https://www.patsnap.com/resources/blog/rd-blog/microwave-and-dielectric-industrial-heating-patent-landscape/ · Patsnap · data cut-off 2026-07-31 · downloaded from the live page
Patent Landscape · Updated 2026
Microwave and Dielectric Industrial Heating Patents: Filing Trends and Leading Assignees
  • Filing peaked in 2017 at 243 records, and the complete-year trend from 2021 to 2024 shows a 52% decline, from 127 to 61 filings.
  • The top 10 assignees hold 21.9% of all 3,406 records, concentrated at the top but with a long tail of single- and low-filing entrants making up the ranked leaders.
  • H05B electric heating circuits lead technology composition at 21.2% of records, while medical and food-processing classes (A61B, A61N, A23L) show the field extends well beyond industrial applicators.
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3,406
Published Records
16%
Top-5 Share of All Records
-52%
Filing Growth 2021→2024
US
Leading Jurisdiction

Filing growth compares 2021 (127 records) with 2024 (61) — a three-year span. 2024 is the most recent year we treat as complete: publication lags filing by roughly 18 months, so 2025 onwards are still filling in and any growth rate that ends there would understate the field. Top-5 share is the combined record count of the five largest assignees divided by all 3,406 records in scope (CR5), not by the ranked leaders only.

Published byPatsnap Research··7 min readSourced from Patsnap Eureka
Overview

What the patent record shows

Microwave and dielectric heating patents span a wider technical territory than the applicator and cavity-design work the search terms target directly. Alongside penetration depth, hot spot avoidance and cavity impedance matching, the corpus pulls in a substantial share of medical electrotherapy, food processing and semiconductor-adjacent filings that use the same underlying physics. That breadth matters for anyone scoping freedom-to-operate: a search built only around industrial heating vocabulary will miss prior art sitting in surgical and food-safety classifications.

Filing activity peaked in 2017 and the most recent complete years show a clear pull-back. Publication lags filing by roughly 18 months, so 2025 and 2026 figures are still filling in and should not be read as confirmation that interest has cooled further than the data already shows.

Filing activity by year, 2017–2026
  1. 1SEMICON ENERGY LAB CO LTD303
  2. 2MARKFORGED INC96
  3. 3AVEDRO INC54
  4. 4HARRIS CORP53
  5. 5ADVANCED TECHNOLOGY EMISSION SOLUTIONS INC50
  6. 6COMETEER INC46
  7. 7CELSION CORP40
  8. 8DOW GLOBAL TECHNOLOGIES LLC36
  9. 9CORNING INC36
  10. 10TECHNOLOGICAL RESOURCES PTY LTD33
Source: Patsnap Eureka. Assignee ranking and totals. Derived from a Patsnap search on Microwave and Dielectric Industrial Heating covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
The Numbers

Filing trend and technology composition

Two views of the same 3,406 records: how filing volume has moved year over year, and which IPC subclasses carry the claim density.

A 2017 peak followed by a documented pull-back

Filings ran from 243 in 2017 down to 7 in the partial 2026 year. The reliable comparison is 2021 to 2024, where volume fell 52%, from 127 to 61 records — a decline worth reading against the 18-month publication lag rather than as a sign the field has stopped.

A 2017 peak followed by a documented pull-back06312518825024320172018201920202021202220232024202572026Most recent year is partial — publication lag means later filings are not yet visible.

H05B dominates, but the field reaches into four other domains

H05B electric heating circuits cover 21.2% of the 3,406 records, the single largest share. A61B, H01L, A61N and B01J each carry between 7.8% and 9.9%, and A23L food processing and B29C plastics shaping round out the picture — evidence that dielectric heating claims are being filed as much for medical and food applications as for industrial process equipment.

H05B dominates, but the field reaches into four other domainsH05B · Electric heating & lighting ci…72321.2%A61B · Diagnosis & surgery3379.9%H01L · Semiconductor devices3209.4%A61N · Electrotherapy & radiation the…2908.5%B01J · Chemical/physical processes & …2647.8%A23L · Foods & non-alcoholic beverages2427.1%A61F · Implants & prostheses1825.3%B29C · Shaping of plastics1514.4%Other3,810111.9%

Shares are the percentage of the 3,406 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.

Source: Patsnap Eureka. Filing trend and technology composition. Derived from a Patsnap search on Microwave and Dielectric Industrial Heating covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.

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Key Patents

Representative and most-cited filings

Representative Recent Filing
US20260040414A12026-02-05

Microwave-assisted processing apparatus, microwave heating device, and use of same

TRUMPF HÜTTINGER GMBH + CO. KG

A microwave-assisted processing apparatus pairs a deformation apparatus that changes the shape of a body with a microwave heating device built from semiconductor-based power amplifiers driving individual microwave antennas at ≥100 W each. The amplifiers are independently adjustable in power and phase, and antenna orientation and emission characteristics are configured relative to one another — a solid-state, phase-controlled approach to directing energy onto a workpiece rather than relying on a single fixed magnetron source.Filed 2026-02-05 by TRUMPF Hüttinger GmbH + Co. KG.

US20260040414A1 — patent drawing 1US20260040414A1 — patent drawing 2
View full filing →
Most-cited records in the dataset
#Publication no.Patent titleCitations
1US20070241482A1Production of three-dimensional objects by use of electromagnetic radiation609
2US6216540B1High resolution device and method for imaging concealed objects within an obscuring medium543
3US5904709AMicrowave treatment for cardiac arrhythmias543
4US5344435AUrethral inserted applicator prostate hyperthermia525
5US20150335288A1Modular physiologic monitoring systems, kits, and methods468
6US6391026B1Methods and systems for treating breast tissue468
7US5519195AMethods and devices used in the microwave heating of foods and other materials408
8US5190539AMicro-heat-pipe catheter397
9US4557272AMicrowave endoscope detection and treatment system375
10US6788977B2System and method for heating the prostate gland to treat and prevent the growth and spread of prostate tumor373

Citation counts favour older records inside any searched corpus; treat them as a signal of influence rather than of current technical importance.

Each row carries its publication number; clicking a row searches Eureka by that number.

Source: Patsnap Eureka. Citation counts and representative records. Derived from a Patsnap search on Microwave and Dielectric Industrial Heating covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
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Insights

What the data means for R&D and IP planning

Three read-outs from the filing trend, the citation table and the technology composition that matter for anyone deciding where to file next.

Filing Momentum
-52%
2021 → 2024 filings

The documented decline is real but not the whole story

Complete-year data shows filings falling from 127 in 2021 to 61 in 2024. Because publication lags filing by about 18 months, 2025 and 2026 volumes are still incomplete — the honest reading is a cooling trend through 2024, not a collapse through the present.

Based on complete-year filing counts.
Technology Spread
21.2%
H05B share of records

Electric heating circuits carry the densest claim space

H05B is the largest single IPC subclass at 21.2% of the 3,406 records, but four other classes each clear 7.8% or more. That spread means applicator and cavity-design claims sit alongside heavy activity in medical electrotherapy and food processing under the same search terms.

Class shares sum to more than 100% because records carry multiple IPC codes.
Citation Influence
609 citations
Top-cited record

Influence in this corpus skews toward older, foundational filings

The most-cited record, on production of three-dimensional objects using electromagnetic radiation, carries 609 citations — well ahead of the next tier. High citation counts here mark early, broadly-drafted claims rather than currently active filing fronts.

Citation counts favour older records in any searched corpus.
Eureka AI Agent
Looking for what nobody has claimed yet?

Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to microwave and dielectric industrial heating, with the prior art for and against each one.

Find the white space →
Source: Patsnap Eureka. Co-assignee relationships and derived observations. Derived from a Patsnap search on Microwave and Dielectric Industrial Heating covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
Players

Who holds the claim space

The ranked leaders cover 100 companies from the data endpoint's full return — not a top-50 or top-100 cut. Filing is concentrated at the top but with plenty of room below it.

Leader Position
303 records
Leading assignee

One filer sits well ahead of the field

The top-ranked assignee holds 303 records, more than five times the fifth-place count of 50. That gap suggests a single filer with sustained, broad-based investment in this claim space rather than a cluster of comparably sized competitors.

Counted in patent families across the ranking.
Top 5 Concentration
16.3%
Share of all 3,406 records

The top five hold a meaningful but not dominant slice

The five leading assignees combine for 556 records, 16.3% of all records in scope. That leaves the large majority of filing activity spread across the remaining ranked leaders and unranked entrants.

Share calculated against the full 3,406-record dataset.
Top 10 Concentration
21.9%
Share of all 3,406 records

Concentration grows slowly past the leader

Extending from five to ten assignees adds only another 5.6 percentage points of coverage, up to 21.9% of the 3,406 records. The long tail below the leading names is where most of the field's activity actually sits.

Top 10 combined = 747 records.
🔍
Under-claimed branches worth a closer look
Sub-areas where filing density is thinner relative to the core applicator and circuit claims.
Solid-state phase-array antenna controlReal-time hot-spot feedback correctionMagnetron-to-solid-state amplifier retrofit pathsMulti-antenna power/phase synchronisationLeakage shielding for modular cavity arrays
Rank all filers by momentum →
Recent-year momentum among named assignees
AssigneeRecent yearYoY
Semiconductor Energy Laboratory Co., Ltd.0-100%
Markforged Inc.0—
Avedro Inc.0—
Harris Corp0—
Avedro Inc.0—
Merz GmbH0—
Advanced Technology Emission Solutions Inc.0—
Dow Global Technologies LLC0—
Source: Patsnap Eureka. Assignee-level momentum. Derived from a Patsnap search on Microwave and Dielectric Industrial Heating covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
What's Next

Where to take this

The filing trend and class composition point to specific next steps depending on whether the goal is freedom-to-operate, licensing, or new filing strategy.

Map claims against the solid-state amplifier shift

The representative 2026 filing shows phase-controlled, semiconductor-amplifier architectures replacing single-magnetron designs. Anyone filing new applicator claims should check how much of that transition is already covered.

Explore the technology shift in Eureka →

Check adjacent-class prior art before scoping FTO

With A61B, A61N and A23L each carrying a meaningful share of records, a freedom-to-operate search limited to industrial heating vocabulary alone will miss relevant prior art.

Run a cross-class search in Eureka →

Watch the long tail for licensing targets

With only 21.9% of records held by the top 10 assignees, a large share of the field sits with smaller filers — a candidate pool for licensing or acquisition scouting.

Screen the ranked leaders in Eureka →
Source: Patsnap Eureka. Forward-looking reading of the same dataset. Derived from a Patsnap search on Microwave and Dielectric Industrial Heating covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
FAQ

Common questions on this landscape

Answers are grounded in the same dataset. Derived from a Patsnap search on Microwave and Dielectric Industrial Heating covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company's registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.

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