Metallic Glass Heat Treatment Patents: Leaders & White Space 2026
- Filing has cooled sharply since its 2017 peak of 43, with the 2022 midpoint at just 15 — a pattern of decline rather than a maturing plateau.
- Magnetics dominates the claim map, with H01F (441 records) and C22C alloy claims (343) far outweighing C21D heat-treatment-specific filings (128).
- The United States leads filing venues by a wide margin (365), ahead of Japan (194) and the EPO (169), shaping where enforcement risk concentrates.
Filing growth compares 2021 (14 records) with 2024 (10) — a three-year span. 2024 is the most recent year we treat as complete: publication lags filing by roughly 18 months, so 2025 onwards are still filling in and any growth rate that ends there would understate the field. Top-5 share is the combined record count of the five largest assignees divided by all 1,123 records in scope (CR5), not by the ranked leaders only.
What this landscape covers
This landscape tracks patent families combining metallic glass, amorphous alloy and bulk metallic glass compositions with structural relaxation annealing, sub-Tg annealing and general thermal treatment claims, filed between 2015 and mid-2026. The corpus spans 1,123 published families, concentrated heavily in magnetic-component applications rather than treatment process claims in isolation.
Because publication lags filing by roughly 18 months, the 2025-2026 counts in the trend chart understate real filing activity; the decline visible through 2022-2024 is the more reliable signal of where the field is heading.
Filing trend and technology composition
Annual filings and IPC distribution across the 1,123 families in this corpus, drawn from records filed 2015 through mid-2026.
A peak in 2017, then a long decline
Filings ran from 43 in 2017 down toward zero in the most recent (partial) year, with the 2022 midpoint at 15 — consistent with a technology that saw a filing burst and has not sustained it, rather than one still building toward a plateau.
Magnetics and alloys outweigh process-specific claims
H01F (magnets, inductors, transformers) leads with 441 records and C22C (alloys) follows with 343, together dwarfing C21D (heat treatment of metals proper) at 128. G11B, B22F, H01L, B32B and C23C each contribute smaller but non-trivial slices, showing that most claims wrap the annealing step inside a downstream component or coating application rather than treating it as the invention itself.
Shares are the percentage of the 1,123 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.
Go deeper on Metallic Glass Heat Treatment with Eureka
This page is one run against one query. Ask Eureka your own question about metallic glass heat treatment and every answer comes back with the patent numbers behind it.
Try EurekaRepresentative and most-cited filings
System and method for treating an amorphous alloy ribbon (US20130139929A1, Hydro-Quebec)
Describes continuous in-line annealing of a ferromagnetic amorphous alloy ribbon in a curved path, heating and cooling at rates greater than 10^3 degrees C per second while applying mechanical constraints, aimed at improving magnetic properties without embrittling the ribbon at high feed rates.Abstract trimmed to the claimed process steps; see the full record for tensioning and constraint details.


| # | Publication no. | Patent title | Citations |
|---|---|---|---|
| 1 | US20160064814A1 | Composite sheet for shielding magnetic field and electromagnetic wave, and antenna module comprising same | 173 |
| 2 | US20150123604A1 | Magnetic field shielding sheet for a wireless charger, method for manufacturing same, and receiving apparatus… | 167 |
| 3 | US4067732A | Amorphous alloys which include iron group elements and boron | 166 |
| 4 | US20090027812A1 | Magnetic signal reproduction system and magnetic signal reproduction method | 150 |
| 5 | US20050043761A1 | MRI-compatible implantable device | 144 |
| 6 | US20080297950A1 | Magnetic signal reproduction system and magnetic signal reproduction method | 138 |
| 7 | US20150290771A1 | Abrasive article and method for making the same | 119 |
| 8 | US6567246B1 | Magnetoresistance effect element and method for producing the same, and magnetoresistance effect type head, m… | 117 |
| 9 | US5796323A | Connector using a material with microwave absorbing properties | 112 |
| 10 | US20180067003A1 | Conduction-path-equipped member, method for patterning conduction path, and method for measuring changes in m… | 107 |
Citation counts favour older records within the searched corpus; treat them as a signal of influence on later filings, not of current commercial relevance.
Each row carries its publication number; clicking a row searches Eureka by that number.
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Browse MCP servers →What the data means for filing strategy
Three patterns stand out once the trend, geography and citation data are read together.
The filing wave has passed, not paused
With the 2022 midpoint at 15 and the trend still falling, this is a declining filing curve rather than a technology approaching saturation from continued growth. New entrants face a shrinking pool of active competitors, but also a claim landscape that was built during a much busier period.
Most claims sit in the application, not the process
H01F magnetic-component filings outnumber C21D heat-treatment filings by more than 3:1. Process-only annealing claims are comparatively rare — most inventors claim the annealed ribbon or shielding sheet as part of a finished magnetic or electromagnetic component.
US filing leads but Japan and Europe are not far behind
The United States receives the largest share of filings, but Japan and the EPO together account for a comparable volume, meaning freedom-to-operate work needs to cover all three jurisdictions rather than the US alone.
Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to metallic glass heat treatment, with the prior art for and against each one.
Who holds the claims
Filing activity clusters around a small group of assignees with historical depth in amorphous alloy ribbon production and magnetic components, several of whom co-file with affiliated entities.
Historic leaders have gone quiet
Every assignee in the recent-momentum data shows zero filings in the latest year, including Metglas, Hydro-Quebec and Toshiba-affiliated entities. This reflects the broader decline in the trend chart rather than any single company exiting the field.
Corporate family filing is common
The strongest co-assignee pairing links Toshiba with Toshiba Materials, and a second links Metglas with Hitachi Metals affiliates, indicating that R&D and IP filing are often split between a parent and a materials-focused subsidiary.
The oldest cited patent still anchors the field
US4067732A, covering amorphous alloys with iron group elements and boron, remains among the most-cited records in the corpus, underlining how much later magnetic-shielding and ribbon-treatment work builds on decades-old alloy composition claims.
| Assignee | Recent year | YoY |
|---|---|---|
| Metglas, Inc. | 0 | — |
| Proterial, Ltd. (formerly Hitachi Metals) | 0 | — |
| Toshiba Corporation | 0 | — |
| Amosense Co., Ltd. | 0 | — |
| Vacuumschmelze GmbH & Co. KG | 0 | — |
| Hydro-Quebec | 0 | — |
| Hitachi, Ltd. | 0 | — |
| Panasonic Corporation (Japan) | 0 | — |
Where to take this analysis
The trend and assignee data point to specific next steps depending on whether the goal is freedom-to-operate or new filing strategy.
Check the C21D-only claim set
Because most filings wrap annealing inside a magnetic or coating claim, isolating the smaller pool of pure heat-treatment-of-metals filings can reveal process claims that are easier to design around than the component-level ones.
Explore C21D filings in EurekaMap the Toshiba and Metglas co-filing family
The strongest co-assignee pairs suggest coordinated parent-subsidiary filing; tracing which entity holds which claims matters for licensing conversations.
Trace assignee families in EurekaWatch for a filing rebound
Given the 18-month publication lag, the apparent drop to zero in the latest year is not yet confirmed as a real stop in filing activity and is worth rechecking as later records publish.
Set a filing alert in EurekaCommon questions on this landscape
In this corpus it means patent families that combine a metallic glass, amorphous alloy or bulk metallic glass composition with a thermal processing step described as structural relaxation annealing, sub-Tg annealing or general thermal treatment. Most of these filings do not claim the heat treatment alone; they claim it as part of a finished product, most often a magnetic shielding sheet, transformer core or data-storage component. That is why the IPC breakdown shows more H01F and C22C records than C21D records specific to metal heat treatment.
The trend data shows filings peaking at 43 in 2017 and falling to 15 by the 2022 midpoint, continuing downward toward the most recent partial year. This pattern is consistent with a technology area where the core annealing and ribbon-processing methods were claimed early and heavily, leaving less unclaimed ground for new filings. It does not necessarily mean commercial interest has disappeared, since publication lag means the last one to two years of data are still incomplete.
The assignee data shows activity concentrated among a handful of companies with long histories in amorphous alloy ribbon production and magnetic components, including Metglas, Hitachi Metals affiliates, Toshiba and its materials subsidiary, and Hydro-Quebec. Notably, every one of these tracked assignees shows zero filings in the latest year, reflecting the broader industry-wide slowdown rather than one company's retreat. Co-assignee pairs, particularly between parent companies and materials-focused subsidiaries, are common in this space.
US20130139929A1, assigned to Hydro-Quebec, describes a system and method for continuously annealing a ferromagnetic amorphous alloy ribbon in-line, in a curved path, using heating and cooling rates greater than 10^3 degrees Celsius per second while applying mechanical constraints. Its purpose is to improve the ribbon's magnetic properties without making it brittle, even at high feed rates. Anyone building continuous ribbon-annealing equipment for magnetic amorphous alloys should review its specific claims on feed rate, curvature and constraint sequencing before finalising a process design.
The IPC composition shows relatively thin filing in sub-Tg annealing kinetics control, coating-integrated thermal treatment that overlaps with C23C, and powder-metallurgy consolidation annealing under B22F, compared with the dense H01F and C22C application claims. These branches sit adjacent to the core magnetic-component filings but have not attracted the same claim density. A first claim in one of these areas would likely need to tie a specific annealing parameter window to a measurable property change, such as coercivity or ductility retention, to distinguish it from the older foundational alloy patents.
The United States receives the largest share of filings in this corpus at 365 records, but Japan (194) and the EPO (169) together represent a comparable volume, so a US-only search would miss a substantial portion of the relevant art. WIPO PCT filings (84) also matter as an early indicator of where applicants intend broader coverage. A thorough freedom-to-operate review should cover all three major venues rather than relying on US filings alone.
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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.
Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company’s registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.