MEMS Resonator Patents: Who Leads, Where the Gaps Are 2026
Temperature-Compensated MEMS Resonator Patents: Filing Trends and Where the Field Is Still Open
31.4% of all 1,257 records sit with just five assignees, but the next tier down thins out fast — a long tail of single- and few-filing entrants fills the remaining ranking. Volume ran from 61 in the 2017 peak down to a stable mid-30s band by the early 2020s. Over the three complete years 2021-2024, filings moved from 36 to 33 — an 8% pullback rather than a collapse. Years beyond 2024 in the chart are undercounted because of publication lag and should not be read as a further drop.
- 1SITIME CORP149
- 2NXP BV77
- 3MURATA MFG CO LTD76
- 4STATHERA IP HOLDING INC51
- 5QORVO US INC42
See the full mems & nems — temperature-compensated mems resonators patent landscape analysis in Eureka
- The complete ranking, not just the top five
- Every IPC branch with its share of the corpus
- The most-cited records, and where claim space is still thin
Common questions about this landscape
Who holds the most patents in temperature-compensated MEMS resonators?
One assignee leads the ranking with 149 records, noticeably ahead of the fifth-ranked assignee at 42 and the tenth-ranked at 27. That gap suggests an early and sustained filing strategy rather than a recent surge. Below the top few positions, holdings tighten considerably, so the field is best described as having one clear leader followed by a competitive mid-tier rather than a flat distribution.
Is patent filing in this space growing or shrinking?
Over the three most recent complete years, 2021 to 2024, filings moved from 36 to 33 records, an 8% decline rather than a sharp drop. Filing peaked earlier, in 2017, at 61 records. Because published records lag actual filing dates by roughly 18 months, the years closest to the 2026 data cut-off will always understate real activity, so treat any apparent recent decline with that caveat rather than reading it as a market signal.
Which patent classes cover the core resonator technology?
H03H, impedance networks and filters, touches 37.2% of the 1,257 records in scope, the largest single share. B81B, microstructural MEMS devices, follows at 25.8%, with H01L semiconductor-device claims at 24.8% and B81C MEMS manufacturing at 20.5%. Because records commonly carry more than one IPC class, these shares overlap rather than sum to 100%, reflecting how filter circuitry, device structure and fabrication process claims frequently appear together in the same filing.
Disclaimer. This analysis is based on Patsnap Eureka data drawn from a limited snapshot of global patent records and is provided for general information and reference only. Patent data carries inherent limitations — recent filings are under-counted because of publication lag, counts may be on a record or family basis, classification and applicant-name data may contain errors or duplicates, and the underlying search query defines the scope shown — so the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing here is an exhaustive prior-art, novelty, freedom-to-operate or validity search, nor does it constitute legal, financial or professional advice, and it should not be relied upon as such. Verify independently and review with qualified patent and legal professionals before acting on it.
Method: Filing trend and technology composition. Derived from a Patsnap search on MEMS & NEMS — Temperature-Compensated MEMS Resonators Patent Landscape covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish. Every share divides by all records in scope. Data: Patsnap Eureka. See the full landscape report.