MEMS Gyroscope Packaging Patent Snapshot 2026
MEMS gyroscope packaging is a highly concentrated, small-corpus niche where the top two filers together account for the dominant share of activity, with filings peaking in 2021 and easing since. The United States is the primary protection jurisdiction, and the technology mix centers tightly on MEMS device structures and gyroscope navigation classes.
A concentrated niche led by Semicon Components and Samsung Electronics
MEMS gyroscope packaging is a small but sharply concentrated corpus. Semicon Components Ind LLC and Samsung Electronics Co Ltd jointly top the applicant ranking, each with 4 patent records, followed by Shin Sung C&T with 2 patent records. The top five filers collectively account for 92% of the combined total of the ranked applicants visible in this query — an unusually tight concentration for any technology area.
The tier gap is steep: the top two applicants are tied at 4 patent records each, while the third-ranked filer holds 2 and the remaining applicants hold 1 each. This structure means a small number of organizations effectively define the current state of the art.
| # | Applicant | Patent records | Share |
|---|---|---|---|
| 1 | Semicon Components Ind LLC | 4 | |
| 2 | Samsung Electronics Co Ltd | 4 | |
| 3 | SHIN SUNG C&T | 2 | |
| 4 | National University of Defense Technology | 1 | |
| 5 | Beijing Micro-Yuan Era Technology Co Ltd | 1 | |
| 6 | Wuhan Hengjuan Technology Development Co Ltd | 1 |
The positions of the two co-leaders — a U. S.-registered components company and a major Korean electronics conglomerate — suggest that packaging innovation in this space is pursued both by specialist component suppliers and by vertically integrated device makers, each with distinct technology emphases.
Filing counts for the most recent 18–24 months are subject to publication lag and likely understate true activity; absence of records in 2023–2024 should not be read as a definitive end to filing activity. Longer-window growth, applicant concentration, and technology-route coverage are therefore more reliable signals than the latest-year bar alone.
Activity peaked in 2021; MEMS device and navigation classes dominate the technology mix
The filing trend and technology composition charts together reveal a field that saw its highest single-year activity in 2021 and has eased since, with patent protection concentrated in the core MEMS device and navigation IPC classes.
Annual filing trend
Filings were sporadic from 2017 through 2020, with a notable spike in 2021 (3 records) before dropping to zero in 2022–2024 and a single record appearing in 2025. The 2021 peak marks the high-water mark of the observable window. Given typical 18–24 month publication lag, the 2024–2025 period is likely undercounted and should not be interpreted as a definitive cessation of activity.
↗ Hover for values · click a bar to ask EurekaTechnology composition
B81B (Microstructural devices / MEMS) and G01C (Distance, navigation and gyroscopes) each account for the largest share of IPC classifications, with B81C (MEMS manufacturing) close behind. This trio forms the core technical envelope of the corpus. Four additional branches — welding/brazing, glass compositions, coating/surface deposition, and velocity/acceleration sensing — each appear only once, marking the periphery of current activity.
↗ Hover for values · click a bar to ask EurekaHighly cited patent families surfaced by the query
Citation-heavy patent families returned by the query. Use this section as citation context, not as a curated list of the most topic-specific patents.
MEMS-GYROSKOP MIT ERFASSUNGSMODUS MIT 2 FREIHEITSG…
Provided is an MEMS gyroscope, which is resistant against external environmental changes such as a microfabrication process error, a vacuum package process error and a temperature change. The MEMS gyroscope comprises: a frame arranged parallel to a bottom wafer substrate; a sensor mass body excited at one degree of freedom in an excitation mode, and of… (excerpt from the patent abstract)
| # | Patent | Citations |
|---|---|---|
| 1 | Vertical MEMS gyroscope by horizontal driving | 37 |
| 2 | Vertical MEMS gyroscope by horizontal driving and … | 25 |
| 3 | 一种平面化圆片级熔融石英MEMS陀螺仪的制作方法 | 15 |
| 4 | Micromachined multi-axis gyroscopes with reduced s… | 7 |
| 5 | Mems gyroscope and fabrication method thereof | 6 |
Ranked by total forward citations. Citation counts favour older and broadly cited patent families, and broad or adjacent patents may appear when they match the search scope. Treat this section as citation context, not as a curated list of the most topic-specific patents. Some patent titles may be shown in their original, non-English language where an accurate translation could not be guaranteed.
Assignee snapshot from the current evidence set
The applicants below are visible in this query result. Because the evidence set is relatively small, read this section as a directional snapshot rather than a full competitive ranking.
Semicon Components Ind LLC
Semicon Components Ind LLC holds 4 patent records and covers three IPC clusters: B81B (MEMS device structures), B81C (MEMS manufacturing), and G01C (navigation and gyroscopes). This breadth suggests a vertically oriented packaging strategy that spans device design, fabrication process, and sensing function. Applicant momentum data is not available for trajectory assessment.
patent records: 4Samsung Electronics Co Ltd
Samsung Electronics Co Ltd also holds 4 patent records but concentrates entirely within MEMS device subclasses (B81B 3, B81B 5, and B81B 7), with no recorded filings in manufacturing process or navigation sensing classes. This narrower IPC profile points to a device-architecture focus rather than a full-stack packaging approach. Applicant momentum data is not available for trajectory assessment.
patent records: 4Frequently asked questions
The corpus currently contains 7 patent families in scope. This is a small, specialized corpus, which means concentration metrics and trend readings carry more uncertainty than in larger technology areas.
Semicon Components Ind LLC and Samsung Electronics Co Ltd are co-leaders, each holding 4 patent records. Shin Sung C&T ranks third with 2 patent records. Three additional filers — National University of Defense Technology, Beijing Micro-Yuan Era Technology, and Wuhan Hengjuan Technology — each hold 1 patent record.
The evidence places the field in a Decline stage. Annual filings peaked in 2021 and have eased back since. The most recent 18–24 months are subject to publication lag, so final filing counts for 2024–2025 are not yet settled.
The United States leads with 6 patent records, followed by Europe (EPO) with 4 and China with 3. The visible assignees appear to pursue selective tri-regional coverage rather than broad multi-jurisdiction filing.
B81B (Microstructural devices / MEMS) and G01C (Distance, navigation and gyroscopes) each account for the highest classification counts, with B81C (MEMS manufacturing) close behind. Four additional classes — B23K, C03C, C23C, and G01P — each appear only once.
Yes. B23K (welding, soldering and brazing), C03C (glass and enamel compositions), C23C (coating and surface deposition), and G01P (velocity and acceleration) each appear in only 1 patent record, representing roughly 3% of IPC classifications each. These branches are adjacent to core packaging functions — bonding, hermetic sealing, getter coatings — but are sparsely covered by dedicated packaging claims in the current corpus.
Map your own MEMS packaging Snapshot in minutes
Join 18,000+ innovators using PatSnap Eureka to map any technology landscape: search 2B+ patents and papers, surface key assignees, and generate a report like this in minutes.
Disclaimer. This page is generated from PatSnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. PatSnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.