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When you want the answer in the next five minutes.
The agent works the prompt against patents and technical literature, citing every source.
Run your analysis now →This dataset tracks patent families where the claims or description explicitly address cycling stability, capacitance retention, bending durability or self-discharge suppression in micro-supercapacitors and on-chip supercapacitors — not general electrode or electrolyte chemistry filings that happen to mention a device. The IPC scope is anchored on H01G11/26 and H01G11/32, the capacitor subclasses covering electric double-layer and hybrid capacitor construction.
Coverage runs from 2015 through the 2026 data cut-off. Because publication typically lags filing by around 18 months, the most recent one to two years in any trend line will understate actual filing activity; treat the tail of the chart as provisional rather than a real decline.
Pick a task. Every answer cites the patents behind it.
Twenty-one families make this a narrow, specialist corpus rather than a broad one — the patterns below are indicative of where durability-specific claims have concentrated, not a full picture of micro-supercapacitor patenting overall.
Filings rose to 12 in 2018 and have not approached that level again; the 2022 midpoint sits at just 1 record. Read the final year or two as undercounted given publication lag, but the multi-year plateau before that is real.
Every record in this set carries an H01G classification, confirming the corpus is correctly scoped to capacitor construction. H10N (solid-state devices), C01B, H01B and H01M each appear only once or twice, marking them as touched-but-not-developed adjacencies rather than active claim fronts.
Shares are the percentage of the 21 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.
This page is one run against one query. Ask Eureka your own question about micro-supercapacitor reliability and durability and every answer comes back with the patent numbers behind it.
Try EurekaAn on-chip supercapacitor has an electrode that includes one-dimensional silicon nanostructures coated with a first layer of titanium nitride, with a second layer of manganese dioxide deposited on the first layer. The associated method provides the nanostructures on a silicon substrate before applying both coatings in sequence.Filed by University of South-Eastern Norway; granted as US11101082B2 on 2021-08-24.


| # | Publication no. | Patent title | Citations |
|---|---|---|---|
| 1 | US20140376158A1 | Yarn-type micro-supercapacitor method for fabricating same | 18 |
| 2 | WO2018162580A2 | Deposited carbon film on etched silicon for on-chip supercapacitor | 9 |
| 3 | US20170309409A1 | Elastic fiber electrode, micro-supercapacitor using same, and preparation method therefor | 8 |
| 4 | WO2018162479A1 | On-chip supercapacitor with silicon nanostructure | 6 |
| 5 | US10446330B2 | Elastic fiber electrode, micro-supercapacitor using same, and preparation method therefor | 4 |
| 6 | US20200013560A1 | Deposited carbon film on etched silicon for on-chip supercapacitor | 3 |
| 7 | US9514892B2 | Yarn-type micro-supercapacitor method for fabricating same | 3 |
Citation counts are drawn from within this searched corpus and favour older filings; use them as a signal of influence on later claim drafting, not of present-day commercial relevance.
Publication numbers are shown where the record carries one (7 of 7 rows); clicking a row searches Eureka by that number.
When you want the answer in the next five minutes.
The agent works the prompt against patents and technical literature, citing every source.
Run your analysis now →When it has to run inside your own pipeline.
Patent search, landscape analysis and assignee resolution as MCP tools. Drop them into any agent framework, or call REST directly.
Browse MCP servers →The signal in a 21-family corpus is in its shape, not its size: where citations cluster, where classification is thin, and where the trend line actually points.
US20140376158A1, covering a yarn-type micro-supercapacitor fabrication method, carries 18 citations — more than double the next record. Fiber and elastic-electrode filings that followed, including US20170309409A1 and US10446330B2 on elastic fiber electrodes, sit downstream of it.
The 2022 midpoint of 1 filing, against a 2018 peak of 12, points to a field that had a burst of interest and then went quiet rather than one that is scaling. New entrants face less recent competing art than the peak year would suggest.
H10N (other electric solid-state devices) appears in 4 of 21 records, ahead of C01B, H01B and H01M at 2 each. That makes solid-state integration the most-explored adjacency to durability claims, though still far behind the H01G core.
Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to micro-supercapacitor reliability and durability, with the prior art for and against each one.
Recent-year momentum across the tracked assignees is uniformly flat: every named organisation in this set shows zero filings in the latest year, including a documented year-on-year drop for one filer. That is consistent with a corpus that peaked in 2018 and has not re-accelerated.
University of South-Eastern Norway, Hanyang University, Université Marie et Louis Pasteur, Northwestern University and Carnegie Mellon University all register zero filings in the most recent tracked year. This is a field where the named leaders built a position earlier and have not returned to it recently in this dataset.
Jain Deemed to be University is the one assignee in this set with an explicit year-on-year figure: a 100% decline to zero in the latest year, following at least one prior year of activity.
With 21 families spread across a mix of universities and research institutions, this is a fragmented field rather than one with a clear commercial leader. That fragmentation is itself informative for freedom-to-operate work: no single blocking portfolio has to be cleared.
| Assignee | Recent year | YoY |
|---|---|---|
| University of South-Eastern Norway | 0 | — |
| Hanyang University | 0 | — |
| Université Marie et Louis Pasteur | 0 | — |
| Northwestern University | 0 | — |
| Carnegie Mellon University | 0 | — |
| JAIN DEEMED TO BE UNIV | 0 | -100% |
The dataset points to specific next steps depending on whether the reader is scouting freedom-to-operate, licensing targets, or open claim space.
Any filing touching yarn-type or elastic fiber electrodes should be checked against US20140376158A1 and its citing family before drafting, given how much of the field's citation weight sits there.
Run a citation check in EurekaAdditive-manufactured electrode arrays and self-discharge suppression circuitry each appear in only a handful of records — a well-scoped first claim in either could sit ahead of meaningful prior art.
Explore white space in EurekaIn this dataset, a record only qualifies if its claims or description explicitly address cycling stability, capacitance retention, bending durability or self-discharge suppression, not just supercapacitor construction generally. The IPC scope is anchored on H01G11/26 and H01G11/32, the electric double-layer and hybrid capacitor construction subclasses. This means a general electrode-material patent that never discusses degradation or retention over cycling would not appear here, even if it is used in a micro-supercapacitor.
The data shows 12 filings in 2018 against just 1 at the 2022 midpoint, a clear plateau rather than sustained growth. Some of the apparent recent decline is a publication-lag artefact: filings typically take around 18 months to publish, so the last one to two years in any trend chart will always look lower than they eventually turn out to be. But the multi-year gap between 2018 and 2022 predates that lag window and reflects a genuine slowdown in this narrowly-scoped claim area.
The most-cited record in this corpus is a yarn-type micro-supercapacitor fabrication method with 18 citations, well ahead of on-chip silicon-based approaches and elastic fiber electrode filings that follow it. Named assignees in the tracked ranking include University of South-Eastern Norway, Hanyang University, Université Marie et Louis Pasteur, Northwestern University, Carnegie Mellon University and Jain Deemed to be University, though all show zero filings in the most recent tracked year. No single organisation holds a dominant, actively-growing position based on this evidence.
Classification data shows every record sits in H01G, but adjacent classes are thin: H10N appears in 4 of 21 records, while C01B, H01B and H01M appear in only 2 each, and B33Y and C09D appear once each. That means additive-manufactured electrode structures, ink-based conductive coatings and self-discharge suppression circuitry are documented as concepts but not built out into dense claim families. A first-filer with a specific, well-drafted claim in one of these adjacencies would face comparatively little competing art in this corpus.
US11101082B2 claims an on-chip supercapacitor electrode built from one-dimensional silicon nanostructures coated first with titanium nitride and then with manganese dioxide, plus the method of building that electrode on a silicon substrate. It was granted to University of South-Eastern Norway on 2021-08-24. Anyone working on silicon-based on-chip supercapacitor electrodes with a similar dual-layer coating structure should review its claim scope directly, since it sits in the same IPC space as several other highly-cited records in this corpus.
Go past this page: query the whole micro-supercapacitor reliability and durability corpus yourself, in your own scope.
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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.
Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company's registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.