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Materials Informatics Patents: Who Leads, Where the Gaps Are 2026

Materials Informatics Patents: Who Leads, Where the Gaps Are 2026
https://www.patsnap.com/resources/blog/rd-blog/materials-informatics-and-materials-genomics-patent-landscape-patent-landscape/ · Patsnap · data cut-off 2026-08-31 · downloaded from the live page
Patent Landscape · Materials Informatics & Materials Genomics
Materials Informatics and Materials Genomics Patents: Who Is Filing, and Where the Field Is Still Open
  • Filing nearly doubled in three years: 2021 to 2024 filings rose from 7 to 12, a 71% increase, before the count for 2025 onward understates true activity due to publication lag.
  • Half the field sits with five assignees: the top 5 combined account for 31 of 62 records in scope (50.0%), while the leader holds 7 records against a long tail of single- and few-filing entrants.
  • Software classes outweigh materials-science classes: G06F (electric digital data processing) appears in 40.3% of records and G16C (computational chemistry) in 37.1%, ahead of G01N (material analysis & testing) at 16.1%.
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62
Published Records
50%
Top-5 Share of All Records
+71%
Filing Growth 2021→2024
US
Leading Jurisdiction

Filing growth compares 2021 (7 records) with 2024 (12) — a three-year span. 2024 is the most recent year we treat as complete: publication lags filing by roughly 18 months, so 2025 onwards are still filling in and any growth rate that ends there would understate the field. Top-5 share is the combined record count of the five largest assignees divided by all 62 records in scope (CR5), not by the ranked leaders only.

Published byPatsnap Research··7 min readSourced from Patsnap Eureka
Overview

What this landscape covers

This landscape maps 62 published patent records at the intersection of materials informatics and materials genomics — filings that combine machine learning, computational chemistry or data-science methods with material property, synthesis condition or composition claims. Coverage runs from 2015 through the 2026-08-31 cut-off, with 2024 the last year that can be read as a complete filing year given an 18-month publication lag.

The record set spans corporate materials suppliers, industrial conglomerates, a software platform vendor, and university and public-research assignees, filed predominantly through the US, EPO and PCT routes. The technology composition leans toward computing and data-processing classes rather than pure materials-testing classes, which signals where the informatics layer — not the underlying material — is where claims are concentrated.

Filing activity and technology composition, 2015–2026
  1. 1CITRINE INFORMATICS INC7
  2. 2PROTERIAL LTD7
  3. 3NGK INSULATORS LTD7
  4. 4PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD5
  5. 5MICROSOFT TECHNOLOGY LICENSING LLC5
  6. 6PRESIDENT & FELLOWS OF HARVARD COLLEGE4
  7. 7JFE STEEL CORP3
  8. 8OSAKA UNIVERSITY3
  9. 9GC CORP3
  10. 10MITSUBISHI HEAVY IND LTD3
Source: Patsnap Eureka. Assignee ranking and totals. Derived from a Patsnap search on Materials Informatics & Materials Genomics Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

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The Data

Filing trend and technology composition

Two views of the same 62-record dataset: how filing activity has moved year over year, and which IPC subclasses carry the claims.

Filing trend, 2017–2026

Filings moved from 2 in 2017 to a peak of 12 in 2023, with the 2021-to-2024 span showing a 71% rise (7 to 12). Years from 2025 onward are still filling in as publications catch up to filing dates, so the apparent tail-off should not be read as a slowdown.

Filing trend, 2017–20260369122201720182019202020212022122023122024202512026Most recent year is partial — publication lag means later filings are not yet visible.

Technology composition by IPC subclass

G06F (electric digital data processing, 40.3% of records) and G16C (computational chemistry, 37.1%) dominate, with G06N (AI-based computing, 29.0%) close behind. Materials-specific classes — G01N material analysis (16.1%), H01M batteries (6.5%), C04B ceramics (4.8%) — appear far less often, and because records can carry multiple classes these shares add up to more than 100%.

Technology composition by IPC subclassG06F · Electric digital data processi…2540.3%G16C · Computational chemistry2337.1%G06N · Computing based on AI models1829.0%G01N · Material analysis & testing1016.1%G06T · Image data processing & genera…46.5%H01M · Batteries, cells & fuel cells46.5%C04B · Ceramics, cement & refractories34.8%G06K · Data recognition & presentation34.8%Other1727.4%

Shares are the percentage of the 62 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.

Source: Patsnap Eureka. Filing trend and technology composition. Derived from a Patsnap search on Materials Informatics & Materials Genomics Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish.

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Key Patents

Most-cited records and a representative filing

Representative Filing
US20220351504A12022-11-03

Method and apparatus for evaluating material property (US20220351504A1)

PROTERIAL, LTD.

Filed by Proterial, Ltd. and published 2022-11-03, this filing covers an image-processing pipeline that scans images of a material, lowers their gradation to create a low-gradation image, generates a virtual image from it, extracts features from the low-gradation image, and predicts a first material property from those features.The claim chain runs from raw image capture through gradation reduction to property prediction — each step is a potential point of differentiation for a workaround.

US20220351504A1 — patent drawing 1US20220351504A1 — patent drawing 2
View full filing
Most-cited records in the dataset
#Publication no.Patent titleCitations
1US20200257933A1Machine Learning to Accelerate Alloy Design187
2US20210118530A1Multi-scale method for simulating mechanical behaviors of multiphase composite materials153
3US20220067249A1Machine Learning to Accelerate Design of Energetic Materials80
4US20180113967A1System and Method for Predicting Fatigue Strength of Alloys39
5WO2019104181A1Solid state electrolytes and methods of production thereof10
6US11915105B2Machine learning to accelerate alloy design8
7US20200350618A1Solid state electrolytes and methods of production thereof8
8US20220407001A1Novel Nanocomposite Phase-Change Memory Materials and Design and Selection of the Same7
9US20210326755A1Learning model creation device, material property prediction device, and learning model creation method and p…7
10WO2020176164A1Predictive design space metrics for materials development7

Citation counts reward older filings that have had more time to accumulate citations inside a searched corpus — read them as a signal of influence, not of current importance.

Each row carries its publication number; clicking a row searches Eureka by that number.

Source: Patsnap Eureka. Citation counts and representative records. Derived from a Patsnap search on Materials Informatics & Materials Genomics Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
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Insights

What the numbers mean for a filing decision

Three read-throughs from the concentration, composition and citation data above.

Concentration
50.0% in top 5
of 62 records

Half the field sits with a handful of assignees

The top 5 assignees combined hold 31 of 62 records in scope, with the leader alone at 7. That leaves the other half of the dataset spread across a long tail of entrants filing once or twice — a pattern typical of a field still forming its dominant designs rather than one already consolidated.

Top 10 combined reach 75.8% of records.
Technology mix
40.3% G06F
of 62 records

Claims cluster on the software layer, not the material

G06F and G16C together outpace G01N (material analysis & testing) by a wide margin, meaning most claims are staked on the data-processing and computational-chemistry pipeline around a material rather than on the material's physical testing or characterisation itself.

G01N appears in only 16.1% of records.
Momentum
+71%
2021 → 2024 filings

Filing activity nearly doubled across three years

Filings rose from 7 in 2021 to 12 in 2024, and 2023 is the peak year recorded so far at 12. Because publication typically lags filing by around 18 months, the apparent drop after 2024 reflects incomplete data, not falling interest.

2017 baseline was 2 filings.
Citation signal
187 citations
top-cited record

Early alloy-design ML filings anchor the citation graph

The most-cited record concerns machine learning for alloy design, followed by a multi-scale composite-materials simulation filing. Both predate most of the recent filing surge, which is expected — older records simply have had longer to accumulate citations inside the searched corpus.

Second-most-cited record: 153 citations.
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Looking for what nobody has claimed yet?

Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to materials informatics & materials genomics patent landscape, with the prior art for and against each one.

Find the white space →
Source: Patsnap Eureka. Co-assignee relationships and derived observations. Derived from a Patsnap search on Materials Informatics & Materials Genomics Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
Players

Who is filing, and where the gaps sit

The ranking below covers the 30 companies the data endpoint returns for this search — not a top-50 or top-100 list — spanning materials suppliers, an industrial conglomerate roster, a software vendor and university assignees.

Leader
7 records
single top assignee

One assignee sets the pace, without running away with the field

The leading assignee holds 7 of 62 records — enough to lead the ranking but well short of a dominant share, leaving room for challengers to build a comparable position with a focused filing programme.

Fifth place holds 5 records; tenth place holds 3.
Receiving offices
30 US filings
of the receiving-office total

Filing is US-centred with meaningful EPO and PCT coverage

The United States receives the largest share of filings, with Europe (EPO) and WIPO (PCT) routes both used at meaningful volume. India, Australia and Canada each carry a small but non-zero share, suggesting selective rather than blanket international filing.

EPO: 14 filings; PCT: 7 filings.
Co-filing
3 joint filings
strongest pair

Corporate–university collaboration is the strongest observed pairing

The strongest co-assignee pair in the dataset links a corporate filer with a university, at 3 joint records — a small but notable signal that some of this field's strongest filings pair industrial application know-how with academic research capacity.

No other pair in the dataset reaches this count.
🔍
Under-claimed branches worth a closer look
Sub-areas where filing density is thin relative to the core software and computational-chemistry claims
Image-to-property prediction pipelinesSynthesis-condition optimisation loopsEnergetic-materials ML designMultiphase composite simulation methodsSolid-state electrolyte discovery workflows
Rank all filers by momentum →
Recent-year filing momentum
AssigneeRecent yearYoY
NGK Insulators, Ltd.1
Proterial, Ltd.0
CITRINE INFORMATICS INC0
Panasonic Intellectual Property Management Co., Ltd.0-100%
Microsoft Technology Licensing, LLC0
President & Fellows of Harvard College0
NGK Insulators, Ltd.0
JFE Steel Corporation0-100%
Source: Patsnap Eureka. Assignee-level momentum. Derived from a Patsnap search on Materials Informatics & Materials Genomics Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
What's Next

Where to take this landscape

The dataset points to a field where claim density sits on the informatics layer rather than the material itself, leaving several practical next steps.

Map your own claim set against the IPC composition

Compare a target filing or portfolio against the G06F/G16C/G06N split shown here to see whether it sits inside the dense software cluster or in the thinner materials-testing space.

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Watch the leaders' recent-year filing momentum

Several top assignees show flat or declining latest-year counts, which given publication lag may reverse — track this before assuming any single leader is pulling ahead.

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Probe the under-claimed branches before they fill in

Image-to-property prediction and synthesis-condition optimisation show thinner filing density than the core computational-chemistry cluster, which is where a first-mover claim carries more weight.

Explore white space in Eureka
Source: Patsnap Eureka. Forward-looking reading of the same dataset. Derived from a Patsnap search on Materials Informatics & Materials Genomics Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
FAQ

Common questions about this landscape

Answers are grounded in the same dataset. Derived from a Patsnap search on Materials Informatics & Materials Genomics Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company’s registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.

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