A micro-supercapacitor current collector is the conductive structure — typically a metal film, printed wire mesh, or coated foil — that carries charge between the electrode material and the external circuit in a miniaturised supercapacitor cell. Because micro-supercapacitors are built at chip or microsystem scale, the collector's geometry and fabrication method directly determine achievable surface area, conductivity and integration compatibility with printed electronics. The patent activity in this dataset matters because it shows fabrication process, not just materials chemistry, is where most recent filing effort is going, particularly laser-based direct patterning and additive manufacturing.

The ranked assignee list in this dataset covers 21 companies and research institutions, with the leader holding 5 records and filing concentrated toward the top: the top 5 assignees account for 50.0% of all 36 records in scope, and the top 10 account for 77.8%. That leaves a long tail of single- or double-filing entrants below the leaders. The filers visible in this dataset are predominantly Korean and Chinese universities and government research institutes rather than established battery or capacitor manufacturers, which suggests the field is still largely at the academic-to-early-commercial stage.

Every record in this dataset is classified under H01G (capacitors), and the largest secondary classifications are welding, soldering and brazing (B23K, 11.1% of records) and additive manufacturing/3D printing (B33Y, 8.3% of records). This pattern indicates that laser-based and printed-structure fabrication methods are the most actively claimed process routes for building the collector itself, ahead of polymer-based or powder-metallurgy approaches, which each appear in only one or two records. Readers should treat this as where claim density already sits, not as a signal that other fabrication routes are technically inferior.

Filings grew from 1 in 2021 to 4 in 2024, a +300% increase over that three-year span, and 2018 remains the highest single year recorded so far at 5 filings. The apparent decline in 2025 and 2026 is not a real slowdown: patent publication typically lags actual filing by around 18 months, so the most recent one to two years in any filing trend are always undercounted until later publications catch up. Anyone tracking this space should expect 2025 and 2026 figures to rise as more records publish, and should not read current-year dips as reduced R&D interest.

The thinnest branches in this dataset are powder-metallurgy-based collector fabrication (B22F, one record) and polymer-composite conductor systems spanning C08J, C08K and C08L (two records each), all of which sit as add-ons to the near-universal H01G capacitor classification rather than as a separate, crowded art base. Co-assignee clustering in this dataset is also limited to two institutional pairs, and neither sits in the polymer or powder-metallurgy branches, suggesting these areas have not yet drawn coordinated multi-institution filing. A new entrant targeting a structurally distinct collector design — rather than incremental improvements to the heavily-cited gel-electrolyte or planar-asymmetric designs — has more room to establish a defensible position there.