MEMS Gas Sensor (Standalone) Patent Snapshot 2026
The standalone MEMS gas sensor patent space is a compact, moderately concentrated field where a Chinese micro-scale sensing specialist leads a mixed industrial-academic top tier. Annual volume peaked in 2020 and has since eased, with the United States as the dominant filing jurisdiction.
Hefei Micro Nano leads a fragmented but top-heavy field
Hefei Micro Nano Sensing Technology Co. Ltd. holds the top position, followed closely by Honeywell International, the Electronics & Telecommunications Research Institute, and Infineon Technologies AG, all tied at the second rank. The top five filers account for 39% of the ranked applicants visible in this query’ combined total — a meaningful but not monopolistic concentration.
A three-way tie at second place signals that no single challenger has pulled decisively ahead of the pack. Below the top five, the field disperses rapidly into single-record holders, indicating a long tail of one-time participants rather than a sustained second tier.
| # | Applicant | Patent records | Share |
|---|---|---|---|
| 1 | Hefei Micro Nano Sensing Technology Co. Ltd. | 5 | |
| 2 | Honeywell International Inc. | 4 | |
| 3 | ELECTRONICS & TELECOMM RES INST | 4 | |
| 4 | Infineon Technologies AG | 4 | |
| 5 | Figaro Engineering Inc. | 3 | |
| 6 | Nissha Printing Co. Ltd. | 3 | |
| 7 | Nayoota Inc. | 2 | |
| 8 | HANOI UNIV OF SCI & TECH | 2 | |
| 9 | Korea Electronics Technology Institute | 2 | |
| 10 | NIPPON TELEGRAPH & TELEPHONE CORP | 2 |
| # | Applicant | Patent records | Share |
|---|---|---|---|
| 11 | National Yang Ming Chiao Tung University | 1 | |
| 12 | Park Joon Shik | 1 | |
| 13 | Qisi Semiconductor (Hangzhou) Co. Ltd. | 1 | |
| 14 | Sun Yat-sen University | 1 | |
| 15 | Xi’an Sanhuan Technology Development General | 1 | |
| 16 | Dr. K. Karthikeyan | 1 | |
| 17 | CNPC Tubular Goods Research Institute | 1 | |
| 18 | China National Petroleum Corporation | 1 | |
| 19 | HUAZHONG UNIV OF SCI & TECH | 1 | |
| 20 | Omron Corporation | 1 |
The leaders’ positions suggest that the established sensor and semiconductor incumbents — Honeywell, Infineon — are maintaining a defensive presence, while Hefei Micro Nano’s lead reflects focused, recent entry with concentrated MEMS-specific filings rather than a decades-long portfolio.
The most recent 18–24 months of filings are likely under-counted due to patent publication lag; activity in 2024–2025 should be read as a lower bound. Longer-window growth, applicant concentration, and technology-route coverage are therefore more reliable signals than the latest-year bar alone.
A 2020 peak followed by easing volume; G01N dominates the technology mix
The filing trend reveals a sharp build-up to 2020 and an uneven retreat since, while the technology composition is heavily weighted toward sensing and analysis classification with thin coverage of adjacent fabrication and materials branches.
Annual filing trend
Filings climbed from 1 record in 2017 to a peak of 10 in 2020, then fell sharply before partial recoveries in 2023 and 2025. The post-2020 pattern is irregular rather than a clean decline, and figures for 2024–2025 remain subject to upward revision as publications clear the lag window.
↗ Hover for values · click a bar to ask EurekaTechnology composition
G01N (material analysis and testing) accounts for the visible share of classified records, reflecting the sensor-function focus of most filings. B81B (microstructural MEMS devices) and B81C (MEMS manufacturing) together form the next tier, confirming that fabrication patents are present but secondary. All other branches — including nanotechnology, electric heating circuits, and separation processes — each hold minimal share, pointing to a highly concentrated technology profile.
↗ Hover for values · click a bar to ask EurekaHighly cited patent families surfaced by the query
Citation-heavy patent families returned by the query. Use this section as citation context, not as a curated list of the most topic-specific patents.
MEMS gas sensor mount body
A MEMS gas sensor mount body includes a MEMS gas sensor chip and a printed circuit board. The MEMS gas sensor chip includes a base having a cavity, an insulating film having an opening portion, a gas sensing unit, and a plurality of pads. The printed circuit board includes a gas introduction path, and a plurality of connection terminals. The MEMS gas sensor… (excerpt from the patent abstract)
| # | Patent | Citations |
|---|---|---|
| 1 | Gas sensor and manufacturing method of the same | 18 |
| 2 | Micro gas sensor and manufacturing method thereof | 17 |
| 3 | Micro gas sensor | 17 |
| 4 | Fabricating method for micro gas sensor and the same | 12 |
| 5 | Micro gas sensor | 10 |
| 6 | Fabricating method for micro gas sensor and the same | 6 |
| 7 | 一种MEMS气体传感器和CMOS芯片一体式封装结构及其制备方法 | 4 |
| 8 | Micro-hotplate and MEMS gas sensor | 4 |
Ranked by total forward citations. Citation counts favour older and broadly cited patent families, and broad or adjacent patents may appear when they match the search scope. Treat this section as citation context, not as a curated list of the most topic-specific patents. Some patent titles may be shown in their original, non-English language where an accurate translation could not be guaranteed.
Assignee snapshot from the current evidence set
The applicants below are visible in this query result. Because the evidence set is relatively small, read this section as a directional snapshot rather than a full competitive ranking.
Hefei Micro Nano Sensing Technology
Hefei Micro Nano Sensing Technology Co. Ltd. tops the ranking with 5 patent records, concentrating on B81B microstructural MEMS devices, G01N material analysis and testing, and B81C MEMS manufacturing — the broadest fabrication-to-function stack among all filers. The applicant is flagged as a new entrant, indicating its entire portfolio is recent, making it the most rapidly assembled position in the field.
patent records: 5Korea Electronics and Telecommunications Research Institute
The Korea Electronics and Telecommunications Research Institute holds 4 patent records with a focus on G01N material analysis and testing and a minor presence in H01L semiconductor devices. Also flagged as a new entrant, its recent activity signals a deliberate push into standalone MEMS gas sensing from a broader electronics research base, distinguishing it from the industrial incumbents sharing the same rank.
patent records: 4Frequently asked questions
The corpus contains 30 patent families in scope for this landscape.
Hefei Micro Nano Sensing Technology Co. Ltd. leads with 5 patent records, ahead of Honeywell International, the Electronics and Telecommunications Research Institute, and Infineon Technologies AG, each holding 4 records.
The United States is the visible filing jurisdiction, followed by Europe (EPO), China, and Japan. South Korea and India each have a small presence, and PCT filings are minimal, indicating targeted national strategies rather than broad global coverage.
Annual filing volume peaked in 2020 and has eased since, placing the field in a post-peak phase. The most recent 18–24 months of data remain subject to upward revision due to publication lag, so the current low figures for 2024–2025 should be treated as a lower bound.
Nanotechnology applications (B82Y) and electric heating and lighting circuits (H05B) each hold only 2 records, representing thin prior-art coverage relative to their technical importance in MEMS gas sensor design. Separation processes (B01D) and metal compound materials (C01G) hold only 1 record each.
Collaboration is minimal. Only one co-applicant relationship is evidenced: a single jointly filed record between Figaro Engineering and Omron Corporation. Most participants are pursuing independent IP strategies.
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Disclaimer. This page is generated from PatSnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
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