Book a demo

Micro-LPBF Fine Features Patent Snapshot 2026

Micro-LPBF Fine Features Patent Snapshot 2026
Evidence Snapshot
Micro-LPBF Fine Features Patent Snapshot in 2026

The Micro-LPBF fine features patent space is a nascent, highly concentrated niche with only 8 patent families in scope, dominated by a French academic-industrial consortium whose co-filing activity accounts for the bulk of recorded activity. Annual volume has eased from its 2021 peak, and the field is currently characterized by a small number of closely clustered players rather than broad competitive pressure.

8
Patent families in scope
N/A
Concentration not assessed
N/A
Growth trend not assessed
China
Leading jurisdiction
↗ Tap any metric to explore the underlying patents and uncover deeper insights in Patsnap Eureka
Published byPatsnap Insights Team··5 min readVerified by Patsnap Eureka data
Overview

A tightly concentrated field led by a French academic-industry cluster

The top five filers — University of Liège, CNES, CNRS, Thales SA, and Université Toulouse III Paul Sabatier — together account for 71% of the ranked applicants visible in this query’ combined patent records, signalling an unusually compact visible assignee structure for an additive manufacturing sub-field.

The tier gap between the leading group and the remainder is pronounced: the top five organizations each hold 2 patent records, while all remaining applicants hold only 1 record each, leaving no meaningful second tier.

Leading applicants
#ApplicantPatent recordsShare
1University of Liège2
2Centre National d’Etudes Spatiales (CNES)2
3French National Centre for Scientific Research (CNRS)2
4Thales SA2
5Université Toulouse III Paul Sabatier2
6Nuclear Power Institute of China1
7Guangdong Institute of New Materials, Guangdong Academy of Sciences1
8Jiangsu Leidian Jiacheng Laser Technology Co., Ltd.1
9Shanghai Yunzhu 3D Technology Co., Ltd.1
↗ Hover a row · click a company to ask Eureka

The dominance of French public research institutions and Thales SA suggests that fundamental process and materials IP for micro-LPBF fine features is being anchored in the academic-aerospace axis; commercial equipment and materials entrants have yet to establish a comparable foothold.

Filing activity from approximately 2024 onward is subject to standard publication lag and likely understates true recent activity; conclusions about very recent momentum should be treated as provisional. Longer-window growth, applicant concentration, and technology-route coverage are therefore more reliable signals than the latest-year bar alone.

Source: Patsnap Eureka. Chart shows the top applicants ranked by patent records; the corpus total is measured in patent families. These figures use different units and should not be compared directly. This same dataset is now available on Patsnap Open Platform via MCP.Connect via MCP →
Trends & Structure

Sporadic filing history dominated by powder metallurgy and additive manufacturing classes

The annual filing trend reveals a small, intermittent corpus with a visible 2021 spike and a 2025 uptick, while the technology composition chart shows that all 8 patent families sit within B22F (powder metallurgy) and B33Y (additive manufacturing), with alloy science (C22C) forming a secondary layer.

Annual filing trend

Activity first appeared in 2019, peaked at 2 filings in 2021, dropped to zero in 2022–2023, then recovered to 3 in 2025 and 1 in 2026; the 2024–2026 window should be read as a lower-bound estimate due to publication lag, so the apparent recent uptick may be larger than currently visible.

Annual filing trendAnnual values from 2017 to 2026, peaking at 3 in 2025.02017020181201902020220210202202023120243202512026↗ Hover for values · click a bar to ask Eureka

Technology composition

B22F (powder metallurgy) and B33Y (additive manufacturing) each cover all 8 patent records, confirming that every filing addresses both the process and the broader AM classification simultaneously; C22C (alloys) appears in 4 records, indicating that roughly half the corpus extends into material composition claims.

Technology compositionB22F · Powder metallurgy leads with 8; B33Y · Additive manufacturing (3D printing) 8.B22F · Powder metallurgy8B33Y · Additive manufact…8C22C · Alloys4↗ Hover for values · click a bar to ask Eureka
Source: Patsnap Eureka. Technology-branch counts are measured in patent records; a single patent family can carry several IPC classes, so class totals can exceed the family total in scope.Explore deeper in Eureka →
Key Patents

Highly cited patent families surfaced by the query

Citation-heavy patent families returned by the query. Use this section as citation context, not as a curated list of the most topic-specific patents.

Featured patent
WO2025202196A1Published 2025-10-02

Graphite-based steel alloy and method for producin…

UNIVERSITÉ De LIÈGE

The present invention relates to a process for producing a steel alloy part, which includes providing a steel alloy powder mixture containing SiC, forming the part from the powder mixture using an additive manufacturing technique, and subjecting the formed part to a thermal treatment for a duration of 1 to 150 minutes at a temperature ranging from 600°C to… (excerpt from the patent abstract)

Graphite-based steel alloy and method for producin… — patent drawingGraphite-based steel alloy and method for producin… — patent drawing
Representative drawings from the patent document.
Open this patent in Eureka →
Highly cited patent families surfaced by this query
#PatentCitations
1Method for manufacturing a multi-material part by …8
2一种适用于激光选区熔化的金属3D打印的落粉与刮粉装置5
3一种适用于SLM金属3D打印机的供粉装置1

Ranked by total forward citations. Citation counts favour older and broadly cited patent families, and broad or adjacent patents may appear when they match the search scope. Treat this section as citation context, not as a curated list of the most topic-specific patents. Some patent titles may be shown in their original, non-English language where an accurate translation could not be guaranteed.

Source: Patsnap Eureka. Citation-ranked patent families surfaced by this query.Open in Eureka →
Visible assignees

Assignee snapshot from the current evidence set

The applicants below are visible in this query result. Because the evidence set is relatively small, read this section as a directional snapshot rather than a full competitive ranking.

Leader · University of Liège

University of Liège

University of Liège holds 2 patent records concentrated entirely in B22F powder metallurgy sub-classes (B22F 1, B22F 10, B22F 5), indicating a process-focused research agenda. Momentum data mark it as a new entrant, suggesting its position was established recently rather than through sustained multi-year filing — making it a nascent but technically grounded player rather than an entrenched incumbent.

patent records: 2
Challenger · Thales SA

Thales SA

Thales SA holds 2 patent records with a technology focus spanning B22F 1, B22F 10, and B22F 12 — the broadest sub-class coverage among all applicants in this cluster. As the only large commercial entity in the top tier, Thales anchors the industrial application angle of the French consortium’s collaborative programme, particularly relevant for aerospace and defense component fabrication.

patent records: 2
🔍
More assignee evidence is available in Eureka
Use Eureka to validate whether these visible assignees remain central after refining the query scope and adding related patent classes.
CNES (Centre National d’Etudes Spatiales)Nuclear Power Institute of China+ more
Unlock full assignee analysis →
Source: Patsnap Eureka. Assignee evidence is drawn from the current PatSnap Eureka query. In small evidence sets, applicant counts should be treated as directional signals, not a complete competitive ranking.Explore players →
Frequently asked questions

Frequently asked questions

Still have questions? Patsnap Eureka answers them from patent and research data.Ask Eureka →

Built on Patsnap Open Platform

This report’s underlying patent dataset — filings, assignees, technology clusters — is open for developers via MCP and REST API. Free to start, 10,000 credits, no credit card required.

Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

Explore in Eureka ↗
Powered by Patsnap Eureka

Help us improve this page

Found incorrect or outdated information? Let us know and we'll get it fixed.