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MEMS Accelerometers Patents: Top Companies & Filing Trends 2026

MEMS Accelerometers Patents: Top Companies & Filing Trends 2026
https://www.patsnap.com/resources/blog/rd-blog/mems-accelerometers-patent-landscape/ · Patsnap · data cut-off 2026-07-31 · downloaded from the live page
Patent Landscape · Sensors & Actuators
MEMS Accelerometer Patents: Who Leads and Where Filing Has Slowed
  • 56.3% concentration. The top 5 assignees account for 80 of the 142 records in scope — more than half the field sits with a handful of filers.
  • Filing peaked in 2017. Annual filings hit 12 that year and have trended down since, with the midpoint year 2022 at only 6.
  • Claims cluster in one subclass. 99.3% of records carry a G01P velocity-and-acceleration classification, leaving MEMS manufacturing (B81C, 7.0%) and semiconductor integration comparatively thin.
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142
Published Records
56%
Top-5 Share of All Records
-55%
3-Yr Growth (lag-adjusted)
US
Leading Jurisdiction
Published byPatsnap Research··6 min readSourced from Patsnap Eureka
Overview

What the MEMS accelerometer patent record shows

MEMS accelerometers sit at the intersection of mechanical sensing and semiconductor fabrication, and the patent record reflects that split. The search underlying this landscape combines device-level claim language — noise density, offset drift over temperature, shock survivability, bandwidth, and package stress — with the core IPC classes for velocity and acceleration sensing, microstructural devices, and gyroscope-adjacent navigation art. That combination surfaces 142 published records dated between 2015 and the 2026 data cut-off.

Filing intensity is not evenly spread across the coverage window. Publication figures for the most recent one to two years understate real filing activity, since patent applications typically publish around 18 months after they are filed — a lag worth remembering when reading the tail end of any trend line here.

Filing activity and technology composition, 2015–2026
  1. 1ATLANTIC INERTIAL SYST LTD41
  2. 2ANALOG DEVICES INC13
  3. 3KIONIX INC12
  4. 4THE RGT UNIV OF MICHIGAN7
  5. 5TEXAS INSTRUMENTS INC7
  6. 6HONEYWELL INTERNATIONAL INC5
  7. 7STMICROELECTRONICS SRL4
  8. 8ROSEMOUNT AEROSPACE INC4
  9. 9SIMMONDS PRECISION PRODUCTS INC4
  10. 10INVENSENSE INC4
Source: Patsnap Eureka. Assignee ranking and totals. Derived from a Patsnap search on MEMS Accelerometers covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
Data

Filing trend and technology composition

Two views of the same 142 records: how filing volume has moved year over year, and which IPC subclasses the claims actually sit in.

Filings rose to a 2017 peak, then eased

Annual filings reached 12 in 2017, the high point of the window tracked here. By the 2022 midpoint, annual output had fallen to 6, and the curve continues to soften toward the present — consistent with a technology area where core claim territory was staked out early rather than one still in a filing surge.

Filings rose to a 2017 peak, then eased0369121220172018201920202021202220232024202502026Most recent year is partial — publication lag means later filings are not yet visible.

Claims concentrate in velocity and acceleration sensing

G01P (velocity and acceleration measurement) appears on 99.3% of the 142 records, which is expected given the search scope. The more informative split is beneath it: B81B microstructural-device claims reach 19.0% of records, H10D semiconductor-device claims 12.7%, and B81C MEMS manufacturing process claims only 7.0% — a noticeably thinner layer than the device-level claims sitting above it.

Claims concentrate in velocity and acceleration sensingG01P · Velocity & acceleration14199.3%B81B · Microstructural devices (MEMS)2719.0%H10D · Semiconductor devices (general)1812.7%B81C · MEMS manufacturing107.0%G01C · Distance, navigation & gyrosco…107.0%H10P107.0%H01L · Semiconductor devices85.6%G01L · Force & pressure measurement74.9%Other3826.8%

Shares are the percentage of the 142 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.

Source: Patsnap Eureka. Filing trend and technology composition. Derived from a Patsnap search on MEMS Accelerometers covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.

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Key Patents

Most-cited records and a representative recent filing

Representative recent filing
US20220033254A12022-02-03

US20220033254A1 — Wide bandwidth MEMS accelerometer for detecting vibrations

STMICROELECTRONICS S.R.L.

A MEMS accelerometer includes a supporting structure, at least one deformable group and one second deformable group, which include, respectively, a first deformable cantilever element and a second deformable cantilever element, which each have a respective first end, which is fixed to the supporting structure, and a respective second end. The first and second deformable groups further include, respectively, a first piezoelectric detection structure and a second piezoelectric detection structure. The MEMS accelerometer further includes a first mobile mass and a second mobile mass, which are fixed, respectively, to the second ends of the first and second deformable cantilever elements.Filed by STMicroelectronics S.R.L., published 2022-02-03.

US20220033254A1 — patent drawing 1US20220033254A1 — patent drawing 2
View full record
Highest-cited records in the dataset
#Publication no.Patent titleCitations
1US6199874B1Microelectromechanical accelerometer for automotive applications298
2US6170332B1Micromechanical accelerometer for automotive applications239
3US6149190AMicromechanical accelerometer for automotive applications183
4US20070119252A1Tri-axis accelerometer91
5US6167757B1Single-side microelectromechanical capacitive accelerometer and method of making same51
6US6966225B1Capacitive accelerometer with liquid dielectric46
7US8079262B2Pendulous accelerometer with balanced gas damping44
8US20150276407A1Multi-axis integrated inertial sensing device40
9US20090107238A1Pendulous accelerometer with balanced gas damping39
10US7430909B2Tri-axis accelerometer38

Citation counts favour older records simply because they have had longer to accumulate them; read this table as a map of influence within the searched corpus, not as a ranking of current technical importance.

Each row carries its publication number; clicking a row searches Eureka by that number.

Source: Patsnap Eureka. Citation counts and representative records. Derived from a Patsnap search on MEMS Accelerometers covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
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Insights

What the numbers mean for a filing decision

Three read-outs from the same dataset, each pointing at a different practical question: who owns the crowded ground, when the crowded ground was staked out, and where the claim space is thinner.

Concentration
56.3%
of 142 records held by top 5

Half the field sits with five filers

The top 5 assignees combined account for 80 of the 142 records in scope, and the top 10 extend that to 71.1% (101 records). New entrants filing on core capacitive-sensing or shock-survivability claims are filing into ground already dense with prior art from a small group of established players.

Source: assignee ranking, 142 records
Timing
2017
peak filing year

The filing curve has already crested

Annual filings peaked at 12 in 2017 and had fallen to 6 by the 2022 midpoint, with the trend continuing to soften. That pattern is more consistent with a maturing claim landscape than an emerging one — most of the foundational architecture claims were filed years ago.

Source: filing trend, 2017–2026
Composition
7.0%
of records classed in B81C (MEMS manufacturing)

Manufacturing-process claims are thin relative to device claims

Device-level classification (G01P, B81B) covers most of the dataset, but the manufacturing-process class B81C sits at just 7.0% of the 142 records — the same share as G01C navigation-adjacent claims. That gap is a candidate area for process-side claims rather than device architecture.

Source: IPC composition, 142 records
Eureka AI Agent
Looking for what nobody has claimed yet?

Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to mems accelerometers, with the prior art for and against each one.

Find the white space →
Source: Patsnap Eureka. Co-assignee relationships and derived observations. Derived from a Patsnap search on MEMS Accelerometers covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
Players

Who holds the ground, and who is still moving

The ranked leaders span automotive-grade sensor houses, semiconductor majors and aerospace-instrumentation specialists. Recent-year filing activity across the leading assignees has gone quiet — a pattern worth checking before assuming any one of them is still actively expanding this portfolio.

Leader
41
records

One filer well ahead of the field

The top-ranked assignee holds 41 records, more than five times the fifth-place holder's 7 — a gap wide enough to suggest a long-standing, deliberately built portfolio rather than opportunistic filing.

Source: assignee ranking
Mid-field
7
records at fifth place

A tighter cluster below the leader

From fifth place down, record counts compress quickly — fifth place holds 7, tenth place holds 4 — meaning the competitive question below the top of the table is less about a single winner and more about a cluster of similarly sized filers.

Source: assignee ranking
Momentum
0
records in the latest year, leading assignees

Leading filers show no latest-year output

Every one of the assignees with visible recent-year momentum data shows 0 records in the latest tracked year. Given the roughly 18-month publication lag, this understates real current activity, but it also means recent competitive signal from public filings alone is limited right now.

Source: recent-year momentum by assignee
🔍
Under-claimed branches worth a closer look
Sub-areas where the IPC composition data shows comparatively thin coverage relative to the core device claims.
MEMS wafer-bonding process claimspackage-stress compensation circuitrytemperature-drift self-calibration methodspiezoelectric cantilever detection structuresmulti-axis navigation-grade integration (G01C overlap)
Rank all filers by momentum →
Recent-year filing momentum by assignee
AssigneeRecent yearYoY
Atlantic Inertial Systems Ltd0
Kionix Inc0
Analog Devices Inc0
The Regents of the University of Michigan0
Texas Instruments Inc0
Honeywell International Inc0
Simmonds Precision Products Inc0
Rosemount Aerospace Inc0
Source: Patsnap Eureka. Assignee-level momentum. Derived from a Patsnap search on MEMS Accelerometers covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
What's Next

Where to take this next

The landscape data points to specific next steps depending on whether the goal is freedom-to-operate, licensing, or new filing strategy.

Map claim scope against the top holders

With 56.3% of records held by five assignees, a freedom-to-operate review should start there rather than across the full ranked list.

Explore assignee claim scope in Eureka

Test the under-claimed branches

B81C manufacturing-process and G01C navigation-integration claims sit well below device-level coverage — a lower-density area for a first-mover filing.

Run a white-space search in Eureka

Verify recent activity beyond publication lag

Zero latest-year output across leading assignees may reflect the 18-month publication lag rather than reduced R&D — worth confirming against non-patent signals.

Track live filing activity in Eureka
Source: Patsnap Eureka. Forward-looking reading of the same dataset. Derived from a Patsnap search on MEMS Accelerometers covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
FAQ

Frequently asked questions

Answers are grounded in the same dataset. Derived from a Patsnap search on MEMS Accelerometers covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company’s registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.

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