MEMS Accelerometer Wafer Mass Production Patent Snapshot
The indexed corpus for MEMS accelerometer wafer mass production is extremely small, with a highly concentrated applicant field dominated by Delco Electronics Corporation. Filing activity is effectively dormant across the observed window, suggesting this precise intersection of wafer-level mass production and MEMS accelerometry remains a narrow, under-patented niche.
Delco Electronics leads a heavily concentrated, minimal-volume niche
Delco Electronics Corporation holds the top-ranked position with 2 patent records, ahead of a group of individual inventors and Delphi Technologies Inc., each credited with 1 patent record. The field is unusually thin for an active manufacturing domain.
The top five filers account for 86% of the combined total among the ranked applicants visible in this query, an extreme concentration ratio that reflects the near-absence of broad competitive filing rather than true market dominance in the commercial sense.
| # | Applicant | Patent records | Share |
|---|---|---|---|
| 1 | Delco Electronics Corporation | 2 | |
| 2 | Deng Ken Kan | 1 | |
| 3 | S Sundar | 1 | |
| 4 | Delphi Technologies Inc. | 1 | |
| 5 | Thangadurai N | 1 | |
| 6 | K Gopalakrishna | 1 |
The positions of Delco Electronics Corporation and Delphi Technologies Inc. — two historically related automotive electronics entities — suggest that early patent activity in this intersection was largely driven by automotive inertial sensing programs rather than dedicated semiconductor foundry players.
The corpus is very small, and any interpretation should account for the possibility that relevant filings are indexed under related but distinct query terms not captured here. Longer-window growth, applicant concentration, and technology-route coverage are therefore more reliable signals than the latest-year bar alone.
Filing activity is dormant; MEMS device and sensing classes dominate the technology mix
The annual trend and technology composition charts together reveal a field with a single year of recorded activity and a technology mix anchored in core MEMS device and acceleration-sensing classes.
Annual filing trend
All recorded filing activity falls in 2018, with zero records in every other year from 2017 through 2026. The most recent 18–24 months are subject to publication lag, but the extended run of zero filings prior to that window indicates genuine dormancy rather than a data artifact.
↗ Hover for values · click a bar to ask EurekaTechnology composition
B81B (Microstructural devices / MEMS) and G01P (Velocity and acceleration measurement) each carry 4 patent records, making them co-visible branches. H05K (Printed circuits and assemblies) follows with 3 records. B81C (MEMS manufacturing) and B82Y (Nanotechnology applications) each appear in only 1 record, flagging them as the sparsest branches within this scope.
↗ Hover for values · click a bar to ask EurekaHighly cited patent families surfaced by the query
Citation-heavy patent families returned by the query. Use this section as citation context, not as a curated list of the most topic-specific patents.
Single chip piezoelectric triaxial MEMS accelerome…
The present invention is directed to a sensing structure comprising four components: a central block proof mass, a continuous belt-shaped membrane (or one having another suitable shape), a piezoelectric sensing layer placed on top of the membrane, and a fixed mounting frame. Electrodes are attached to the top and the underside of the piezoelectric sensing… (excerpt from the patent abstract)
| # | Patent | Citations |
|---|---|---|
| 1 | Hybrid accelerometer assembly | 56 |
| 2 | Accelerometer assembly with evaluation circuit | 26 |
| 3 | Single chip piezoelectric triaxial MEMS accelerome… | 22 |
Ranked by total forward citations. Citation counts favour older and broadly cited patent families, and broad or adjacent patents may appear when they match the search scope. Treat this section as citation context, not as a curated list of the most topic-specific patents. Some patent titles may be shown in their original, non-English language where an accurate translation could not be guaranteed.
Assignee snapshot from the current evidence set
The applicants below are visible in this query result. Because the evidence set is relatively small, read this section as a directional snapshot rather than a full competitive ranking.
Delco Electronics Corporation
Delco Electronics Corporation holds 2 patent records, the highest count in this scope. Its technology emphasis spans B81B (Microstructural devices / MEMS), G01P (Velocity and acceleration), covering both the device structure and sensing performance dimensions of MEMS accelerometry. No momentum data is available for this applicant in the evidence, so trajectory cannot be quantified.
patent records: 2Delphi Technologies Inc.
Delphi Technologies Inc. holds 1 patent record in this scope. Given its historical relationship with Delco Electronics Corporation in the automotive electronics supply chain, its presence reinforces the automotive-heritage character of the corpus. No applicant momentum data is available in the evidence.
patent records: 1Frequently asked questions
Delco Electronics Corporation is the top-ranked filer in the indexed corpus with 2 patent records, followed by Delphi Technologies Inc. and several individual inventors each holding 1 patent record.
Filing activity in the indexed corpus is effectively dormant. A single filing was recorded in 2018, with zero records in all other years from 2017 through 2026. The most recent 18–24 months are subject to publication lag, but the broader pattern indicates very low activity.
B81B (Microstructural devices / MEMS) and G01P (Velocity and acceleration measurement) are co-visible with 4 patent records each. H05K (Printed circuits and assemblies) follows with 3 records. B81C (MEMS manufacturing) and B82Y (Nanotechnology applications) each appear in only 1 record.
Patent records appear in Europe (EPO) with 2 records, the United States with 2 records, and India with 1 record. Major MEMS manufacturing jurisdictions including China, Japan, South Korea, and Taiwan are absent from the indexed corpus.
No co-applicant or joint-filing activity is detected in the indexed corpus. All filers appear to have filed independently, with individual inventors operating separately from institutional applicants.
The most-cited work identified in the evidence covers a hybrid accelerometer assembly (56 citations), an accelerometer assembly with evaluation circuit (26 citations), and a single-chip piezoelectric triaxial MEMS accelerometer (22 citations). These represent the foundational reference documents within this indexed scope.
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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
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