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Metallic Glass Reliability Patents: Leaders & White Space 2026

Metallic Glass Reliability Patents: Leaders & White Space 2026
https://www.patsnap.com/resources/blog/rd-blog/metallic-glass-reliability-and-durability-patent-landscape/ · Patsnap · data cut-off 2026-07-31 · downloaded from the live page
Patent Landscape · Advanced Materials & Metallurgy
Metallic Glass Reliability and Durability Patents
  • Filing has cooled since its 2024 peak of 12. with the 2022 midpoint at just 2 families, the growth curve is flat-to-declining rather than accelerating.
  • Alloys and data storage dominate the claim space. C22C alloy compositions (80 records) and G11B storage media (72) together outweigh battery, semiconductor and filtration applications combined.
  • Japan and the US receive the bulk of filings. 81 Japanese and 73 US filings versus 33 at the EPO and 18 via PCT, showing activity concentrated in two national systems rather than spread globally.
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256
Published Records
30%
Top-5 Share of All Records
+71%
3-Yr Growth (lag-adjusted)
JP
Leading Jurisdiction
Published byPatsnap Research··6 min readSourced from Patsnap Eureka
Overview

What this landscape covers

This dataset tracks 256 patent families published between 2015 and mid-2026 that combine metallic glass, amorphous alloy or bulk metallic glass terminology with claims to fatigue durability, embrittlement resistance or long-term stability. It captures reliability engineering around amorphous metals rather than the base alloy chemistry alone, so it skews toward applications where a component has to survive repeated stress, thermal cycling or years of service.

The technology composition points to two established use cases carrying most of the filing weight: alloy compositions themselves (C22C) and magnetic/optical storage media (G11B), with magnetics, batteries, semiconductors and filtration trailing behind. Publication lags filing by roughly 18 months, so the 2025-2026 counts in any trend chart understate real activity.

Filing activity and technology mix, 2017-2026
  1. 1NIPPON STEEL CORPORATION17
  2. 2TOHOKU DAIGAKU KINZOKU ZAIRYO KENKYU SHOCHO17
  3. 3MITSUI PETROCHEMICAL INDUSTRIES LTD14
  4. 4THE JAPAN STEEL WORKS LTD14
  5. 5KITAMI INST OF TECH14
  6. 6MITSUI CHEMICALS INC11
  7. 7PROTERIAL LTD11
  8. 8KK TOSHIBA10
  9. 9AEGIS SEMICON8
  10. 10RICOH CO LTD8
Source: Patsnap Eureka. Assignee ranking and totals. Derived from a Patsnap search on Metallic Glass Reliability and Durability covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

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The Data

Filing trend and technology composition

Two views of the same 256-family dataset: how filing volume has moved year over year, and which IPC subclasses carry the claim density.

A peak in 2024, not a ramp

Filings rose from 8 in 2017 to a peak of 12 in 2024, but the 2022 midpoint sat at only 2 — the path there was uneven, not a steady climb, and the most recent partial year should be read with the 18-month publication lag in mind rather than as a real drop-off.

A peak in 2024, not a ramp03691282017201820192020202120222023122024202512026Most recent year is partial — publication lag means later filings are not yet visible.

Alloys and storage lead, batteries and semiconductors trail

C22C alloy claims (80) and G11B storage media (72) are the two largest subclasses by a wide margin over H01F magnetics (46), H01M batteries (31), B01D separation (21), H01L semiconductors (17), C21D heat treatment (15) and C01B inorganic compounds (14) — a spread that shows reliability claims following the alloy itself and its use in data storage more than newer application areas.

Alloys and storage lead, batteries and semiconductors trailC22C · Alloys8031.3%G11B · Information storage (magnetic/…7228.1%H01F · Magnets, inductors & transform…4618.0%H01M · Batteries, cells & fuel cells3112.1%B01D · Separation processes (filtrati…218.2%H01L · Semiconductor devices176.6%C21D · Heat treatment of metals155.9%C01B · Non-metallic elements & inorga…145.5%Other19375.4%

Shares are the percentage of the 256 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.

Source: Patsnap Eureka. Filing trend and technology composition. Derived from a Patsnap search on Metallic Glass Reliability and Durability covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.

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Key Patents

A representative filing and the most-cited prior art

Representative Filing
US20040140016A12004-07-22

US20040140016A1 — Iron-base amorphous alloy thin strip and iron core

NIPPON STEEL CORPORATION

Assigned to Nippon Steel Corporation, this filing claims an iron-base amorphous alloy thin strip produced by rapidly cooling molten metal onto a moving substrate through a slot-shaped nozzle, with an ultra-thin oxide layer of 5-20 nm on one or both surfaces of an amorphous phase containing 0.2-12 atomic % phosphorus, aimed at improved soft magnetic properties for iron cores.Filed 2004-07-22 — illustrates how early rapid-solidification and surface-oxide control claims in this space were staked out.

US20040140016A1 — patent drawing 1US20040140016A1 — patent drawing 2
View full filing
Most-cited records in this corpus
#Publication no.Patent titleCitations
1US20040129135A1Dense, layered membranes for hydrogen separation139
2US4951674ABiomagnetic analytical system using fiber-optic magnetic sensors134
3US20180151884A1High-capacity battery electrodes with improved binders, construction, and performance83
4US7001446B2Dense, layered membranes for hydrogen separation76
5US6416879B1Fe-based amorphous alloy thin strip and core produced using the same75
6US7486498B2Strong substrate alloy and compressively stressed dielectric film for capacitor with high energy density59
7US4318738AAmorphous carbon alloys and articles manufactured from said alloys55
8US20170183257A1Method for production of a coated, chemically prestressed glass substrate having Anti-fingerprint properties …53
9US20040140016A1Iron-base amorphous alloy thin strip excellent in soft magnetic properties, iron core manufactured by using s…48
10JP1976004017AKokyodo taihiro taizenmenfushoku taikoshoku taisukimafushoku taioryokufushokuware taisuisozeiseiyo amorufuasu…43

Citation counts favour older filings simply by virtue of time in the corpus; treat them as a measure of historical influence, not of which claims matter most today.

Each row carries its publication number; clicking a row searches Eureka by that number.

Source: Patsnap Eureka. Citation counts and representative records. Derived from a Patsnap search on Metallic Glass Reliability and Durability covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
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Insights

What the numbers mean for a filing decision

Three read-throughs from the trend, the technology split and the citation table.

Filing Momentum
8 → 12 → 1
2017 to peak-2024 to latest partial year

Activity has plateaued, not accelerated

The climb from 8 filings in 2017 to a peak of 12 in 2024 passed through a flat midpoint of only 2 in 2022. That unevenness, combined with a partial and understated latest year, argues against reading this as a technology in an upswing.

Trend data, 2017-2026
Claim Concentration
80 + 72 of 256
C22C alloys and G11B storage combined

Two subclasses carry most of the density

Alloy composition (C22C) and magnetic/optical storage media (G11B) together account for well over half the tracked records. Newer application areas — batteries, semiconductors, filtration — sit well behind, which is where claim space is comparatively less occupied.

IPC subclass distribution
Citation Signal
139 citations
Top-cited record, hydrogen separation membranes

The most-cited prior art is not the newest

The highest citation counts belong to older filings on membranes and magnetic sensing rather than to recent durability-specific claims. That is a corpus-age effect as much as a relevance signal, and should not be read as showing where current activity is concentrated.

Most-cited records table
Eureka AI Agent
Looking for what nobody has claimed yet?

Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to metallic glass reliability and durability, with the prior art for and against each one.

Find the white space →
Source: Patsnap Eureka. Co-assignee relationships and derived observations. Derived from a Patsnap search on Metallic Glass Reliability and Durability covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
Players

Who is filing, and where the field is open

Assignee activity in this corpus is led by Japanese research and industrial organisations, with a small number of recurring co-filing pairs and little momentum from any single named assignee in the most recent year.

Co-Filing Pattern
14 shared families
Strongest co-assignee pair

Collaboration is narrow and academic-industrial

Only 6 co-assignee pairs appear across the dataset. The strongest links an industrial steel manufacturer to a national technical university, suggesting durability claims here often originate from applied research partnerships rather than pure corporate R&D.

Co-assignee pairs, full corpus
Recent Momentum
0 in latest year
Across every top-momentum assignee tracked

No assignee is currently pulling ahead

Every named assignee tracked for recent-year momentum shows zero filings in the latest year. Combined with the flat overall trend, this points to a field where prior claims are largely settled rather than one being actively contested.

Recent-year momentum table
Geographic Filing
81 vs 73
Japan vs United States receiving offices

Two national systems dominate over PCT

Japan and the United States receive far more filings than the EPO, WIPO/PCT, Canada or India combined. A strategy built only around PCT or EPO coverage would miss most of where this art is actually being protected.

Receiving office counts
🔍
Under-claimed technical branches
Sub-areas where filing density is comparatively thin relative to the core alloy and storage claims
Battery electrode binder durabilitySemiconductor thin-film embrittlement resistanceFiltration membrane long-term stabilityHeat-treatment cycle fatigue control
Rank all filers by momentum →
Recent-year filing momentum by assignee
AssigneeRecent yearYoY
Mitsui Petrochemical Industries, Ltd.0
Institute for Materials Research, Tohoku University0
Japan Steel Works, Ltd.0
Nippon Steel Corporation0
Kitami Institute of Technology0
Toshiba Corporation0
Mitsui Chemicals, Inc.0
Bomaili Cheng Co., Ltd.0
Source: Patsnap Eureka. Assignee-level momentum. Derived from a Patsnap search on Metallic Glass Reliability and Durability covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
What's Next

Where to take this analysis

The dataset points to a mature, geographically concentrated field with specific thinner branches worth a closer look.

Map the under-claimed branches in detail

Battery, semiconductor and filtration applications of amorphous alloy durability carry a fraction of the filings that alloy composition and storage media do. A branch-level search would show whether that gap is genuine white space or simply unindexed under different terminology.

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Watch for the 18-month publication lag

The apparent drop to 1 filing in the latest year is very likely a reporting artefact rather than a real stop in activity. Re-running the trend in 12-18 months will give a truer picture of where filing stands today.

Track this topic in Eureka
Source: Patsnap Eureka. Forward-looking reading of the same dataset. Derived from a Patsnap search on Metallic Glass Reliability and Durability covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
FAQ

Common questions about this landscape

Answers are grounded in the same dataset. Derived from a Patsnap search on Metallic Glass Reliability and Durability covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company’s registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.

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