https://www.patsnap.com/resources/blog/rd-blog/micro-supercapacitor-reliability-and-durability-patent-landscape/ · Patsnap · data cut-off 2026-07-31 · downloaded from the live page
Patent Landscape · Supercapacitors
Micro-Supercapacitor Reliability and Durability Patents
  • Filing peaked in 2018 at 12 records and has not returned to that level since — activity around cycling stability and capacitance retention claims has gone flat, not upward, through the most recent full years of data.
  • One 2014 yarn-type electrode filing carries 18 citations, more than double the next most-cited record — it anchors a large share of the prior art that later filers in fiber and elastic electrodes have had to design around.
  • H01G accounts for every record in this set, but H10N, C01B and H01B each appear only a handful of times — adjacent material and fabrication classes are touched, not built out, leaving room for claims that combine them more deliberately.
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21
Published Records
95%
Top-5 Share of All Records
US
Leading Jurisdiction
6
Active Filers Ranked
Published byPatsnap Research··6 min readSourced from Patsnap Eureka
Overview

What this landscape covers

This dataset tracks patent families where the claims or description explicitly address cycling stability, capacitance retention, bending durability or self-discharge suppression in micro-supercapacitors and on-chip supercapacitors — not general electrode or electrolyte chemistry filings that happen to mention a device. The IPC scope is anchored on H01G11/26 and H01G11/32, the capacitor subclasses covering electric double-layer and hybrid capacitor construction.

Coverage runs from 2015 through the 2026 data cut-off. Because publication typically lags filing by around 18 months, the most recent one to two years in any trend line will understate actual filing activity; treat the tail of the chart as provisional rather than a real decline.

Filing activity, 2017-2026
  1. 1University of South-Eastern Norway12
  2. 2Hanyang University4
  3. 3Université Marie et Louis Pasteur2
  4. 4Northwestern University1
  5. 5Carnegie Mellon University1
  6. 6JAIN DEEMED TO BE UNIV1
Source: Patsnap Eureka. Assignee ranking and totals. Derived from a Patsnap search on Micro-Supercapacitor Reliability and Durability covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

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The Data

Filing trend and technology composition

Twenty-one families make this a narrow, specialist corpus rather than a broad one — the patterns below are indicative of where durability-specific claims have concentrated, not a full picture of micro-supercapacitor patenting overall.

A peak in 2018, then a flat line

Filings rose to 12 in 2018 and have not approached that level again; the 2022 midpoint sits at just 1 record. Read the final year or two as undercounted given publication lag, but the multi-year plateau before that is real.

A peak in 2018, then a flat line03691202017122018201920202021202220232024202502026Most recent year is partial — publication lag means later filings are not yet visible.

Concentrated in H01G, thin elsewhere

Every record in this set carries an H01G classification, confirming the corpus is correctly scoped to capacitor construction. H10N (solid-state devices), C01B, H01B and H01M each appear only once or twice, marking them as touched-but-not-developed adjacencies rather than active claim fronts.

Concentrated in H01G, thin elsewhereH01G · Capacitors21100.0%H10N · Other electric solid-state dev…419.0%C01B · Non-metallic elements & inorga…29.5%H01B · Cables, conductors & insulators29.5%H01M · Batteries, cells & fuel cells29.5%B33Y · Additive manufacturing (3D pri…14.8%C09D · Coatings, paints & inks14.8%H10P14.8%

Shares are the percentage of the 21 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.

Source: Patsnap Eureka. Filing trend and technology composition. Derived from a Patsnap search on Micro-Supercapacitor Reliability and Durability covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.

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Key Patents

The most-cited prior art

Representative filing
US11101082B22021-08-24

On-chip supercapacitor with silicon nanostructure

UNIVERSITY OF SOUTH-EASTERN NORWAY

An on-chip supercapacitor has an electrode that includes one-dimensional silicon nanostructures coated with a first layer of titanium nitride, with a second layer of manganese dioxide deposited on the first layer. The associated method provides the nanostructures on a silicon substrate before applying both coatings in sequence.Filed by University of South-Eastern Norway; granted as US11101082B2 on 2021-08-24.

US11101082B2 — patent drawing 1US11101082B2 — patent drawing 2
View full record
Most-cited records in this corpus
#Publication no.Patent titleCitations
1US20140376158A1Yarn-type micro-supercapacitor method for fabricating same18
2WO2018162580A2Deposited carbon film on etched silicon for on-chip supercapacitor9
3US20170309409A1Elastic fiber electrode, micro-supercapacitor using same, and preparation method therefor8
4WO2018162479A1On-chip supercapacitor with silicon nanostructure6
5US10446330B2Elastic fiber electrode, micro-supercapacitor using same, and preparation method therefor4
6US20200013560A1Deposited carbon film on etched silicon for on-chip supercapacitor3
7US9514892B2Yarn-type micro-supercapacitor method for fabricating same3

Citation counts are drawn from within this searched corpus and favour older filings; use them as a signal of influence on later claim drafting, not of present-day commercial relevance.

Publication numbers are shown where the record carries one (7 of 7 rows); clicking a row searches Eureka by that number.

Source: Patsnap Eureka. Citation counts and representative records. Derived from a Patsnap search on Micro-Supercapacitor Reliability and Durability covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
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Insights

What the numbers mean for a filing decision

The signal in a 21-family corpus is in its shape, not its size: where citations cluster, where classification is thin, and where the trend line actually points.

Citation concentration
18 citations
on the top-cited record

One yarn-type filing anchors the field

US20140376158A1, covering a yarn-type micro-supercapacitor fabrication method, carries 18 citations — more than double the next record. Fiber and elastic-electrode filings that followed, including US20170309409A1 and US10446330B2 on elastic fiber electrodes, sit downstream of it.

Prior art to clear before drafting fiber-electrode claims.
Filing trend
12 in 2018
peak year, not sustained

Activity has not compounded since its peak

The 2022 midpoint of 1 filing, against a 2018 peak of 12, points to a field that had a burst of interest and then went quiet rather than one that is scaling. New entrants face less recent competing art than the peak year would suggest.

Read the final years as understated due to publication lag.
Classification spread
H10N: 4 records
largest adjacent class

Solid-state device crossover is the biggest adjacency

H10N (other electric solid-state devices) appears in 4 of 21 records, ahead of C01B, H01B and H01M at 2 each. That makes solid-state integration the most-explored adjacency to durability claims, though still far behind the H01G core.

Additive manufacturing (B33Y) and coatings (C09D) each appear only once.
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Looking for what nobody has claimed yet?

Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to micro-supercapacitor reliability and durability, with the prior art for and against each one.

Find the white space →
Source: Patsnap Eureka. Co-assignee relationships and derived observations. Derived from a Patsnap search on Micro-Supercapacitor Reliability and Durability covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
Players

Who holds the durability claims

Recent-year momentum across the tracked assignees is uniformly flat: every named organisation in this set shows zero filings in the latest year, including a documented year-on-year drop for one filer. That is consistent with a corpus that peaked in 2018 and has not re-accelerated.

Momentum
0 in latest year
across all tracked assignees

No assignee is currently active

University of South-Eastern Norway, Hanyang University, Université Marie et Louis Pasteur, Northwestern University and Carnegie Mellon University all register zero filings in the most recent tracked year. This is a field where the named leaders built a position earlier and have not returned to it recently in this dataset.

Publication lag means very recent filings may not yet be visible.
Sharpest pullback
-100% YoY
Jain Deemed to be University

One filer shows a documented drop

Jain Deemed to be University is the one assignee in this set with an explicit year-on-year figure: a 100% decline to zero in the latest year, following at least one prior year of activity.

A useful marker of where activity has stopped rather than paused.
Long tail
21 families total
across the ranking

No single assignee dominates the ranking

With 21 families spread across a mix of universities and research institutions, this is a fragmented field rather than one with a clear commercial leader. That fragmentation is itself informative for freedom-to-operate work: no single blocking portfolio has to be cleared.

Useful for licensing scouts as much as for FTO counsel.
🔍
Under-claimed sub-areas
Branches touched by only one or two records in this corpus — candidates for a first, well-drafted claim rather than crowded space.
Additive-manufactured microelectrode arraysTitanium nitride / MnO2 dual-layer coatingsSelf-discharge suppression circuitrySilicon nanostructure current collectorsInk-based conductive coatings for flexible cells
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Recent-year filing momentum by assignee
AssigneeRecent yearYoY
University of South-Eastern Norway0
Hanyang University0
Université Marie et Louis Pasteur0
Northwestern University0
Carnegie Mellon University0
JAIN DEEMED TO BE UNIV0-100%
Source: Patsnap Eureka. Assignee-level momentum. Derived from a Patsnap search on Micro-Supercapacitor Reliability and Durability covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
What's Next

Where to take this

The dataset points to specific next steps depending on whether the reader is scouting freedom-to-operate, licensing targets, or open claim space.

Check fiber and elastic-electrode claims against the top-cited art

Any filing touching yarn-type or elastic fiber electrodes should be checked against US20140376158A1 and its citing family before drafting, given how much of the field's citation weight sits there.

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Model the under-claimed adjacencies before filing

Additive-manufactured electrode arrays and self-discharge suppression circuitry each appear in only a handful of records — a well-scoped first claim in either could sit ahead of meaningful prior art.

Explore white space in Eureka
Source: Patsnap Eureka. Forward-looking reading of the same dataset. Derived from a Patsnap search on Micro-Supercapacitor Reliability and Durability covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
FAQ

Common questions

Answers are grounded in the same dataset. Derived from a Patsnap search on Micro-Supercapacitor Reliability and Durability covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company's registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.