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Metal AM Residual-Stress Patents: Who Leads, Where the Gaps Are 2026

Metal AM Residual-Stress Patents: Who Leads, Where the Gaps Are 2026
https://www.patsnap.com/resources/blog/rd-blog/metal-additive-manufacturing-additive-residual-stress-mitigation-patent-landscape-patent-landscape/ · Patsnap · data cut-off 2026-07-31 · downloaded from the live page
Patent Landscape · Metal Additive Manufacturing
Residual-Stress Mitigation Patents in Metal Additive Manufacturing
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29
Published Records
-40%
Filing Growth 2021→2024
US
Leading Jurisdiction
6
Active Filers Ranked

Filing growth compares 2021 (10 records) with 2024 (6) — a three-year span. 2024 is the most recent year we treat as complete: publication lags filing by roughly 18 months, so 2025 onwards are still filling in and any growth rate that ends there would understate the field.

Published byPatsnap Research··7 min readSourced from Patsnap Eureka
Overview

What this landscape covers

This landscape tracks patent activity specifically directed at controlling or mitigating residual stress, thermal distortion, and print-stress artifacts in metal additive manufacturing — laser and electron-beam powder bed fusion, directed energy deposition, and related metal 3D-printing processes. The scope excludes general additive-manufacturing filings that do not address thermal stress control directly, so the 29 records here are a narrow, purpose-built slice rather than a survey of metal AM as a whole. Distortion mitigation in directed energy deposition and powder-bed re-coater heat management are the two clearest recurring claim families in the set.

Coverage runs from 2015 through the 2026-07-31 cut-off, with the United States as the dominant receiving office ahead of Europe, WIPO/PCT, Australia, Canada and India. Because publication trails filing by roughly 18 months, any read of the final one or two years in the trend should be treated as provisional, not as a real slowdown.

Filing activity and technology mix, 2015–2026
  1. 1Norsk Titanium21
  2. 2Divergent Technologies, Inc.4
  3. 3KVA TECH2
  4. 4DELHI TECHNOLOGICAL UNIVERSITY1
  5. 5ASANSOL ENGINEERING COLLEGE1
  6. 6ALMEIDA PEDRO1
Source: Patsnap Eureka. Assignee ranking and totals. Derived from a Patsnap search on Metal Additive Manufacturing — Additive Residual-Stress Mitigation Patent Landscape covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
The data

Filing trend and technology composition

Two views of the same 29-record set: how filing activity has moved year over year, and which IPC subclasses carry the claims.

Filing trend: a 2020 peak, then a measured pull-back

Filing rose from zero in 2017 to a peak of 10 records in 2020, held near that level into 2021, then declined to 6 by 2024 — a 40% drop over that three-year span. 2025 and 2026 figures are still filling in under the publication lag and should not be read as continued decline.

Filing trend: a 2020 peak, then a measured pull-back0358100201720182019102020102021202220232024202512026Most recent year is partial — publication lag means later filings are not yet visible.

IPC composition: welding and 3D-printing classes dominate

B23K (welding, soldering & brazing) appears in 79.3% of the 29 records and B33Y (additive manufacturing) in 69.0%, with B22F (powder metallurgy) at 51.7%. B22D (metal casting), B29C (plastics shaping) and C22C (alloys) each sit under 14%, marking them as thinner branches rather than empty ones — a record can carry more than one class, so these figures sum past 100%.

IPC composition: welding and 3D-printing classes dominateB23K · Welding, soldering & brazing2379.3%B33Y · Additive manufacturing (3D pri…2069.0%B22F · Powder metallurgy1551.7%B22D · Metal casting413.8%B29C · Shaping of plastics310.3%C22C · Alloys13.4%

Shares are the percentage of the 29 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.

Source: Patsnap Eureka. Filing trend and technology composition. Derived from a Patsnap search on Metal Additive Manufacturing — Additive Residual-Stress Mitigation Patent Landscape covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.

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Key Patents

The most-cited filings in this set

Representative filing
US20210154771A12021-05-27

Powder bed fusion re-coaters with heat source for thermal management (US20210154771A1)

DIVERGENT TECHNOLOGIES, INC.

Techniques for pre-heating the powders of a layer deposited on the powder bed during a 3-D print process are disclosed. A re-coater includes a heat source that pre-heats the deposited layer as a leveling member smooths it onto the powder bed, and may reheat the bed following selective fusing by an energy beam. Consistent pre-heating and re-heating directly at the powder bed surface is claimed to reduce damage, cracks, dimensional flaws, and other artifacts from excessive thermal gradients.Filed by Divergent Technologies, Inc.; published 2021-05-27; cited 9 times in this dataset.

US20210154771A1 — patent drawing 1US20210154771A1 — patent drawing 2
View full filing
Highest-cited records, 2015–2026
#Publication no.Patent titleCitations
1US20210154732A1Distortion mitigation in directed energy deposition15
2US20210276096A1Distortion mitigation in directed energy deposition10
3US20210154771A1Powder bed fusion re-coaters with heat source for thermal management9
4WO2021099459A1Distortion mitigation in directed energy deposition4
5US12048965B2Distortion mitigation in directed energy deposition3
6CA3160960A1Distortion mitigation in directed energy deposition2
7US20250187075A1Distortion mitigation in directed energy deposition1
8US20250065404A1Distortion mitigation in directed energy deposition1
9WO2022242873A1Mount system, pin support system and a method of directed energy deposition for producing a metal workpiece t…1
10EP4061567A1Distortion mitigation in directed energy deposition1

Citation counts inside a searched corpus favour older filings; treat this as a signal of influence on later filers, not of current commercial weight.

Each row carries its publication number; clicking a row searches Eureka by that number.

Source: Patsnap Eureka. Citation counts and representative records. Derived from a Patsnap search on Metal Additive Manufacturing — Additive Residual-Stress Mitigation Patent Landscape covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
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Insights

What the numbers mean for a filing decision

Three read-throughs from the ranking, the trend and the citation table, translated into what they change for someone about to file.

Concentration
21 of 29 records
held by the leading assignee

One filer set the claim boundaries early

With the leader holding 21 records against a fifth-place filer holding just 1, most of the documented claim space around distortion mitigation in directed energy deposition and powder-bed re-coater heat management was staked out by a single applicant. New entrants should expect to design around that filer's specific mechanisms rather than the technology generally.

Assignee ranking, 6 companies
Momentum
-40% (2021→2024)
filing change, complete years only

Activity cooled from its 2020 peak, not yet clear if this continues

Filing peaked at 10 records in 2020 and declined to 6 by 2024. Because 2025-2026 publications are still arriving under the normal 18-month lag, this reads as a pull-back from a peak rather than confirmed abandonment of the space.

Peak year 2020: 10 records
Technology mix
79.3% vs 13.8%
B23K share vs B22D share of 29 records

Thermal/process-heat routes dominate over casting-adjacent routes

Welding and brazing classifications (B23K) and additive-manufacturing classifications (B33Y) cover the large majority of records, while metal casting (B22D) and alloy composition (C22C) claims are comparatively rare. Filers approaching stress mitigation through alloy chemistry rather than process heat control are working in a thinner part of the field.

IPC subclass counts, 29 records in scope
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Source: Patsnap Eureka. Co-assignee relationships and derived observations. Derived from a Patsnap search on Metal Additive Manufacturing — Additive Residual-Stress Mitigation Patent Landscape covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
What's next

Where to take this next

This landscape narrows to a single research question. Two natural extensions follow from it.

Broaden to metal AM process control generally

This dataset excludes general metal AM filings that do not directly address thermal stress. A wider process-control search would show how residual-stress claims sit relative to the full metal AM patent volume.

Explore adjacent landscapes

Track the leading assignee's continuation filings

With one filer holding the majority of records and a change in recent-year momentum, watching for continuations or new families from both the incumbent and the newer filer is the most direct way to see where the space moves next.

Set up assignee monitoring
Source: Patsnap Eureka. Forward-looking reading of the same dataset. Derived from a Patsnap search on Metal Additive Manufacturing — Additive Residual-Stress Mitigation Patent Landscape covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
FAQ

Questions practitioners ask about this space

Answers are grounded in the same dataset. Derived from a Patsnap search on Metal Additive Manufacturing — Additive Residual-Stress Mitigation Patent Landscape covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company’s registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.

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