Metallography Patents: Who Leads, Where the Gaps Are 2026
- Filing has cooled since 2021. The peak year was 2021 at 7 families; by the 2022 midpoint filings were back down to 3, and the trend line since reads flat to declining rather than growing.
- China dominates the filing office split. 29 of the tracked records were filed at the Chinese patent office against 8 in the United States and single digits everywhere else, concentrating both prior art and design-around risk in one jurisdiction.
- Ownership is fragmented, not consolidated. Only four co-assignee pairs exist across 50 families and none of the six most visible assignees filed anything in the latest tracked year, pointing to a field of isolated filers rather than a race between a handful of leaders.
What this patent set covers
This landscape tracks 50 patent families filed between 2015 and mid-2026 that combine metallography or EBSD-based microstructure work with sample preparation, grain size measurement, phase quantification, texture analysis or automated imaging, classified under G01N1, G01N23 or G01N33. The core claim territory is material analysis and testing: every one of the 50 records sits in G01N, with image processing (G06T) and data recognition (G06K) appearing as secondary classifications on a minority of filings where automated imaging or machine-vision grain analysis is involved.
Because publication typically lags filing by around 18 months, the 2025 and 2026 counts in the trend chart are undercounts of true filing activity and should be read as provisional rather than as evidence of an accelerating decline.
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Filing trend and technology composition
Two views of the same 50-family dataset: how filing activity has moved year over year, and how those filings split across IPC subclasses.
A peak in 2021, then a pullback
Filings rose from 3 in 2017 to a peak of 7 in 2021, then fell back to 3 by 2022 and have not recovered. Read the final one or two years as partial given publication lag rather than as a confirmed drop-off.
Concentrated in G01N, with imaging as a secondary layer
All 50 records classify under G01N (material analysis and testing). Image data processing (G06T, 8 records) and data recognition (G06K, 7) show up where automated imaging or pattern-based grain/phase analysis is claimed, while shaping (B29C), polymer chemistry (C08F, C08L) and grinding (B24B) appear only as incidental secondary classes tied to sample-preparation substrates.
Shares are the percentage of the 50 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.
Go deeper on Metallography and Microstructure Characterization with Eureka
This page is one run against one query. Ask Eureka your own question about metallography and microstructure characterization and every answer comes back with the patent numbers behind it.
Try EurekaThe most-cited records in this set
GB2551868A — Colouring method for wrought aluminium alloy welded joint colour metallography
Filed by CRRC Qingdao Sifang, this patent claims a two-step colour metallography process: an acid pre-etch using a specific aqueous solution (defined Cl-, H+ and PO4 3- concentration ranges) heated to 55-65C and applied for 50-60 seconds, followed by immersion in a Weck reagent for 5-10 seconds with gentle agitation. The claims are tied to narrow, numerically bounded process parameters rather than the general concept of colour etching.Published 2018-01-03


| # | Publication no. | Patent title | Citations |
|---|---|---|---|
| 1 | CN1967197A | 一种制备铝硅铜系合金金相样品及显示组织的方法 | 30 |
| 2 | CN103913364A | 薄规格钢铁材料进行电子背散射衍射分析的样品制备方法 | 29 |
| 3 | WO2020223833A1 | 一种快速呈现多晶材料特定晶面分布特征的方法 | 24 |
| 4 | US3805035A | Device for the logical analysis of textures | 21 |
| 5 | US20170276577A1 | Colouring method for wrought aluminium alloy welded joint colour metallography | 15 |
| 6 | CN110514503A | 一种纯铜试样的制备方法 | 11 |
| 7 | CN105823671A | 一种中锰汽车用钢原奥氏体晶界的显示方法 | 10 |
| 8 | CN105928767A | 含镍钢EBSD分析用样品的制备方法 | 9 |
| 9 | US20180080884A1 | Macrotexture Map Visualizing Texture Heterogeneity in Polycrystalline Parts | 7 |
| 10 | CN113418946A | 一种金属钌的高标定率EBSD制样方法 | 6 |
Citation counts are drawn from within this searched corpus and skew toward older filings; treat them as a measure of influence on later filers, not of current commercial relevance.
Patent titles are shown in the language they were filed in, not translated, so that each record stays verifiable against the original filing — a translated title will not match in Eureka or in any national register. Each row carries its publication number; clicking a row searches Eureka by that number.
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Browse MCP servers →What the numbers say about this field
Three patterns stand out once the filing trend, geography and citation data are read together.
Growth has stalled since the 2021 peak
The filing count roughly halved between the 2021 peak and the 2022 midpoint and has not rebounded since. Combined with publication lag, this reads as a field where the early wave of claims has already been staked out rather than one still building momentum.
China is the dominant filing venue by a wide margin
Almost 60% of tracked filings went through the Chinese patent office, with the United States a distant second and Europe, India, the UK and Luxembourg each in single digits. Freedom-to-operate work should weight Chinese prior art heavily regardless of where a product will ultimately sell.
Older aluminium-alloy sample-prep patents anchor the citation graph
The most-cited records in this set are older Chinese and international filings on sample preparation for specific alloy systems and EBSD sample prep, rather than recent automated-imaging work. That is consistent with citation counts favouring age over current relevance in a searched corpus.
Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to metallography and microstructure characterization, with the prior art for and against each one.
Who is filing, and where the field is still open
Ownership across this dataset is fragmented: most assignees appear once, co-filing is rare, and none of the most visible names show activity in the latest tracked year.
Almost no joint filing
Only four co-assignee pairs exist in the entire dataset, the strongest being a tungsten-industry pairing that filed twice together. The overwhelming majority of the 50 families are single-assignee filings, which points to a fragmented field of independent filers rather than an emerging alliance structure.
Visible names have gone quiet recently
Every assignee in the recent-momentum tracking, including rail-equipment, steel and specialty-alloy filers, shows zero filings in the latest tracked year. That is consistent with the broader post-2021 slowdown and suggests current activity may be concentrated among filers not yet prominent in this set.
Filers span heavy industry rather than instrument makers
Assignees include rail rolling-stock manufacturers, steel producers, tungsten/hard-alloy specialists and hydropower operators, more than dedicated metallography-equipment or software vendors. That suggests much of this patenting is defensive or process-specific rather than aimed at selling characterization tools.
| Assignee | Recent year | YoY |
|---|---|---|
| CRRC Qingdao Sifang Co., Ltd. | 0 | — |
| UES INC | 0 | — |
| Lucite International Speciality Polymers & Resins | 0 | — |
| HBIS Company Limited | 0 | — |
| Xiamen Tungsten Co., Ltd. | 0 | — |
| Xiamen Golden Egret Special Alloy Co., Ltd. | 0 | — |
| Northeastern University (China) | 0 | — |
| LI DONGSHENG | 0 | — |
Where to take this analysis
This landscape is a starting point for freedom-to-operate and whitespace scoping, not a substitute for a full search.
Check citation-heavy prior art before filing
The highest-cited records in this set, including sample-preparation and EBSD-related filings, are the ones most likely to surface in an examiner's search. Review them directly rather than relying on the summary table alone.
Explore citation network in Eureka →Map the under-claimed sub-areas against your own process
Automated imaging and machine-vision phase work show lighter filing density than core sample-preparation claims. Run a targeted search against your specific process parameters before assuming the space is open.
Run a whitespace search in Eureka →Common questions about metallography and microstructure patents
This dataset tracks 50 patent families filed between 2015 and mid-2026 that combine metallography or EBSD-based microstructure analysis with sample preparation, grain size measurement, phase quantification, texture analysis or automated imaging, all classified under G01N1, G01N23 or G01N33. The true figure for very recent years is understated because publication typically lags filing by about 18 months. Anyone scoping a full freedom-to-operate search should treat 50 as a floor for this specific search definition, not a ceiling, since broader IPC or keyword choices would pull in more records.
Ownership in this dataset is fragmented rather than concentrated: only four co-assignee pairs exist across all 50 families, and the most visible names, including rail rolling-stock, steel and specialty-alloy manufacturers, show zero filings in the latest tracked year. This is a field of largely independent, single-assignee filers rather than one dominated by a small group of repeat filers. A ranking table sits alongside this analysis showing the specific assignees by family count.
Filing activity peaked at 7 families in 2021 and had fallen back to 3 by the 2022 midpoint, with no clear recovery in the years since. Part of that apparent drop is a publication-lag artifact, since the most recent one to two years are always undercounted at the time of any snapshot. But the multi-year decline from the 2021 peak is real enough that it likely also reflects the core sample-preparation and imaging techniques being already well claimed, pushing new filers toward narrower process variations rather than broad new claims.
GB2551868A claims a specific two-step colour metallography process for wrought aluminium alloy welded joints: an acid pre-etch at a defined temperature range and immersion time using a solution with specific ion concentrations, followed by a short Weck-reagent immersion step. Because the claims are tied to numerically bounded process parameters rather than the general concept of colour etching, work using different temperature, timing or reagent-concentration ranges, or applied to non-aluminium alloys or non-welded-joint samples, is likely to sit outside its claim scope. Anyone using acid pre-etch plus Weck-reagent colouring on aluminium welds specifically should review the granted claims in detail rather than relying on this summary.
The lightest overlap with the core G01N filing cluster shows up in automated EBSD grain-boundary segmentation, machine-vision-based phase quantification, and in-situ texture analysis performed during processing rather than after the fact, alongside sample-preparation etchants tuned for polymer-composite substrates and multi-material colour metallography. These branches show secondary-classification activity in G06T and G06K but are not the center of gravity of the filed claims. A first claim in these areas would typically need to tie a specific imaging or segmentation algorithm to a defined material system or process step, since broad claims on automated grain analysis generally risk overlap with existing sample-preparation and imaging prior art.
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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.
Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company’s registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.