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MEMS Accelerometer Pressure Sensor Patent Landscape

MEMS Accelerometer Pressure Sensor Patent Landscape
Competitive Landscape

MEMS Accelerometer Pressure Sensor Patent Landscape in 2026

InvenSense dominates a small, mature corpus of 14 patent families, holding the largest single share among all filers. Annual filing volume has plateaued near its 2019 and 2023 peaks, signalling a field in maturity rather than active expansion.

14
Patent families in scope
67%
Top-5 share of top-100 filers
0%
3-yr filing growth (lag-adj.)
China
Leading jurisdiction
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Published byPatSnap Insights Team··6 min readVerified by PatSnap Eureka data
Overview

InvenSense leads a highly concentrated, small-corpus field

InvenSense holds the top position in the applicant ranking, followed at a distance by Shanghai Jiao Tong University and Suzhou Zhonghong Weiyu Technology, each with substantially fewer patent records. The field is narrowly held: the top five filers account for 67% of the combined total among the hundred largest filers.

The tier gap between rank one and the rest is pronounced. InvenSense’s count is three times that of the next two applicants combined, creating a clear dominant-player structure rather than a balanced competitive field.

Leading applicants
#ApplicantPatent recordsShare
1InvenSense Inc6
2Shanghai Jiao Tong University2
3Suzhou Zhonghong Weiyu Technology Co., Ltd.2
4Lovely Professional University1
5Hangzhou Hanlu Geophysical Exploration Co., Ltd.1
6Yang Hongyuan1
#ApplicantPatent recordsShare
7Zhongke Huakong Aerospace Technology (Hefei) Co., Ltd.1
8Beijing Yundahuakai Technology Co., Ltd.1
9Zhongke Huakong Technology Anhui Co., Ltd.1
10Galgotias University1
11Tianjin Andaweier Aviation Technology Co., Ltd.1
↗ Hover a row · click a company to ask Eureka

InvenSense’s strong position across MEMS microstructural device (B81B), dimensional measurement (G01B), and force/pressure measurement (G01L) classes indicates broad technical coverage rather than narrow specialisation, raising freedom-to-operate considerations for new entrants in core sensing sub-classes.

The most recent 18–24 months of filing data are subject to publication lag and likely under-represent true activity; conclusions about very recent shifts should be treated as provisional. Longer-window growth, applicant concentration, and technology-route coverage are therefore more reliable signals than the latest-year bar alone.

Source: PatSnap Eureka. Chart shows the top applicants ranked by patent records; the corpus total is measured in patent families. These figures use different units and should not be compared directly.Explore deeper in Eureka →
Trends & Structure

Plateaued annual volume; acceleration and MEMS microstructure dominate the technology mix

The filing trend and technology composition charts together show a field that peaked around 2019 and 2023 without sustained growth, while the IPC mix reveals that core acceleration measurement remains central alongside a dispersed set of application-specific branches.

Annual filing trend

Annual filings first peaked in 2019, dipped, then matched that level again in 2023 before easing. The overall recent-window growth is flat at zero percent. The 2024–2025 period should be read with caution given publication lag; the apparent low in 2021 and the modest 2025 count are consistent with a maturity plateau rather than a structural decline.

Annual filing trendAnnual values from 2017 to 2026, peaking at 3 in 2019.02017120183201922020020211202232023120243202502026↗ Hover for values · click a bar to ask Eureka

Technology composition

G01P (velocity and acceleration) is the dominant IPC branch, reflecting the core sensor function. G01L (force and pressure measurement) and B81B (MEMS microstructural devices) follow, confirming the dual sensing character of this corpus. The long tail of application-specific branches — spanning marine rescue, geophysics, medical devices, ammunition, and wireless networks — illustrates how broadly MEMS accelerometer pressure sensor technology is being deployed across end-use domains.

Technology compositionG01P · Velocity & acceleration leads with 8; G01L · Force & pressure measurement 4.G01P · Velocity & accele…8G01L · Force & pressure …4B63C · Launching & salva…3B81B · Microstructural d…3G01B · Measuring length …3G01C · Distance, navigat…2G01D · Measuring (genera…2G06F · Electric digital …2↗ Hover for values · click a bar to ask Eureka
Source: PatSnap Eureka. Technology-branch counts are measured in patent records; a single patent family can carry several IPC classes, so class totals can exceed the family total in scope.Explore deeper in Eureka →
Key Patents

Highly cited patent families surfaced by the query

Citation-heavy patent families returned by the query. Use this section as citation context, not as a curated list of the most topic-specific patents.

Featured patent
US10260871B1Published 2019-04-16

Trajectory estimation system

INVENSENSE, INC.

A system and method for efficiently determining trajectory and/or location of a device (or user thereof). In a non-limiting example, rotation matrix coefficients may be analyzed in conjunction with stepping information to determine device trajectory and/or location. The system and method may, for example, be implemented in a MEMS sensor system, for example… (excerpt from the patent abstract)

Trajectory estimation system — patent drawingTrajectory estimation system — patent drawing
Representative drawings from the patent document.
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Highly cited patent families surfaced by this query
#PatentCitations
1Trajectory estimation system11
2一种便携式智能溺水救生系统10
3一种轻便式防溺水智能救生系统8
4基于MEMS加速度计的智能手写系统及其识别方法4
5Dual-sealed accelerometer with cavity pressure mon…1
6Trajectory estimation system1

Ranked by total forward citations. Citation counts favour older and broadly cited patent families, and broad or adjacent patents may appear when they match the search scope. Treat this section as citation context, not as a curated list of the most topic-specific patents. Some patent titles may be shown in their original, non-English language where an accurate translation could not be guaranteed.

Source: PatSnap Eureka. Citation-ranked patent families surfaced by this query.Open in Eureka →
Insights

What the structure means for R&D investment decisions

The combination of a dominant incumbent, a mature filing curve, and a dispersed application footprint defines the strategic context for any new entrant or existing player looking to extend coverage.

Maturity

Field has plateaued near its peak

The lifecycle evidence indicates annual filings have plateaued near their peak, placing the field firmly in a maturity stage. Filing activity spiked in 2019 and again in 2023 but has not established a sustained upward trajectory. For R&D teams, this means incremental improvement patents face a crowded prior-art landscape, while genuinely differentiated architectures or novel application domains offer the clearest path to protectable positions.

Lifecycle: Maturity
Concentration

One dominant filer; rest are fragmented

InvenSense accounts for a disproportionate share of records among the ranked filers, with the top five together representing 67% of the hundred largest filers’ combined total. The remaining applicants — several of which are universities or small Chinese firms — hold single-digit counts. This structure means that outside InvenSense’s claim footprint, the field is relatively open, but freedom-to-operate analysis against InvenSense’s portfolio is a prerequisite for any product development programme.

High concentration
Collaboration

One co-filing pair identified; ecosystem is sparse

The only recorded collaboration is between Zhongke Huakong Aerospace Technology (Hefei) and Zhongke Huakong Technology Anhui — two entities sharing a common institutional origin — which co-filed on a single ammunition-guidance application. No broader multi-party co-filing networks are evidenced. For new entrants, this sparse collaboration landscape suggests that partnering with academic institutions (Shanghai Jiao Tong University and Lovely Professional University are both active) could be an under-used route to building an initial patent position.

Sparse ecosystem
Geography

China dominates filings; US presence is InvenSense-anchored

China accounts for the largest share of jurisdiction records, followed by the United States, India, Europe (EPO), and WIPO (PCT). The US presence is anchored primarily by InvenSense. India’s appearance — driven by university filers Lovely Professional University and Galgotias University — signals emerging academic interest. For companies seeking geographic coverage, EPO and PCT routes remain lightly utilised relative to the technology’s commercial reach.

China-led geography
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Top collaboration links
ApplicantCollaboratorCo-filings
Zhongke Huakong Aerospace Technology (Hefei) Co., Ltd.Zhongke Huakong Technology Anhui Co., Ltd.1

Co-filing pairs, ranked by the number of jointly-filed patent families.

Source: PatSnap Eureka. Insights are grounded in applicant ranking, lifecycle, collaboration, and jurisdiction evidence from the corpus.Explore insights →
Leaders

InvenSense leads on breadth; Shanghai Jiao Tong University anchors academic activity

Two distinct player profiles emerge: a commercial incumbent with broad technical coverage and a research-institution cohort with narrower, application-specific focuses.

Leader · InvenSense Inc

InvenSense Inc

InvenSense holds 6 patent records in the ranked corpus, the highest count of any filer. Its technology focus spans MEMS microstructural devices (B81B), dimensional measurement (G01B), and force/pressure measurement (G01L) — a combination reflecting system-level sensor integration rather than a single sub-function. Momentum data shows InvenSense as a new entrant to the most recent filing window with 3 recent records, suggesting active portfolio maintenance despite the field’s overall maturity plateau.

patent records: 6
Challenger · Shanghai Jiao Tong University

Shanghai Jiao Tong University

Shanghai Jiao Tong University holds 2 patent records, tied for second place alongside Suzhou Zhonghong Weiyu Technology. Its technology focus is concentrated in acceleration measurement (G01P 15), human-computer interaction data processing (G06F 3), and data recognition (G06K 11) — pointing toward gesture-recognition and smart-interface applications of MEMS accelerometers. No momentum data places it in the recent active-filer list, indicating a stable rather than accelerating position.

patent records: 2
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See the full applicant breakdown
Explore all ranked filers, their IPC emphases, and recent filing momentum in the full PatSnap Eureka analysis.
Suzhou Zhonghong Weiyu TechnologyLovely Professional University+ more
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Leading-applicant momentum (recent 3 yrs, lag-adjusted)
ApplicantRecent (3 yrs)Trend
InvenSense Inc3▲ new entrant
Lovely Professional University1▲ new entrant
Beijing Yundahuakai Technology Co., Ltd.1▲ new entrant
Source: PatSnap Eureka. Player profiles are derived from applicant ranking, technology focus, and filing momentum evidence.Explore players →
Adjacent Branches

Under-served routes worth watching in MEMS accelerometer pressure sensing

Several IPC branches appear in the corpus at low counts relative to the dominant G01P class. These are observations of relative sparsity; the two below also carry plausible technical rationale and a visible entry path.

G01C · Navigation and gyroscopes

G01C (distance, navigation, and gyroscopes) appears with only 2 patent records and a 5% share among the ranked branches, yet inertial navigation systems are a natural pairing with MEMS accelerometer pressure sensors in drone, autonomous vehicle, and wearable applications. Beijing Andaweier Technology is the sole identifiable filer here. An entrant combining MEMS accelerometer and barometric pressure data for altitude-aided dead-reckoning navigation could build a differentiated position with limited prior-art competition in this specific intersection.

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G01D · General measurement and recording

G01D (measuring, general, and recording) holds 2 patent records at a 5% share, with Beijing Yundahuakai Technology as the primary filer. Multi-parameter data-logging devices that simultaneously record acceleration, pressure, and environmental signals for industrial condition monitoring represent a plausible extension. The branch’s sparsity combined with growing demand for predictive-maintenance sensor nodes in manufacturing and infrastructure suggests it could support novel filings, though the small corpus size means this observation should be validated with a broader prior-art search before committing R&D resources.

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Unlock the full white-space map
PatSnap Eureka’s full analysis maps all IPC branch gaps, co-citation clusters, and claim-level white space across the MEMS accelerometer pressure sensor corpus.
B81B · Microstructural devices (MEMS)G01V · Geophysics and gravity surveying+ more
Unlock full analysis →
Source: PatSnap Eureka. Adjacent branch observations are based on IPC branch counts and shares within the ranked patent records corpus.Explore emerging →
Route Matrix

How leading filers differ by technology route

Strength of each leader across the main technology routes.

PlayerG01P 15 · Velocity & accelerationB63C 9 · Launching & salvaging vesselsB81B 7 · Microstructural devices (MEMS)G01B 21 · Measuring length & dimensionsG01L 19 · Force & pressure measurement
InvenSense IncStrong · 3AbsentStrong · 3Strong · 3Strong · 3
Shanghai Jiao Tong UniversityStrong · 2AbsentAbsentAbsentAbsent
Suzhou Zhonghong Weiyu Technology Co., Ltd.AbsentStrong · 2AbsentAbsentAbsent
Galgotias UniversityStrong · 1AbsentAbsentAbsentAbsent
Beijing Yundahuakai Technology Co., Ltd.Strong · 1AbsentAbsentAbsentAbsent
Lovely Professional UniversityStrong · 1AbsentAbsentAbsentAbsent
Yang HongyuanAbsentStrong · 1AbsentAbsentAbsent
Source: PatSnap Eureka. Matrix values are measured in patent records and should not be compared directly with family-level applicant totals.Compare in Eureka →
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Disclaimer. This page is generated from PatSnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. PatSnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

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