MEMS Pressure Sensor Signal Conditioning Patents: Leaders & Gaps 2026
A patent landscape review of MEMS pressure sensor signal conditioning: filing trends, IPC composition, leading assignees and white space, based on 39 records filed 2015-2026.
Filing growth = 2021 (3 records) → 2024 (0); 2024 is the last year we treat as complete. Top-5 share = the 5 largest assignees ÷ all 39 records in scope (CR5), not the ranked leaders only.
What this landscape covers
MEMS pressure sensor signal conditioning sits at the intersection of the mechanical transducer and the electronics that turn its output into a usable signal — amplification, filtering, compensation and readout circuitry built around a MEMS pressure element. This landscape draws on 39 published records classified under force and pressure measurement, general measuring instrumentation and MEMS microstructural devices, filed between 2015 and 2026. Patent families, rather than raw document counts, are used wherever the ranking is built, which neutralises continuation filings and multi-jurisdiction duplicates.
The scope pulls in adjacent application classes — smokers' requisites, body-fluid devices, flow measurement and signal coding — which signals that signal-conditioning circuitry originally built for pressure sensing is being reused in vaping devices, medical delivery systems and flow instrumentation. That cross-pollination matters for anyone scoping freedom-to-operate: a claim written for one application class can still read on a design built for another.
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Filing trend and technology composition
Two views of the same 39 records: how filings moved year over year, and which IPC subclasses carry the claim volume.
A shallow, front-loaded filing curve
Annual filings ran from 2 in 2017 to a peak of 5 in 2018, and the hero figure of -100% for 2021 to 2024 reflects the last fully-published year on record, not a collapse in interest. Because publication lags filing by roughly 18 months, 2025 and 2026 figures are still incomplete and should not be read as a decline.
Publication lags filing by roughly 18 months, so 2025 onwards are still filling in. Growth rates on this page therefore end at 2024; running them to the last bar would understate the field.
Force and pressure measurement dominates the class mix
G01L accounts for 76.9% of the 39 records, more than three times the next class, G01D at 23.1%. B81B, the MEMS-specific microstructural class, appears in only 12.8% of records, which suggests most applicants are claiming the signal path and readout rather than the microstructure itself.
Shares are the percentage of the 39 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.
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Try EurekaA recent filing that shows how the field is being claimed
Integrated MEMS pressure sensor microphone chip with adaptive drive control
The filing combines a piezoresistive MEMS pressure sensor with an ASIC carrying a low-offset operational amplifier and an adaptive power-switch control circuit. The MEMS element detects inhalation strength; the ASIC converts that signal into a control voltage that governs the drive power and brightness of a heating filament, aiming to fix single-function designs prone to misjudging inhalation.Filed 2025-04-15 by a vocational college assignee, illustrating how signal-conditioning circuitry for MEMS pressure sensing is migrating into consumer vaping hardware rather than staying inside industrial or automotive pressure measurement.
| # | Publication no. | Patent title | Citations |
|---|---|---|---|
| 1 | US6404204B1 | Sensor and sensor system for liquid conductivity, temperature and depth | 99 |
| 2 | US20110160560A1 | Pressure sensor apparatus, system and method | 40 |
| 3 | US7430918B2 | Amplified flow through pressure sensor | 34 |
| 4 | US20180317022A1 | Combined ambient pressure and acoustic MEMS sensor | 23 |
| 5 | US20040232923A1 | Sensor and sensor system for liquid conductivity, temperature and depth | 23 |
| 6 | US20130047746A1 | MEMS pressure sensor | 18 |
| 7 | CN106644244A | 一种MEMS压力传感器 | 16 |
| 8 | US20020135377A1 | Sensor and sensor system for liquid conductivity, temperature and depth | 14 |
| 9 | US6577134B2 | Sensor and sensor system for liquid conductivity, temperature and depth | 13 |
| 10 | US20080127741A1 | Amplified flow through pressure sensor | 12 |
Citation counts favour older records in any searched corpus; treat them as a signal of influence on the field, not of what is currently competitive.
Patent titles are shown in the language they were filed in, not translated, so that each record stays verifiable against the original filing — a translated title will not match in Eureka or in any national register. Each row carries its publication number; clicking a row searches Eureka by that number.
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Browse MCP servers →What the concentration and class data imply
Three readings of the same dataset, aimed at where to file, who to watch, and what is still open.
A short leader list, then a long tail
The leader holds 8 records outright, and the top 5 assignees combined account for 48.7% of all 39 records in scope. Past tenth place, holdings drop to 2 records each, which points to a field with one clear incumbent and a wide field of single- or double-filing entrants rather than a crowded top tier.
China is the primary filing venue
China accounts for 19 of the filings by receiving office, well ahead of the United States at 11 and Europe at 4. Combined with the WIPO and Australia/Germany totals, this points to a field where Chinese applicants and vocational/university-linked entities are filing actively even where corporate concentration elsewhere is thin.
Circuitry claims outnumber structure claims
Only 12.8% of the 39 records carry a B81B MEMS-structure classification, against 76.9% for G01L pressure measurement. Most of the claim activity in this dataset sits on the signal path and readout electronics around the sensor, not on the micromechanical element itself.
Collaboration is sparse and localised
Only 5 co-assignee pairs appear across the dataset, the strongest linking a single corporate assignee with named inventors, and a separate pair linking a Shaoxing investment vehicle to a university research institute. Cross-organisation co-filing is not yet a structural feature of this field.
Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to mems pressure sensor signal conditioning patent landscape, with the prior art for and against each one.
Where to take this analysis
The dataset points to specific follow-on questions depending on whether the goal is freedom-to-operate, licensing or new filing strategy.
Map the leader's claim boundaries
With one assignee holding 8 of 39 records, understanding exactly what that portfolio claims in the signal path is the first freedom-to-operate step before designing a competing readout circuit.
Explore claim charts in EurekaCheck the under-claimed branches
B81B microstructural claims sit at only 12.8% of records against 76.9% for G01L; that gap is worth probing before assuming the MEMS element itself is heavily blocked.
Run a white space search in EurekaTrack the vocational and university filers
Filings from Chinese vocational colleges and university-linked research institutes appear alongside corporate assignees; watching this segment early can flag emerging licensing or acquisition targets.
Set up assignee alerts in EurekaCommon questions about this landscape
The ranking covers 26 assignees built from 39 records, with the leader holding 8 records and the fifth and tenth-place holders each at 2. The top 5 combined account for 48.7% of all 39 records, and the top 10 account for 74.4%, so the field has a clear incumbent followed quickly by a long tail of entrants with one or two filings each. This is not a top-100 list; it is the whole ranking the underlying dataset returns.
Filings peaked at 5 in 2018 and the most recent fully-published year, 2024, shows a -100% change from 2021's level of 3. That figure should be read carefully: publication lags filing by roughly 18 months, so 2025 and 2026 numbers are still incomplete and cannot yet be compared fairly to earlier years. The honest reading is a thin, front-loaded filing curve rather than a confirmed decline.
G01L, force and pressure measurement, appears in 76.9% of the 39 records and is by far the dominant class. G01D (measuring and recording, 23.1%) and G01N (material analysis and testing, 20.5%) follow, with B81B, the MEMS-specific structural class, present in only 12.8% of records. Because a single record can carry multiple IPC codes, these shares add up to more than 100% and should be read against the record total, not against each other.
The class data suggests the MEMS microstructural element itself (B81B, 12.8% of records) is less densely claimed than the surrounding signal-conditioning circuitry (G01L, 76.9%). Adjacent application classes such as flow measurement (G01F) and body-fluid devices (A61M) each sit at only 5.1%, which points to specific application domains where fewer filings currently compete for claim space. Any white-space assessment should still be paired with a full freedom-to-operate search before committing engineering resources.
CN119827033A, filed in April 2025, integrates a piezoresistive MEMS pressure sensor with an ASIC that adapts heating-filament drive power based on inhalation strength, aimed at a consumer vaping application. It shows signal-conditioning circuitry originally developed for industrial or automotive pressure sensing migrating into consumer hardware, consistent with the smokers'-requisites and body-fluid IPC classes appearing in this dataset. It is a useful marker of application drift rather than a definitive claim boundary, since the abstract does not disclose the full claim scope.
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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.
Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company’s registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.