Across this 3,591-record corpus, the ranked leader holds 159 records, but no single company dominates the field: the top 5 assignees combined account for only 19.3% of all records in scope, and the top 10 combined reach 32.2%. The ranking covers 100 companies, so it should be read as a broad field map rather than a short list of dominant players. Names span medical imaging and surgical navigation firms alongside semiconductor and automotive-sensor suppliers, reflecting how widely MEMS sensing has been embedded into other product categories.

Filing peaked in 2018 at 257 records and has pulled back since; the most recent fully comparable window, 2021 to 2024, shows a 29% decline from 212 to 150. Figures for 2025 and 2026 currently look lower still, but that is expected: publication lags filing by roughly 18 months, so the newest years are always undercounted at the point of measurement. A fair read is a cooling trend through 2024, with the last two years not yet settled.

A61B, the diagnosis-and-surgery class, appears on 28.5% of all 3,591 records, making it the single largest category by a wide margin. B81B, the microstructural-devices class most directly associated with MEMS fabrication, sits at 8.5%, on par with G01N material testing, G01S positioning and H01L semiconductor devices. This spread indicates that most MEMS and NEMS claims in this corpus describe sensing components embedded in larger systems, particularly medical devices, rather than standalone MEMS hardware.

Relative to the density in A61B and the broader host classes, sub-areas like shared-cavity multi-transducer packaging, NEMS-scale resonant sensing, and calibration routines for multi-sensor fusion carry comparatively thinner direct claim coverage. That does not mean these areas are unclaimed, but that filing density is lower than in the dominant medical and semiconductor classes, which is where a first claim is more likely to find open space. Any specific design should still be checked against the relevant assignees' full portfolios before relying on apparent white space.

US20150125003A1, assigned to Infineon Technologies AG and filed 2015-05-07, claims a MEMS device with two transducer elements on a shared semiconductor substrate connected to a single acoustically coupled cavity. The specificity of that arrangement — two elements, one shared cavity, acoustic coupling — means it blocks that particular structural configuration rather than dual-transducer MEMS designs generally. Designs using separate cavities per transducer, or coupling mechanisms other than acoustic, would sit outside its literal claim scope, though a full freedom-to-operate review should check the granted claim language directly rather than the abstract.