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Metallic Glass Heat Treatment Patents: Leaders & White Space 2026

Metallic Glass Heat Treatment Patents: Leaders & White Space 2026
https://www.patsnap.com/resources/blog/rd-blog/metallic-glass-heat-treatment-patent-landscape/ · Patsnap · data cut-off 2026-07-31 · downloaded from the live page
Patent Landscape · Advanced Materials & Metallurgy
Metallic Glass Heat Treatment Patents: Who Holds the Annealing Claims
  • Filing has cooled sharply since its 2017 peak of 43, with the 2022 midpoint at just 15 — a pattern of decline rather than a maturing plateau.
  • Magnetics dominates the claim map, with H01F (441 records) and C22C alloy claims (343) far outweighing C21D heat-treatment-specific filings (128).
  • The United States leads filing venues by a wide margin (365), ahead of Japan (194) and the EPO (169), shaping where enforcement risk concentrates.
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1,123
Published Records
22%
Top-5 Share of All Records
-29%
Filing Growth 2021→2024
US
Leading Jurisdiction

Filing growth compares 2021 (14 records) with 2024 (10) — a three-year span. 2024 is the most recent year we treat as complete: publication lags filing by roughly 18 months, so 2025 onwards are still filling in and any growth rate that ends there would understate the field. Top-5 share is the combined record count of the five largest assignees divided by all 1,123 records in scope (CR5), not by the ranked leaders only.

Published byPatsnap Research··7 min readSourced from Patsnap Eureka
Overview

What this landscape covers

This landscape tracks patent families combining metallic glass, amorphous alloy and bulk metallic glass compositions with structural relaxation annealing, sub-Tg annealing and general thermal treatment claims, filed between 2015 and mid-2026. The corpus spans 1,123 published families, concentrated heavily in magnetic-component applications rather than treatment process claims in isolation.

Because publication lags filing by roughly 18 months, the 2025-2026 counts in the trend chart understate real filing activity; the decline visible through 2022-2024 is the more reliable signal of where the field is heading.

Filing activity and technology composition, 2017-2026
  1. 1METGLAS INC78
  2. 2PROTERIAL LTD55
  3. 3KK TOSHIBA41
  4. 4AMOSENSE CO LTD36
  5. 5HYDRO QUEBEC CORP36
  6. 6VACUUMSCHMELZE GMBH & CO KG35
  7. 7PANASONIC HOLDINGS CORP26
  8. 8SCHLUMBERGER TECH CORP21
  9. 9U T T UNIQUE TRANSFORMER TECH19
  10. 10COVESTRO DEUTSCHLAND AG19
Source: Patsnap Eureka. Assignee ranking and totals. Derived from a Patsnap search on Metallic Glass Heat Treatment covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
The Numbers

Filing trend and technology composition

Annual filings and IPC distribution across the 1,123 families in this corpus, drawn from records filed 2015 through mid-2026.

A peak in 2017, then a long decline

Filings ran from 43 in 2017 down toward zero in the most recent (partial) year, with the 2022 midpoint at 15 — consistent with a technology that saw a filing burst and has not sustained it, rather than one still building toward a plateau.

A peak in 2017, then a long decline0132538504320172018201920202021202220232024202502026Most recent year is partial — publication lag means later filings are not yet visible.

Magnetics and alloys outweigh process-specific claims

H01F (magnets, inductors, transformers) leads with 441 records and C22C (alloys) follows with 343, together dwarfing C21D (heat treatment of metals proper) at 128. G11B, B22F, H01L, B32B and C23C each contribute smaller but non-trivial slices, showing that most claims wrap the annealing step inside a downstream component or coating application rather than treating it as the invention itself.

Magnetics and alloys outweigh process-specific claimsH01F · Magnets, inductors & transform…44139.3%C22C · Alloys34330.5%C21D · Heat treatment of metals12811.4%G11B · Information storage (magnetic/…12210.9%B22F · Powder metallurgy1039.2%H01L · Semiconductor devices968.5%B32B · Layered products & laminates696.1%C23C · Coating & surface deposition655.8%Other99488.5%

Shares are the percentage of the 1,123 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.

Source: Patsnap Eureka. Filing trend and technology composition. Derived from a Patsnap search on Metallic Glass Heat Treatment covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.

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Key Patents

Representative and most-cited filings

Representative Filing
US20130139929A12013-06-06

System and method for treating an amorphous alloy ribbon (US20130139929A1, Hydro-Quebec)

HYDRO-QUEBEC

Describes continuous in-line annealing of a ferromagnetic amorphous alloy ribbon in a curved path, heating and cooling at rates greater than 10^3 degrees C per second while applying mechanical constraints, aimed at improving magnetic properties without embrittling the ribbon at high feed rates.Abstract trimmed to the claimed process steps; see the full record for tensioning and constraint details.

US20130139929A1 — patent drawing 1US20130139929A1 — patent drawing 2
View full record
Most-cited records in this corpus
#Publication no.Patent titleCitations
1US20160064814A1Composite sheet for shielding magnetic field and electromagnetic wave, and antenna module comprising same173
2US20150123604A1Magnetic field shielding sheet for a wireless charger, method for manufacturing same, and receiving apparatus…167
3US4067732AAmorphous alloys which include iron group elements and boron166
4US20090027812A1Magnetic signal reproduction system and magnetic signal reproduction method150
5US20050043761A1MRI-compatible implantable device144
6US20080297950A1Magnetic signal reproduction system and magnetic signal reproduction method138
7US20150290771A1Abrasive article and method for making the same119
8US6567246B1Magnetoresistance effect element and method for producing the same, and magnetoresistance effect type head, m…117
9US5796323AConnector using a material with microwave absorbing properties112
10US20180067003A1Conduction-path-equipped member, method for patterning conduction path, and method for measuring changes in m…107

Citation counts favour older records within the searched corpus; treat them as a signal of influence on later filings, not of current commercial relevance.

Each row carries its publication number; clicking a row searches Eureka by that number.

Source: Patsnap Eureka. Citation counts and representative records. Derived from a Patsnap search on Metallic Glass Heat Treatment covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
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Insights

What the data means for filing strategy

Three patterns stand out once the trend, geography and citation data are read together.

Filing Momentum
43 → 0
peak (2017) to latest year

The filing wave has passed, not paused

With the 2022 midpoint at 15 and the trend still falling, this is a declining filing curve rather than a technology approaching saturation from continued growth. New entrants face a shrinking pool of active competitors, but also a claim landscape that was built during a much busier period.

Trend section, 2017-2026
Application Skew
441 vs 128
H01F records vs C21D records

Most claims sit in the application, not the process

H01F magnetic-component filings outnumber C21D heat-treatment filings by more than 3:1. Process-only annealing claims are comparatively rare — most inventors claim the annealed ribbon or shielding sheet as part of a finished magnetic or electromagnetic component.

IPC composition
Venue Concentration
365 US filings
vs 194 Japan, 169 EPO

US filing leads but Japan and Europe are not far behind

The United States receives the largest share of filings, but Japan and the EPO together account for a comparable volume, meaning freedom-to-operate work needs to cover all three jurisdictions rather than the US alone.

Receiving offices
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Looking for what nobody has claimed yet?

Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to metallic glass heat treatment, with the prior art for and against each one.

Find the white space →
Source: Patsnap Eureka. Co-assignee relationships and derived observations. Derived from a Patsnap search on Metallic Glass Heat Treatment covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
Players

Who holds the claims

Filing activity clusters around a small group of assignees with historical depth in amorphous alloy ribbon production and magnetic components, several of whom co-file with affiliated entities.

Legacy Producer
0 latest-year filings
across tracked assignees

Historic leaders have gone quiet

Every assignee in the recent-momentum data shows zero filings in the latest year, including Metglas, Hydro-Quebec and Toshiba-affiliated entities. This reflects the broader decline in the trend chart rather than any single company exiting the field.

Recent-year momentum
Co-Filing Pattern
8 co-assignee pairs (top pair)
Toshiba + Toshiba Materials

Corporate family filing is common

The strongest co-assignee pairing links Toshiba with Toshiba Materials, and a second links Metglas with Hitachi Metals affiliates, indicating that R&D and IP filing are often split between a parent and a materials-focused subsidiary.

Co-assignee pairs
Process Originator
US4067732A · 166 citations
foundational amorphous alloy patent

The oldest cited patent still anchors the field

US4067732A, covering amorphous alloys with iron group elements and boron, remains among the most-cited records in the corpus, underlining how much later magnetic-shielding and ribbon-treatment work builds on decades-old alloy composition claims.

Most-cited records
🔍
Under-claimed branches worth checking
Sub-areas with comparatively thin filing density relative to the core magnetics and alloy claims.
Sub-Tg annealing kinetics controlIn-line ribbon constraint toolingCoating-integrated thermal treatment (C23C overlap)Powder-metallurgy consolidation annealingSemiconductor-substrate compatible relaxation
Rank all filers by momentum →
Recent-year filing momentum by assignee
AssigneeRecent yearYoY
Metglas, Inc.0
Proterial, Ltd. (formerly Hitachi Metals)0
Toshiba Corporation0
Amosense Co., Ltd.0
Vacuumschmelze GmbH & Co. KG0
Hydro-Quebec0
Hitachi, Ltd.0
Panasonic Corporation (Japan)0
Source: Patsnap Eureka. Assignee-level momentum. Derived from a Patsnap search on Metallic Glass Heat Treatment covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
What's Next

Where to take this analysis

The trend and assignee data point to specific next steps depending on whether the goal is freedom-to-operate or new filing strategy.

Check the C21D-only claim set

Because most filings wrap annealing inside a magnetic or coating claim, isolating the smaller pool of pure heat-treatment-of-metals filings can reveal process claims that are easier to design around than the component-level ones.

Explore C21D filings in Eureka

Map the Toshiba and Metglas co-filing family

The strongest co-assignee pairs suggest coordinated parent-subsidiary filing; tracing which entity holds which claims matters for licensing conversations.

Trace assignee families in Eureka

Watch for a filing rebound

Given the 18-month publication lag, the apparent drop to zero in the latest year is not yet confirmed as a real stop in filing activity and is worth rechecking as later records publish.

Set a filing alert in Eureka
Source: Patsnap Eureka. Forward-looking reading of the same dataset. Derived from a Patsnap search on Metallic Glass Heat Treatment covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
FAQ

Common questions on this landscape

Answers are grounded in the same dataset. Derived from a Patsnap search on Metallic Glass Heat Treatment covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company’s registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.

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