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Machine Vision In-Line Metrology — PatSnap Eureka

Machine Vision In-Line Metrology — PatSnap Eureka
In-Line Metrology · Patent Intelligence

Machine Vision In-Line Metrology: Replacing CMM in High-Volume Production

A patent landscape analysis of 40+ active and historical patents from Mitutoyo, Hexagon, Cognex, Applied Materials and more — tracing how non-contact optical systems eliminate stop-and-measure CMM cycles on the production floor.

Top Assignees by Patent Activity

Dominant filers across 40+ machine vision metrology patents in this dataset.

Top Assignees by Patent Activity: Mitutoyo 8, Hexagon 7, Applied Materials 5, Cognex 3, Lam Research 2, Others 15 Horizontal bar chart showing patent filing activity by dominant assignees in machine vision-based in-line metrology, derived from analysis of 40+ patents via PatSnap Eureka. Mitutoyo leads with 8 patents, followed by Hexagon Technology Center with 7. Mitutoyo 8 Hexagon 7 Appl. Materials 5 Cognex 3 Lam Research 2 Source: PatSnap Eureka · 40+ patent records · 2005–2025
40+
Patents Analysed
7+
Jurisdictions Covered
8
Dominant Assignees
2005–25
Filing Timeline
Core Measurement Principles

How Machine Vision Replaces the CMM Stylus

Machine vision-based in-line metrology replaces the mechanical stylus of a traditional coordinate measuring machine with optical sensing. Instead of physically touching a workpiece at discrete coordinate points, a vision system captures image data from which dimensional features are extracted algorithmically.

The most fundamental enabling technique is focus-height measurement via image stacking: the imaging system scans a workpiece along the Z-axis while collecting a series of images at known Z positions. The Z-height at which a region of interest achieves peak focus — the "focus peak" — becomes the measured surface height. Mitutoyo's 2024 patent defines an image stack set spanning all Z-heights to be determined for multiple regions of interest, extracting a focus metric for each sub-image to derive a corrected Z-height measurement.

A complementary approach using strobed illumination and periodically modulated focus position (Mitutoyo, EP 2019) allows illumination strobe pulses to be phase-matched to a sinusoidally modulated objective lens position. This enables rapid Z-height stacks to be collected without mechanically stepping the stage — dramatically increasing measurement throughput compared to conventional step-and-capture methods.

For workpieces with low-contrast or highly reflective surfaces, standard edge detection fails. Mitutoyo's 2005 patent resolves this by training the system in a learning mode to generate a "line-intensified image" using a parameter-controlled technique, then applying linear transformation to the enhanced image and analysing local extrema corresponding to the target line features. This extends machine vision metrology to challenging materials typical in precision machining, semiconductor packaging, and metal stamping.

Illumination consistency across multi-station lines is addressed by Quality Vision International's 2014 patent, which discloses a pre-calibration process where illumination intensity data collected on one machine can be transferred to other machines of the same type — enabling consistent measurement accuracy across production lines without manual recalibration at each station. Learn more about patent landscape analytics for metrology technology.

Z-Stack
Focus-height image stacking for 3D surface measurement
Strobe
Sinusoidally modulated objective lens + phase-matched illumination
No Touch
Optical sensing replaces mechanical stylus contact entirely
Multi-Line
Illumination calibration portable across all stations in a fleet
  • Focus-curve analysis for 3D surface height
  • Strobed illumination eliminates stage stepping
  • Learning-mode line intensification for reflective parts
  • Cross-machine illumination calibration transfer
  • Micrometer-level precision from unified coordinate systems
Engineering Implementation

How In-Line Vision Metrology Is Deployed in Production

Six architectural patterns — from fly-mode CMM cameras to loader-integrated gauging — that eliminate dedicated off-line measurement steps.

Fly-Mode Acquisition

Continuous-Motion Image Capture with Encoder Synchronisation

The camera never stops at a measurement location. Position data from linear encoders is latched at the moment of image capture, and a synchronised strobe flash freezes the part image despite relative motion. Hexagon Technology Center's Delta-robot CMM patents (CN 2015, CN 2016) describe a camera whose field of view covers at most 20% of the robot's motion envelope, operating in fly mode — eliminating the acceleration and deceleration cycles that dominate cycle time in stop-and-measure CMM operation and reducing vibration-induced errors.

Hexagon Technology Center · 2015–2016
Mechanical Decoupling

Imaging Detectors Separated from CMM Carrier Mechanics

Hexagon's EP 2016 patent discloses that imaging detectors are firmly mounted to a stationary metrology table and mechanically decoupled from the CMM carrier. Vibration or thermal drift in the positioning structure does not propagate to the measurement sensor — a critical requirement when deploying metrology in the vibration-rich environment of a production floor. This architectural decision is a prerequisite for achieving CMM-grade accuracy outside a temperature-controlled metrology lab.

Hexagon Technology Center GmbH · EP 2016
Loader-Integrated Gauging

Non-Contact Measurement Within the Part-Handling Loader Path

Murata Machinery's 2010 patent discloses a non-contact measuring device positioned at a measurement station within the loader path. An auxiliary step first determines the inclination angle of the part as gripped, and a main measurement step then positions the desired measurement features at the station based on that inclination correction. This removes the need for a separate workpiece-moving mechanism and achieves accurate in-process gauging without interrupting material flow through turning or milling cells.

Murata Machinery · JP 2010
Reference Systems

Image-to-Mold Coordinate Correlation Independent of Robot Accuracy

Bombardier's US 2019 patent addresses composite aerospace structures: reference targets placed on the lay-up surface contour establish a direct correlation between the image reference system and the mold reference system. Crucially, this referencing is performed independently of the positioning accuracy of the automated lay-up tool — so even if the robot's absolute positioning drifts, the vision measurement remains accurate relative to the as-built mold geometry. This decouples measurement quality from robot calibration state.

Bombardier Inc. · US 2019
Program Portability

Blur-Constrained Parameters Enable Fleet-Wide Program Reuse

Mitutoyo's CN 2010 patent addresses multi-machine production lines directly: the inspection program determines image acquisition parameters — stage speed, strobe power, strobe exposure time — based on functional limits derived from image blur constraints, not from fixed hardware specifications. The same part program delivers consistent measurement accuracy on any compatible machine regardless of its specific hardware capabilities, enabling true program portability across a production fleet without re-validation at each machine.

Mitutoyo · CN 2010
Self-Routing Automation

Workpiece Self-Identification and Automatic Task Matching

Suzhou Hande's CN 2020 patent discloses a system that performs workpiece arrival pre-detection, task matching and filtering based on the part's feature information, then executes the matched visual measurement task — unifying all measurement coordinate systems into the workpiece's own coordinate system to reduce accumulation errors. The patent claims micrometer-level precision from this unified coordinate approach. This is necessary for realising 100% in-line inspection in high-mix, high-volume production rather than statistical sampling.

Suzhou Hande · CN 2020
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Patent Data Visualised

Technical Approach Distribution Across the Dataset

Derived from analysis of 40+ machine vision metrology patents spanning Germany, Japan, China, the US, Canada, Israel, and PCT filings via PatSnap analytics.

Dominant Technical Approaches in the Patent Dataset

Five primary technology clusters identified across 40+ patents, with fly-mode acquisition and Z-height stacking accounting for over half of all claims.

Dominant Technical Approaches: Fly-Mode & Encoder Sync 28%, Z-Height Focus Stacking 24%, ML Dimensional Inference 20%, Reference & Calibration 16%, Structured Illumination 12% Donut chart showing distribution of five primary technology clusters across 40+ machine vision metrology patents analysed via PatSnap Eureka. Fly-mode acquisition and Z-height stacking together represent over half of all patent claims. 40+ patents Fly-Mode & Encoder Sync 28% Z-Height Focus Stacking 24% ML Dimensional Inference 20% Reference & Calibration 16% Structured Illumination 12% Source: PatSnap Eureka · 40+ patents · 2005–2025

Patent Filing Activity by Era (Selected Milestones)

Key filing milestones from the dataset illustrate the technology maturation arc from early autofocus methods to ML-based dimensional inference.

Patent Filing Milestones: 2005 Mitutoyo line-intensified image, 2010 blur-constrained portability, 2011 autofocus video tool, 2015 Hexagon fly-mode Delta CMM, 2019 Bombardier reference system, 2020 ML metrology Lam Research, 2023 Applied Materials ML film thickness, 2024 Mitutoyo optical deviation correction Bar chart showing key patent filing milestones in machine vision-based in-line metrology from 2005 to 2024, derived from PatSnap Eureka patent analysis. The dataset spans Mitutoyo, Hexagon, Applied Materials, Lam Research, and Bombardier. 2024 2019 2015 2010 Mitutoyo optical deviation Applied Materials ML thickness Lam Research ML metrology Bombardier reference system Hexagon decoupled detectors Hexagon fly-mode Delta CMM Mitutoyo autofocus video tool Mitutoyo blur-constrained portability Mitutoyo line-intensified image Source: PatSnap Eureka · Selected milestone patents · 2005–2024

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Machine Learning Integration

ML Extends In-Line Metrology Beyond Physical CMM Limits

Trained neural networks infer dimensional parameters directly from image data at feature scales — and throughput rates — that contact CMMs cannot physically achieve.

🧠

Film Thickness from RGB Image Regression

Applied Materials (JP 2023) trains a deep neural network to regress RGB intensity values from in-line colour images of semiconductor substrates against ground-truth thickness measurements from a calibration substrate. The model predicts film thickness for each die region during chemical-mechanical planarisation (CMP) without stopping the process — a task physically impossible for a contact CMM at wafer scale.

🔬

Die-Level Spatial Resolution Across Full Wafers

Applied Materials' 2025 patent extension explicitly describes using a die mask to partition a full-wafer colour image into per-die sub-images, each paired with a ground-truth thickness measurement for supervised training — enabling die-level spatial resolution of thickness variation across the wafer in real time during production.

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Key Players & Innovation Trends

Who Is Driving the Machine Vision Metrology Patent Landscape

Eight dominant assignees span the full stack from CMM motion control to semiconductor-scale ML inference. Each occupies a distinct technical niche.

Most Prolific Assignee

Mitutoyo — Vision-Probe CMM Integration

The most prolific assignee in this dataset, with patents spanning vision-probe CMM integration, autofocus dimensional tooling, Z-height stacking, blur-constrained program portability, interrupted-operation programming, and CMM sampling period optimisation. Their dual-sampling-period CMM method (JP 2020) interleaves short (fast, lower-accuracy) and long (slow, higher-accuracy) probe sampling periods to simultaneously serve motion control and high-precision measurement needs — a direct architectural response to throughput demands. Explore patent analytics for Mitutoyo's full portfolio.

8 patents in dataset · 2005–2024
Structural CMM Architecture

Hexagon Technology Center — Delta-Robot CMM Systems

Dominates the structural CMM architecture space with multiple patents on Delta-robot CMMs with fly-mode cameras, stationary imaging detectors decoupled from moving carriers, and open-loop non-contact distance regulation. Their CN 2024 open-loop distance regulation patent describes controlling the standoff distance of a non-contact probe using projected primary measurement beam patterns — enabling fast scanning of free-form surfaces without prior CAD models. Hexagon also contributes CMM validation through a calibrated conformance test artifact (CN 2019).

7 patents in dataset · 2015–2024
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Key Takeaways

What the Patent Landscape Tells Engineers and IP Teams

Fly-mode continuous-motion image acquisition is the primary mechanism by which CMM-integrated vision systems eliminate the deceleration and acceleration cycles that dominate cycle time in traditional stop-and-measure CMM operation. Position encoder data is latched at image capture; a strobe flash freezes the part. This is the architectural foundation of Hexagon's Delta-robot CMM family (2015–2016).

Z-height focus stacking and focus-curve analysis provides the 3D surface measurement capability that allows vision systems to replace the contact probe for form and height measurements. Mitutoyo's 2024 optical deviation correction patent and their EP 2019 high-speed focus height patent represent the current state of the art for this approach. According to ISO metrology standards, non-contact methods must meet equivalent traceability requirements to contact CMMs for production acceptance.

Mechanical decoupling of imaging detectors from CMM carriers is an architectural prerequisite for achieving CMM-grade accuracy in a vibration-rich production floor environment. Hexagon's EP 2016 patent demonstrates this by mounting imaging detectors to a stationary metrology table, entirely separate from the moving carrier mechanics.

Blur-constrained program portability is a practical enabler for multi-machine production deployments. By deriving acquisition parameters from blur constraints rather than hardware specifications, the same validated inspection program executes on any machine in a fleet with consistent accuracy — critical for high-volume lines with parallel or successor inspection machines.

Machine learning inference extends in-line metrology to feature scales and measurement types physically inaccessible to contact CMMs — tens-of-nanometre semiconductor features, real-time CMP film thickness, and virtual metrology from synthetic microscopy images. For enterprise R&D teams, PatSnap life sciences intelligence and materials science analytics offer adjacent landscape coverage.

Workpiece self-identification and automatic task routing without operator intervention is necessary for realising 100% in-line inspection in high-mix, high-volume production rather than statistical sampling. Suzhou Hande's CN 2020 patent claims micrometer-level precision from this unified coordinate approach. The European Patent Office has seen accelerating filings in this sub-class over the past five years.

Seven Critical Enablers
  • Fly-mode encoder-synchronised image capture
  • Z-height focus stacking for 3D surface measurement
  • Mechanical decoupling of detectors from carriers
  • Blur-constrained program portability across fleets
  • ML inference at nanometre feature scales
  • Workpiece self-ID and automatic task routing
  • Probe-vision cross-calibration for hybrid CMM migration
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DATASET COVERAGE
Germany · Japan · China · United States · Canada · Israel · PCT/WO filings
Assignees include Mitutoyo, Hexagon, Keyence, Applied Materials, Cognex, Zebra Technologies, Quality Vision International, Bombardier, Murata Machinery, Lam Research, Nova Ltd., and academic institutions.
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Machine Vision In-Line Metrology — key questions answered

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References

  1. Optical Deviation Correction for Machine Vision Inspection Systems — MITUTOYO CORP., 2024
  2. Machine Vision Inspection System and Method for Performing High-Speed Focus Height Measurement Operations — MITUTOYO CORPORATION, EP 2019
  3. Autofocus Video Tool for Accurate Dimensional Inspection and Method Therefor — Mitutoyo, JP 2011
  4. Method for Automatically Adjusting the Level of an Illumination Light Source in an Optical Measuring Machine — QUALITY VISION INTERNATIONAL, INC., JP 2014
  5. Operation Method for Image Measuring Machine Inspection System Used for Inspection of Line Groups Embedded in High-Degree Property-Worked Material — Mitutoyo, JP 2005
  6. Coordinate Measuring Machine (Delta Robot, Fly Mode) — Hexagon Technology Center, CN 2015
  7. Coordinate Measuring Machine (Delta Robot, Fly Mode) — Hexagon Technology Center, CN 2016
  8. Coordinate Measuring Machine (Imaging Detectors Decoupled) — HEXAGON TECHNOLOGY CENTER GMBH, EP 2016
  9. Open-Loop Distance Regulation for Coordinate Measuring Machines — Hexagon Technology Center, CN 2024
  10. Blur-Limit Based System and Method for Controlling Consistent Precision and High-Speed Inspection Vision Systems — Mitutoyo, CN 2010
  11. An Online Measurement System and Method Based on Machine Vision — Shenyang Jianzhu University, CN 2019
  12. A Vision Measurement System and Measurement Method — Suzhou Hande Optoelectronics Technology Co., Ltd., CN 2020
  13. Machine Learning-Based Film Thickness Estimation from Substrate Image Processing — Applied Materials, Inc., JP 2023
  14. Film Thickness Estimation from Machine Learning Based Processing of Substrate Images — Applied Materials, Inc., JP 2025
  15. Optical Metrology in Machine Learning to Characterize Features — Lam Research, CN 2020
  16. System and Method for Calibrating a Vision System with Respect to a Touch Probe — COGNEX CORPORATION, DE 2016
  17. System and Method for Calibrating Vision System Relative to Contact Probe — Cognex Corporation, CN 2018
  18. Workpiece Measurement System Using Loader — Murata Machinery, JP 2010
  19. Reference System for Online Vision Inspection — BOMBARDIER INC., US 2019
  20. Systems and Methods to Optimize Performance of a Machine Vision System — ZEBRA TECHNOLOGIES CORPORATION, WO 2022
  21. Conformance Test Artifact for Coordinate Measuring Machines — Hexagon Measurement Technologies, CN 2019
  22. Method for Operating a Coordinate Measuring Device — Mitutoyo, JP 2020
  23. NIST — National Institute of Standards and Technology (metrology standards reference)
  24. ISO — International Organization for Standardization (metrology and measurement standards)
  25. EPO — European Patent Office (patent filing data and classification)
  26. SEMI — Semiconductor Equipment and Materials International (semiconductor metrology standards)

All data and statistics on this page are sourced from the references above and from PatSnap's proprietary innovation intelligence platform. Patent analysis conducted via PatSnap Eureka.

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