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Run your analysis now →https://www.patsnap.com/resources/blog/rd-blog/mems-and-nems-resonant-mems-gyroscopes-patent-landscape-patent-landscape/ · Patsnap · data cut-off 2026-07-31 · downloaded from the live page
Patent Landscape · MEMS & NEMSResonant MEMS gyroscope patents: who leads, where filings are heading, and what's still open
- Top-heavy field. The five leading assignees hold 50.7% of all 1,736 records in scope, and the leading ten hold 61.9% — a small group has occupied most of the core claim space.
- Filing has cooled from its peak. Filings peaked at 112 in 2018; over the most recent complete three-year span, 2021 to 2024, filings fell 42%, from 67 to 39.
- Navigation and MEMS structure classes dominate. G01C (navigation/gyroscopes) appears on 51.4% of records and B81B (MEMS microstructures) on 34.5%, showing the claim density sits at the intersection of sensing and micro-fabrication.
1,736
Published Records
51%
Top-5 Share of All Records
-42%
Filing Growth 2021→2024
US
Leading Jurisdiction
Filing growth compares 2021 (67 records) with 2024 (39) — a three-year span. 2024 is the most recent year we treat as complete: publication lags filing by roughly 18 months, so 2025 onwards are still filling in and any growth rate that ends there would understate the field. Top-5 share is the combined record count of the five largest assignees divided by all 1,736 records in scope (CR5), not by the ranked leaders only.
Published byPatsnap Research··7 min readSourced from Patsnap Eureka
Overview
What this landscape covers
Resonant MEMS gyroscopes sit at the intersection of inertial navigation and micro-fabrication: a vibrating proof mass, driven electrostatically or piezoelectrically, whose Coriolis-induced motion is sensed to measure rotation rate. This landscape covers 1,736 published records filed or published between 2015 and mid-2026, spanning device architecture, drive and sense electronics, quadrature and bias-error correction, and the wafer-level packaging that determines yield and cost at scale.
Because publication lags filing by roughly 18 months, the last one to two years in any trend chart are still filling in — treat 2025 and 2026 figures as provisional rather than a real slowdown.
Filing activity and technology composition, 2015–2026
Source: Patsnap Eureka. Assignee ranking and totals. Derived from a Patsnap search on MEMS & NEMS — Resonant MEMS Gyroscopes Patent Landscape covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
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The data
Filing trend and technology mix
Two views of the same 1,736-record corpus: filing activity by year, and the IPC subclasses those records carry.
Filings peaked in 2018, then declined through the last complete year
Filings ran from 92 in 2017 to a peak of 112 in 2018. Over the most recent three-year span that can be treated as complete, 2021 to 2024, filings fell 42%, from 67 to 39. Later years in the dataset (2025-2026) are undercounted due to publication lag and should not be read as a continuation of that decline.
Claim density concentrates in navigation and MEMS structure classes
G01C (distance, navigation and gyroscopes) appears on 51.4% of the 1,736 records, followed by B81B (MEMS microstructural devices) at 34.5% and G01P (velocity and acceleration) at 23.3%. Manufacturing-specific class B81C reaches 19.4%, and semiconductor-device classes H01L, H10P, H10N and H10D each sit below 13%, marking the fabrication and integration side of the field as comparatively less crowded than the core sensing architecture.
Shares are the percentage of the 1,736 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.
Source: Patsnap Eureka. Filing trend and technology composition. Derived from a Patsnap search on MEMS & NEMS — Resonant MEMS Gyroscopes Patent Landscape covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.
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A representative claim and the most-cited prior art
Representative record
US10060757B2 — MEMS device quadrature shift cancellation
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
This document provides apparatus and methods for cancelation of quadrature error from a micro-electromechanical system (MEMS) device, such as a MEMS gyroscope. In certain examples, a quadrature correction apparatus can include a drive charge-to-voltage (C2V) converter configured to provide drive information of a proof mass of a MEMS gyroscope, a sense C2V converter configured to provide sense information of the proof mass, a phase-shift module configured to provide phase shift information of the drive information, a drive demodulator configured to receive the drive information and the phase shift information and to provide demodulated drive information, a sense demodulator configured to receive corresponding information and produce corrected sense output.Filed by Semiconductor Components Industries, LLC (2018-08-28) — quadrature error correction is one of the few electronics-side sub-problems with a granted claim of this specificity in the corpus.
Most-cited records in this corpus
| # | Publication no. | Patent title | Citations |
|---|---|---|---|
| 1 | US20150201918A1 | Surgical Handpiece | 1,097 |
| 2 | US20030217915A1 | Fabrication of microstructures with vacuum-sealed cavity | 583 |
| 3 | US6315062B1 | Horizontal directional drilling machine employing inertial navigation control system and method | 373 |
| 4 | US20100193884A1 | Method of Fabricating High Aspect Ratio Transducer Using Metal Compression Bonding | 317 |
| 5 | US6635509B1 | Wafer-level MEMS packaging | 317 |
| 6 | US7219033B2 | Single/multiple axes six degrees of freedom (6 DOF) inertial motion capture system with initial orientation d… | 238 |
| 7 | US9656852B2 | CMOS-MEMS device structure, bonding mesa structure and associated method | 236 |
| 8 | US9368429B2 | Interposer for hermetic sealing of sensor chips and for their integration with integrated circuit chips | 230 |
| 9 | US8250921B2 | Integrated motion processing unit (MPU) with MEMS inertial sensing and embedded digital electronics | 214 |
| 10 | US20090007661A1 | Integrated Motion Processing Unit (MPU) With MEMS Inertial Sensing And Embedded Digital Electronics | 203 |
Citation counts favour older records simply by virtue of time in the corpus; treat them as a signal of influence, not of current technical relevance.
Each row carries its publication number; clicking a row searches Eureka by that number.
Source: Patsnap Eureka. Citation counts and representative records. Derived from a Patsnap search on MEMS & NEMS — Resonant MEMS Gyroscopes Patent Landscape covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
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What the numbers mean for a filing decision
Three read-outs from the concentration, trend and citation data, aimed at where to file next rather than where the field has already been.
Concentration
50.7% / 5 assignees
share of 1,736 records
The core architecture is largely claimed
With half of all records held by five assignees and nearly two-thirds by ten, new entrants filing on core drive-sense architecture are filing into dense prior art rather than open space. The leader alone accounts for 256 records.
Top 5 = 880 of 1,736 records
Filing momentum
-42% (2021→2024)
three-year filing change
Activity has pulled back from its 2018 peak
After peaking at 112 filings in 2018, volume declined to 39 by 2024. That is a real pullback in the last complete years of data, not an artefact of publication lag, and it suggests the mainstream architecture space is maturing rather than expanding.
Peak year 2018: 112 filings
Technology mix
51.4% G01C
share of 1,736 records
Sensing architecture outweighs fabrication claims
Navigation and gyroscope classification (G01C) and MEMS structural classification (B81B) dominate the corpus, while manufacturing-specific claims (B81C, 19.4%) and semiconductor integration classes (H01L, H10P, H10N, H10D, each under 13%) are comparatively lighter — a sign that packaging and fabrication method claims remain less contested than device architecture.
B81B manufacturing overlap: 34.5% vs 19.4%
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Co-filing is limited and concentrated around a few inventor pairs
| Assignee | Co-assignee | Shared families |
|---|---|---|
| Honeywell International Inc. | DCAMP JON B | 6 |
| Honeywell International Inc. | CURTIS HARLAN L | 6 |
| Robert Bosch GmbH | EZEKWE CHINWUBA D | 5 |
| Honeywell International Inc. | DUNAWAY LORI A | 4 |
| Analog Devices, Inc. | JUDY MICHAEL W | 4 |
| Analog Devices, Inc. | JOHARI GALLE HOURI | 4 |
| Analog Devices, Inc. | HARNEY KIERAN P | 4 |
| Analog Devices, Inc. | GEEN JOHN A | 4 |
Only 10 co-assignee pairs appear in the corpus, and the strongest pairings sit within single organisations rather than across companies — this is a field of solo filers more than joint ventures.
Source: Patsnap Eureka. Co-assignee relationships and derived observations. Derived from a Patsnap search on MEMS & NEMS — Resonant MEMS Gyroscopes Patent Landscape covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
Players
Who is filing, and who has slowed down
The ranking covers 100 companies returned by the data endpoint — not a curated top-50 or top-100 — and recent-year momentum shows most of the historically active names filing little to nothing in the latest tracked year.
Leader
256 records
of 1,736 in scope
One assignee holds nearly 15% of the field on its own
The leading assignee's 256 records sit well ahead of fifth place (73) and tenth place (32), a gap that marks a genuine scale advantage in filed claims rather than a statistical artefact of the ranking method.
5th place: 73 · 10th place: 32
Momentum
0% to -100% YoY
recent-year filing change
Even leading filers have gone quiet in the latest year
Several historically active assignees recorded zero or near-zero filings in the latest tracked year, with year-over-year changes as steep as -100% for some. This is consistent with the broader three-year decline rather than isolated to any one company, though publication lag means the very latest year understates true activity.
Latest-year filings mostly 0-2 per assignee
Geography
900 US filings
of receiving offices tracked
Filing is concentrated in the US, with EPO and PCT as secondary routes
The United States receives the largest share of filings (900), ahead of the European Patent Office (305) and WIPO/PCT (190). Germany, Austria and Australia each register in the double digits, suggesting protection strategy is US-anchored with selective European and PCT coverage.
EPO 305 · PCT 190 · Germany 98
Recent-year filing momentum by assignee
| Assignee | Recent year | YoY |
|---|---|---|
| Murata Manufacturing Co., Ltd. | 2 | 0% |
| InvenSense, Inc. | 1 | -83% |
| Honeywell International Inc. | 0 | — |
| Analog Devices, Inc. | 0 | -100% |
| Taiwan Semiconductor Manufacturing Co., Ltd. | 0 | -100% |
| Fairchild Semiconductor Corporation | 0 | — |
| STMicroelectronics S.r.l. | 0 | — |
| Robert Bosch GmbH | 0 | -100% |
Source: Patsnap Eureka. Assignee-level momentum. Derived from a Patsnap search on MEMS & NEMS — Resonant MEMS Gyroscopes Patent Landscape covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
What's next
Where to take this analysis
The dataset points to a field with an occupied core and a thinning frontier. These are the natural next steps for turning that into a filing or freedom-to-operate decision.
Map claims against the leader's 256-record portfolio
Before filing on core drive-sense architecture, check claim scope against the portfolio holding 256 of the 1,736 records — the density there is the single biggest freedom-to-operate risk in this landscape.
Explore assignee portfolios in EurekaTest the under-claimed branches for real white space
Packaging, high-aspect-ratio fabrication and quadrature correction show visibly lighter filing density than core sensing architecture — verify whether that holds at claim-level before committing R&D budget.
Run a white space search in EurekaRe-check the 2025-2026 trend once publication catches up
The apparent decline through 2024 is real, but the last one to two years are still filling in. Revisit filing volume in six to twelve months before concluding the field is contracting further.
Set a trend alert in EurekaSource: Patsnap Eureka. Forward-looking reading of the same dataset. Derived from a Patsnap search on MEMS & NEMS — Resonant MEMS Gyroscopes Patent Landscape covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
FAQ
Common questions on resonant MEMS gyroscope patents
The corpus of 1,736 records is led by a single assignee holding 256 records, well ahead of the fifth-ranked assignee at 73 and tenth-ranked at 32. The five leading assignees together account for 50.7% of all records, and the leading ten account for 61.9%. This is a concentrated field: a small number of established sensor and semiconductor companies hold the majority of the filed claim space, and new entrants should expect dense prior art around core drive-sense architecture.
Filing activity peaked at 112 in 2018 and, over the most recent three-year span that can be treated as complete (2021 to 2024), fell 42% from 67 to 39 filings. That is a genuine pullback, not a rounding effect. Figures for 2025 and 2026 are still incomplete because publication typically lags filing by around 18 months, so the true trajectory of the most recent two years will not be clear for some time yet.
Records in this corpus most commonly carry IPC classification G01C (distance, navigation and gyroscopes), present on 51.4% of the 1,736 records, followed by B81B (MEMS microstructural devices) at 34.5% and G01P (velocity and acceleration measurement) at 23.3%. Manufacturing-specific classification B81C appears on 19.4%, while semiconductor-device classes such as H01L, H10P, H10N and H10D each sit below 13%. Because a single record can carry multiple classes, these figures overlap rather than sum to 100%.
The technology composition data shows fabrication and packaging classes carrying noticeably lighter filing density than core sensing-architecture classes: B81C manufacturing sits at 19.4% versus B81B structural claims at 34.5%, and semiconductor integration classes such as H10N and H10D sit under 5% each. Sub-areas like wafer-level vacuum packaging, metal compression bonding for high-aspect-ratio transducers, and quadrature/bias-error correction circuitry show comparatively less claim density than the core proof-mass drive-sense mechanism. Any white-space claim should still be checked against the specific patents in those classes before committing to a filing strategy.
Not directly. High filing density in a class such as G01C or B81B indicates that claim space is occupied, not that the underlying approach is commercially superior or technically mature. Citation counts inside this corpus also skew toward older records simply because they have had more time to accumulate citations, so a highly-cited record from the early 2000s reflects historical influence rather than current commercial traction. Commercial viability needs to be assessed against product shipment and design-win data separately from the patent count.
Answers are grounded in the same dataset. Derived from a Patsnap search on MEMS & NEMS — Resonant MEMS Gyroscopes Patent Landscape covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.
Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company's registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.