic modelling and molecular dynamics to predict solidification microstructure, yet this branch is nearly absent from the patent record. An entry strategy coupling G16C computational methods with the established C22C (alloys) class — which itself has only 7 records — could address the alloy-design-to-process-simulation integration gap with minimal prior-art conflict.
Search this in Eureka →How leading applicants differ across technology routes
Route coverage across the main technology branches in the current evidence set.
| Player | B22F 10 · Powder metallurgy | G06F 30 · Electric digital data processing | B33Y 50 · Additive manufacturing (3D printing) | B33Y 10 · Additive manufacturing (3D printing) | G06F 119 · Electric digital data processing |
|---|---|---|---|---|---|
| RTX Corp (Raytheon Technologies) | Strong · 6 | Absent | Strong · 8 | Moderate · 4 | Absent |
| Shenyang Research Institute of Foundry, China Academy of Machinery Science and Technology Group | Moderate · 2 | Strong · 5 | Moderate · 2 | Strong · 5 | Moderate · 2 |
| Northwestern Polytechnical University | Moderate · 2 | Strong · 4 | Moderate · 2 | Absent | Strong · 4 |
| Nanjing University of Aeronautics and Astronautics | Absent | Strong · 5 | Absent | Absent | Strong · 4 |
| Jiangsu XCMG Construction Machinery Research Institute | Strong · 2 | Strong · 2 | Strong · 2 | Strong · 2 | Absent |
| Nanjing University of Aeronautics and Astronautics Wuxi Research Institute | Absent | Strong · 4 | Absent | Absent | Strong · 3 |
| Indian Space Research Organisation | Strong · 2 | Absent | Absent | Strong · 2 | Absent |
Frequently asked questions
The corpus covers 93 patent families in scope globally. The applicant ranking is drawn from the hundred largest filers and counts patent records, which can produce higher per-applicant numbers than a pure family count because a family may be filed in multiple offices.
RTX Corp leads with 8 patent records, ahead of Nanjing University of Aeronautics and Astronautics and Shenyang Research Institute of Foundry, which each hold 5 patent records.
Annual filings have risen consistently from 2 records in 2018 to approximately 19–20 records in 2024–2025, representing 153% growth in the recent measurement window. The field is in a Growth stage. The 2025–2026 counts are understated due to publication lag and should not be read as a slowdown.
China is the leading jurisdiction with 52 patent records, followed by the United States with 16, Europe (EPO) with 9, India with 8, and WIPO PCT with 7. Russia accounts for 1 record.
B22F (powder metallurgy) and B33Y (additive manufacturing) are the two largest IPC classes at 58 and 57 patent records respectively, closely followed by G06F (electric digital data processing) at 52 records. These three classes form the core of the field; G06N (AI models) and G06T (image processing) are present but at much lower volumes.
G06N (AI and machine-learning models) and G16C (computational chemistry) are the most notable under-served branches relative to their technical relevance, with 11 and 4 patent records respectively. G06T (image data processing) and C22C (alloys) are also sparse at 10 and 7 records, given the role of melt-pool imaging and alloy-design simulation in LPBF workflows.
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Disclaimer. This page is generated from PatSnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
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