LPBF Scan-Strategy & Process Optimization Patent Snapshot
The LPBF scan-strategy and process optimization patent space is nascent and fragmented, with no single applicant holding more than 2 patent families and China-based filers dominating the filing geography. Activity is in a growth phase with a 50% increase in recent filings, and the field is still expanding on a multi-year basis with no concentration around a single dominant route.
Fragmented field with no dominant leader — universities and research institutes set the pace
Five applicants are tied at the top of the ranking, each holding 2 patent families: NuTech Ventures Ltd, Nikon SLM Solutions AG, Central South University, Jiangsu XCMG Construction Machinery Research Institute, and Tianjin University. No single organization has established a commanding position.
The top five filers account for 33% of the combined output of the ranked applicants visible in this query, indicating moderate early-stage concentration rather than entrenched oligopoly. The gap between the top tier and the remainder of the field is narrow — one family separates leaders from all other ranked applicants.
| # | Applicant | Patent families | Share |
|---|---|---|---|
| 1 | NuTech Ventures Ltd | 2 | |
| 2 | Nikon SLM Solutions AG | 2 | |
| 3 | Central South University | 2 | |
| 4 | Jiangsu XCMG Construction Machinery Research Institute Co., Ltd. | 2 | |
| 5 | Tianjin University | 2 | |
| 6 | Xi’an Jiaotong University | 1 | |
| 7 | Vallurupalli Nageswara Rao Vignana Jyothi Institute of Engineering and Technology | 1 | |
| 8 | Cao Sen | 1 | |
| 9 | Shanghai Leimou Technology Co., Ltd. | 1 | |
| 10 | INST OF CORROSION SCI & TECH | 1 |
| # | Applicant | Patent families | Share |
|---|---|---|---|
| 11 | Shenyang Liming Aero-Engine Group Corporation | 1 | |
| 12 | Inner Mongolia University of Technology | 1 | |
| 13 | HARBIN UNIV OF SCI & TECH | 1 | |
| 14 | HUAZHONG UNIV OF SCI & TECH | 1 | |
| 15 | The Research Foundation for the State University of New York | 1 | |
| 16 | Xi’an University of Technology | 1 | |
| 17 | Shanghai Union Technology Corporation | 1 | |
| 18 | NANJING UNIV OF SCI & TECH | 1 | |
| 19 | 10th Research Institute of CETC | 1 | |
| 20 | Materials Institute of China Academy of Engineering Physics | 1 |
The joint leadership of an equipment OEM (Nikon SLM Solutions AG), an IP-licensing entity (NuTech Ventures Ltd), and three Chinese universities signals that fundamental process knowledge is still being staked out rather than consolidated by vertically integrated manufacturers.
Filings from approximately 2024 onward are likely under-counted due to standard patent publication lag; the apparent plateau in those years should not be read as a slowdown. Longer-window growth, applicant concentration, and technology-route coverage are therefore more reliable signals than the latest-year bar alone.
Rising filing volumes driven by powder-metallurgy and AI-assisted process control
Two charts frame the field’s trajectory: annual filing counts from 2017 onward reveal a growth-phase pattern, while the IPC class breakdown shows where technical effort is concentrated and where it remains thin.
Annual filing trend
Filings were negligible before 2019 and began stepping up meaningfully from 2021. The field is in a growth phase with recent-window activity up 50% versus the prior period. Years 2024–2026 appear flat or declining in raw counts but are materially under-counted because of publication lag; do not read those years as a genuine slowdown.
↗ Hover for values · click a bar to ask EurekaTechnology composition
B22F (powder metallurgy) and B33Y (additive manufacturing) are visible in the IPC mix, consistent with core process claims on laser-bed fusion. G06F (digital data processing) is the third-largest branch, reflecting the growing share of simulation and optimization software claims. G06N (AI/ML models) and G16C (computational chemistry) are present but sparse, suggesting they remain adjacent rather than core filing territory.
↗ Hover for values · click a bar to ask EurekaHighly cited patent families surfaced by the query
Citation-heavy patent families returned by the query. Use this section as citation context, not as a curated list of the most topic-specific patents.
Composition design optimization method of aluminum…
A composition design optimization method of aluminum alloy for selective laser melting, including the following steps: S1: making alloy ingots with different composition; S2: pre-treating and processing the alloy ingots to obtain alloy sample blocks with different composition; S3: twice laser surface scanning treatment; S4: treating the alloy sample blocks… (excerpt from the patent abstract)
| # | Patent | Citations |
|---|---|---|
| 1 | Composition design optimization method of aluminum… | 12 |
| 2 | 一种高熵合金激光选区熔化工艺参数优化方法 | 10 |
| 3 | 选区激光熔化铝合金的成分设计优化方法 | 9 |
| 4 | Thermal stress and substrate damage reducing addit… | 8 |
| 5 | Method of designing and manufacturing a hydraulic … | 6 |
| 6 | Systems and Methods | 6 |
| 7 | 基于深度强化学习的激光功率参数优化方法 | 5 |
| 8 | 一种SLM成形性能预测与工艺参数优化方法及系统 | 5 |
Ranked by total forward citations. Citation counts favour older and broadly cited patent families, and broad or adjacent patents may appear when they match the search scope. Treat this section as citation context, not as a curated list of the most topic-specific patents. Some patent titles may be shown in their original, non-English language where an accurate translation could not be guaranteed.
Assignee snapshot from the current evidence set
The applicants below are visible in this query result. Because the evidence set is relatively small, read this section as a directional snapshot rather than a full competitive ranking.
NuTech Ventures Ltd
NuTech Ventures Ltd holds 2 patent families focused on powder metallurgy process parameters (B22F 10, B22F 12) with secondary coverage in additive manufacturing data and quality control (B33Y 50). The applicant entered recently and is flagged as a new entrant with rising momentum, suggesting these filings represent an early-stage IP-staking effort rather than an established manufacturing position.
families: 2Nikon SLM Solutions AG
Nikon SLM Solutions AG holds 2 patent families with a distinct emphasis on digital simulation and process modeling (G06F 30), alongside core powder-metallurgy process claims (B22F 10, B22F 12). This combination — the only equipment OEM in the top tier coupling simulation to hardware process claims — positions Nikon SLM as the closest to a system-level scan-strategy approach among the current leaders.
families: 2Frequently asked questions
The current corpus contains 28 patent families in scope. This is a small, early-stage field, and filings from approximately 2024 onward are under-counted due to standard patent publication lag.
Five applicants are tied at the top of the ranking, each holding 2 patent families: NuTech Ventures Ltd, Nikon SLM Solutions AG, Central South University, Jiangsu XCMG Construction Machinery Research Institute, and Tianjin University. No single organization leads outright.
China leads with 17 patent records, followed by the United States with 7. WIPO PCT accounts for 2, with single records in Europe (EPO) and India. The strong Chinese domestic concentration reflects the high participation of Chinese universities and state-linked research institutes.
The field is in a Growth stage. Annual filings are still rising on a multi-year basis, with a 50% increase in the recent filing window. No single applicant has established a broad blocking portfolio, indicating that fundamental process claims are still being staked out.
B22F (powder metallurgy) and B33Y (additive manufacturing) are visible in, consistent with core laser powder-bed fusion process claims. G06F (electric digital data processing) is the third-largest class, reflecting the growing importance of simulation and optimization software. G06N (AI/ML models) and G16C (computational chemistry) are present but sparse.
No co-applicant or joint filings are detected in the current corpus. The field is characterized by independent filings, predominantly from academic and research institutions, with no evidence of cross-sector partnerships forming around shared IP as of the data available.
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Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
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