MEMS Gas Sensor (Standalone) Patent Snapshot 2026
The standalone MEMS gas sensor patent corpus is a small, moderately concentrated field in which Hefei Micro Nano Sensing Tech leads by filing volume, with the United States as the dominant grant jurisdiction. Annual filing activity peaked in 2020 and has since eased, placing this field in a declining phase on a recent-window basis, though several new entrants signal continued technical interest.
Hefei Micro Nano leads a fragmented but top-heavy field
Hefei Micro Nano Sensing Tech Co Ltd holds the top position among filers, followed closely by Honeywell International, Electronics & Telecomm Research Institute, and Infineon Technologies AG. The top five filers account for thirty-nine percent of the combined output of the ranked applicants visible in this query, indicating a moderately concentrated but still fragmented visible assignee structure.
The gap between the leader and the next tier is narrow — the top four applicants are separated by only one or two patent records — suggesting no single player has established an overwhelming positional advantage. Below rank five, filings drop to three or fewer records per applicant, confirming a long, thin tail of occasional filers including universities and individual inventors.
| # | Applicant | Patent records | Share |
|---|---|---|---|
| 1 | Hefei Micro Nano Sensing Tech Co Ltd | 5 | |
| 2 | Honeywell International Inc | 4 | |
| 3 | ELECTRONICS & TELECOMM RES INST | 4 | |
| 4 | Infineon Technologies AG | 4 | |
| 5 | Figaro Engineering Inc | 3 | |
| 6 | Nissha Printing Co Ltd | 3 | |
| 7 | Nayoota Inc | 2 | |
| 8 | HANOI UNIV OF SCI & TECH | 2 | |
| 9 | Korea Electronics Technology Institute | 2 | |
| 10 | NIPPON TELEGRAPH & TELEPHONE CORP | 2 |
| # | Applicant | Patent records | Share |
|---|---|---|---|
| 11 | National Yang Ming Chiao Tung University | 1 | |
| 12 | Park Joon Shik | 1 | |
| 13 | Qisi Semiconductor (Hangzhou) Co Ltd | 1 | |
| 14 | Sun Yat-sen University | 1 | |
| 15 | Xian Sanhuan Technology Development General | 1 | |
| 16 | Dr K Karthikeyan | 1 | |
| 17 | CNPC Tubular Goods Research Institute | 1 | |
| 18 | China National Petroleum Corporation | 1 | |
| 19 | HUAZHONG UNIV OF SCI & TECH | 1 | |
| 20 | Omron Corporation | 1 |
This shallow hierarchy means the field remains contestable. An entrant with focused MEMS fabrication or novel sensing-material expertise could establish a credible position without displacing any incumbent outright, provided filing activity is sustained over multiple cycles.
Filings from roughly 2024 onward are subject to publication lag and likely under-represent true recent activity; competitive conclusions should weight earlier cohorts more heavily. Longer-window growth, applicant concentration, and technology-route coverage are therefore more reliable signals than the latest-year bar alone.
A 2020 peak followed by easing volume; G01N analysis dominates the technology mix
The two charts below map how filing activity has evolved year by year and how the IPC technology branches are distributed across the corpus, providing a combined view of timing and technical focus.
Annual filing trend
Annual filings surged to a clear peak in 2020 and have been uneven since. The recent-window growth rate is negative, consistent with a post-peak decline phase. Years 2024 through 2026 should be read as provisional given publication lag — they do not yet reflect the full eventual filing count for those periods.
↗ Hover for values · click a bar to ask EurekaTechnology composition
G01N (material analysis and testing) is by far the visible branch, reflecting the sensing and measurement core of the field. B81B (microstructural MEMS devices) and B81C (MEMS manufacturing) form a secondary cluster. All remaining branches — including nanotechnology, electric heating circuits, and separation processes — hold very small shares, pointing to limited cross-disciplinary diversification in the corpus to date.
↗ Hover for values · click a bar to ask EurekaHighly cited patent families surfaced by the query
Citation-heavy patent families returned by the query. Use this section as citation context, not as a curated list of the most topic-specific patents.
MEMS gas sensor mount body
A MEMS gas sensor mount body includes a MEMS gas sensor chip and a printed circuit board. The MEMS gas sensor chip includes a base having a cavity, an insulating film having an opening portion, a gas sensing unit, and a plurality of pads. The printed circuit board includes a gas introduction path, and a plurality of connection terminals. The MEMS gas sensor… (excerpt from the patent abstract)
| # | Patent | Citations |
|---|---|---|
| 1 | Gas sensor and manufacturing method of the same | 18 |
| 2 | Micro gas sensor and manufacturing method thereof | 17 |
| 3 | Micro gas sensor | 17 |
| 4 | Fabricating method for micro gas sensor and the same | 12 |
| 5 | Micro gas sensor | 10 |
| 6 | Fabricating method for micro gas sensor and the same | 6 |
| 7 | 一种MEMS气体传感器和CMOS芯片一体式封装结构及其制备方法 | 4 |
| 8 | Micro-hotplate and MEMS gas sensor | 4 |
Ranked by total forward citations. Citation counts favour older and broadly cited patent families, and broad or adjacent patents may appear when they match the search scope. Treat this section as citation context, not as a curated list of the most topic-specific patents. Some patent titles may be shown in their original, non-English language where an accurate translation could not be guaranteed.
Assignee snapshot from the current evidence set
The applicants below are visible in this query result. Because the evidence set is relatively small, read this section as a directional snapshot rather than a full competitive ranking.
Hefei Micro Nano Sensing Tech Co Ltd
The current corpus leader with five patent records, Hefei Micro Nano Sensing Tech focuses primarily on B81B microstructural MEMS devices, G01N material analysis and testing, and B81C MEMS manufacturing — a broad but coherent MEMS-fabrication profile. Momentum is flagged as a new entrant (▲ new entrant), indicating all filings have emerged recently from a zero prior base. This trajectory suggests an active, growth-oriented IP program rather than a legacy portfolio.
patent records: 5Korea Electronics Technology Institute
Holding two patent records, Korea Electronics Technology Institute is also classified as a new entrant (▲ new entrant), with a technology emphasis concentrated in G01N material analysis and testing alongside semiconductor device classification H01L. Its academic-industrial positioning and recent entry suggest potential for rapid portfolio scaling, particularly in integration of MEMS sensors with semiconductor read-out circuits.
patent records: 2Frequently asked questions
There are 30 patent families in scope for this landscape. The corpus is relatively small, reflecting a specialized sub-field within the broader MEMS and gas-sensing domains.
Hefei Micro Nano Sensing Tech Co Ltd leads with five patent records, ahead of Honeywell International, Electronics & Telecomm Research Institute, and Infineon Technologies AG, each with four.
Annual filings peaked in 2020 and have eased since, with a recent-window growth rate of negative thirty-six percent. The field is currently in a decline phase on a short-window basis. Note that 2024–2026 data is likely under-counted due to publication lag and should not be interpreted as the final filing count for those years.
The United States leads with fourteen patent records, followed by Europe via the EPO with five, and China and Japan with four each. India and South Korea each hold three records. A comprehensive protection strategy should prioritize the US and EPO, with China and Japan as near-equal secondary targets.
G01N (material analysis and testing) is the visible branch by a wide margin, reflecting the sensing and measurement core of gas detection. B81B (microstructural MEMS devices) and B81C (MEMS manufacturing processes) form a secondary cluster. All other branches, including nanotechnology and electric heating circuits, are sparsely represented.
Evidence shows one documented co-filing relationship: Figaro Engineering and Omron Corporation share one joint filing. No other co-applicant pairs appear in the corpus, indicating that the field is predominantly characterized by proprietary single-applicant development programs.
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Disclaimer. This page is generated from PatSnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
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