MEMS Pressure Sensor System Integration Patent Landscape 2026
- Filing peaked in 2023 at 6 records, then went flat. with 2022 sitting at zero — this is a field that surged briefly rather than one climbing steadily, and 2026 figures are still incomplete.
- United States receiving offices carry 14 of 22 records against 7 for China and 1 for Europe, so venue choice here is heavily US-weighted relative to most MEMS categories.
- Only 3 co-assignee pairs exist across 22 families and all three link the same three Chinese research entities, meaning most other filers are working alone rather than in named partnerships.
What this landscape covers
This dataset tracks patent families combining MEMS pressure sensor or micromachined pressure sensor terminology in the title/abstract with system-integration language — MEMS-ASIC integration, system-in-package, sensor module — in the title, claims or description. The IPC scope is narrowed to force and pressure measurement (G01L19/00, G01L9) and MEMS structural classes (B81B7), which keeps the set focused on packaging and integration claims rather than raw transduction physics.
22 published records map to 22 distinct patent families, so there is essentially no continuation or multi-jurisdiction inflation in this set — each family appears to have been filed once and tracked once. That makes the family count a clean proxy for the number of genuinely distinct integration approaches on file.
Filing trend and technology composition
The filing curve and the IPC split together describe a narrow, packaging-focused niche rather than a broad sensor category — most records touch pressure measurement and MEMS structure classes simultaneously.
A short burst, not a sustained climb
Filings opened at 2 in 2017, dropped through a flat 2022, then rose to a peak of 6 in 2023 before tapering. Because publication lags filing by roughly 18 months, the 2025–2026 counts are undercounted and should not be read as a real decline yet.
Integration claims dominate the structural side
All 22 records sit in G01L (force/pressure measurement), and half also carry a B81B (MEMS structural device) code, confirming the search captured integration-specific claims rather than generic pressure-sensing art. B81C manufacturing codes appear in 8 records, and a single A61B record shows the rare medical-diagnostic crossover.
Shares are the percentage of the 22 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.
Go deeper on MEMS Pressure Sensor System Integration with Eureka
This page is one run against one query. Ask Eureka your own question about mems pressure sensor system integration and every answer comes back with the patent numbers behind it.
Try EurekaThe most-cited records and a representative filing
US20250102391A1 — Pressure sensor with flange
A sensor module includes an organic substrate, a MEMS pressure sensor mounted to the organic substrate, and a unitary lid mounted on the substrate. The unitary lid includes a central elevated portion housing the MEMS pressure sensor, an aperture in the central elevated portion, and a flat flange extending from the central elevated portion to an edge of the organic substrate.Filed by STMicroelectronics International N.V., published 2025-03-27.
| # | Publication no. | Patent title | Citations |
|---|---|---|---|
| 1 | US20180313709A1 | MEMS pressure sensor with through-hole cap | 49 |
| 2 | US20110160560A1 | Pressure sensor apparatus, system and method | 40 |
| 3 | US20170030788A1 | MEMS pressure sensor | 23 |
| 4 | US9846095B2 | 3D stacked piezoresistive pressure sensor | 12 |
| 5 | US20160320255A1 | 3D stacked piezoresistive pressure sensor | 12 |
| 6 | US10247629B2 | Stacked or unstacked MEMS pressure sensor with through-hole cap and plurality of chip capacitors | 8 |
| 7 | US10768065B2 | MEMS pressure sensor | 6 |
| 8 | CN108871655A | 基于模组的MEMS压力传感器以及批量校准设备和校准工艺 | 6 |
| 9 | US20210156756A1 | MEMS pressure sensor | 5 |
| 10 | US11579033B2 | MEMS pressure sensor | 4 |
Citation counts are drawn from within this searched corpus and favour older filings that have had more time to accumulate citations — treat them as a signal of influence, not current relevance.
Patent titles are shown in the language they were filed in, not translated, so that each record stays verifiable against the original filing — a translated title will not match in Eureka or in any national register. Each row carries its publication number; clicking a row searches Eureka by that number.
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Three patterns stand out once the filing curve, the IPC split and the venue data are read together.
A burst, not a trend
The jump from a flat 2022 to a peak of 6 filings in 2023 looks like a response to a specific packaging problem rather than steady category growth. With 2024–2026 still filling in behind an 18-month publication lag, it is too early to call this a plateau or a decline.
US-centred filing
Two-thirds of the tracked records were filed at the USPTO, with China a distant second and Europe barely present. For a MEMS packaging niche this is a notably US-weighted split, and it narrows the venues worth watching for competitive clearance.
Mostly solo filers
Only three co-assignment relationships exist in the set, and all three connect the same three Chinese entities — a technology transfer venture, a university research institute and the parent university. No cross-border or cross-company joint filings appear.
Packaging-first claims
Every record sits in G01L, and half add a B81B structural code — consistent with the search design, but it also confirms this corpus is genuinely about integration and packaging rather than sensing chemistry or algorithms.
Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to mems pressure sensor system integration, with the prior art for and against each one.
| Assignee | Co-assignee | Shared families |
|---|---|---|
| Shaoxing Science and Technology Venture Investment Co., Ltd. | Shaoxing Research Institute of Zhejiang University | 2 |
| Shaoxing Science and Technology Venture Investment Co., Ltd. | Zhejiang University | 2 |
| Shaoxing Research Institute of Zhejiang University | Zhejiang University | 2 |
The only recorded co-assignee links form a triangle between one Chinese investment vehicle and two university-affiliated entities — a pattern that looks like a single regional research cluster rather than an industry-wide collaboration norm.
Who is filing, and where the gaps sit
Activity is spread thin across named assignees, with none showing filings in the latest tracked year — consistent with the flat 2022–2026 stretch in the trend data.
STMicroelectronics International N.V.
Holds the representative filing in this set, a sensor-module patent describing a unitary lid and organic substrate construction. No filings from this assignee land in the most recent tracked year, matching the broader flat-momentum pattern across the field.
Continental Automotive Systems, Inc. (Continental Automotive Systems)
Automotive-sector presence in this set, with no filings recorded in the latest year tracked. Its inclusion signals that pressure-sensor packaging claims here extend into automotive-grade module design, not just consumer or industrial sensing.
Shaoxing Science and Technology Venture Investment Co., Ltd. + Shaoxing Research Institute of Zhejiang University + Zhejiang University
The only named collaboration structure in the dataset connects an investment vehicle, a university research institute, and the parent university, all based around Shaoxing. Each pairing appears twice, suggesting a small, repeatable filing relationship rather than a one-off.
MOTION ENGINE / MEI MICRO INC
Smaller, specialised entrants with no recent-year filings recorded. Their presence in a 22-family set without a clear collaboration or continuation pattern suggests single-invention filings rather than a sustained program.
| Assignee | Recent year | YoY |
|---|---|---|
| STMicroelectronics International N.V. (Switzerland) | 0 | — |
| Continental Automotive Systems, Inc. | 0 | — |
| MEI MICRO INC | 0 | — |
| MOTION ENGINE | 0 | — |
| Shaoxing Science and Technology Venture Investment Co., Ltd. | 0 | — |
| Shaoxing Research Institute of Zhejiang University | 0 | — |
| Zhejiang University | 0 | — |
| Kunshan Lingke Sensing Technology Co., Ltd. | 0 | — |
Where to take this analysis
The filing and citation patterns above point to specific next steps for anyone evaluating freedom-to-operate or filing strategy in this space.
Map claim scope against the most-cited records
The five most-cited records in this set, including two separate 3D-stacked piezoresistive filings, define the prior-art baseline that any new packaging claim will be measured against.
Explore citation chains in EurekaTrack the Shaoxing research cluster
The only repeated co-assignment structure in the dataset centres on one Chinese investment-university triangle — a useful signal for where follow-on filings from that group might land next.
Monitor assignee activity in EurekaWatch for the 2024–2026 filing lag to resolve
With publication running roughly 18 months behind filing, the apparent taper after 2023 needs another year of data before it can be read as a real slowdown.
Set an alert on this landscape in EurekaCommon questions about this landscape
This dataset identifies 22 published records mapping to 22 distinct patent families between 2015 and the 2026 data cut-off. The one-to-one ratio of records to families means there is little continuation filing or multi-jurisdiction duplication in this specific niche, so each family represents a genuinely distinct filing rather than a variant of an earlier one. That makes the count a reasonably clean measure of how many separate integration approaches are actually on file.
Filing activity rose from 2 records in 2017 to a peak of 6 in 2023, after sitting flat at 0 in 2022. Part of the apparent drop after 2023 is real, but part of it is a publication artefact: patent filings typically publish around 18 months after they are filed, so the 2025 and especially 2026 counts are still incomplete and will rise as more applications clear that lag. Treat the post-2023 numbers as a floor, not a final reading.
The United States receiving office accounts for 14 of the 22 tracked records, roughly two-thirds of the set, with China at 7 and Europe (EPO) at just 1. For most clearance work in this specific integration niche, a US search should come first, followed by China; European coverage is thin enough that it may reflect under-filing rather than an open market, so it should not be assumed clear without a direct check.
US20250102391A1, filed by STMicroelectronics International N.V. and published 2025-03-27, describes a specific construction: a MEMS pressure sensor mounted on an organic substrate under a unitary lid with a central elevated portion, an aperture for pressure access, and a flat flange running to the substrate edge. It blocks that specific lid-and-flange geometry, not sensor modules in general — designs using different lid architectures, multi-piece caps, or non-flanged sealing approaches sit outside its literal claim scope, though a full claim-by-claim comparison is needed before relying on that gap.
The IPC composition shows every record touching G01L (pressure measurement) and roughly half touching B81B (MEMS structural devices), with B81C manufacturing codes in 8 of 22 records — a pattern that concentrates around packaging and structural claims rather than manufacturing process detail. Sub-areas such as organic-substrate thermal stress relief, wafer-level cap bonding for pressure ports, and automotive-grade MEMS-ASIC co-packaging show little direct coverage in this set, making them worth checking before assuming the space is occupied. Given the flat 2022 and undercounted 2025–2026 data, any white-space read should be revisited once the recent-year lag resolves.
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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.
Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company’s registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.