Millimeter Wave Packaging Patents: Top Companies & Trends 2026
Millimeter Wave Packaging and Interconnect Patents
44.1% of the field sits with a handful of leaders. the top 5 assignees combined account for 30 of 68 records in scope, while the top 10 hold 73.5% — a steep concentration curve with a long single-filer tail below it. Filings rose from 3 in 2017 to a peak of 12 in 2020, then eased — 2021's 7 filings dropped to 4 by 2024, a 43% decline over that span. 2025 and 2026 counts are still incomplete because publication typically lags filing by around 18 months; treat the tail end of the curve as a floor, not a ceiling.
- 1SKYGIG LLC6
- 2PERASO TECH6
- 3RAYTHEON CO6
- 4APTIV TECHNOLOGIES AG6
- 5HUAWEI TECH CO LTD6
See the full millimeter wave packaging and interconnect analysis in Eureka
- The complete ranking, not just the top five
- Every IPC branch with its share of the corpus
- The most-cited records, and where claim space is still thin
Common questions about this landscape
Who holds the most patents in millimeter wave packaging and interconnect?
The ranked leader holds 6 of the 68 records in scope, tied with the fifth-placed assignee at the same count, so no single company dominates outright. The top 10 assignees together account for 73.5% of all records, meaning the field is concentrated but not monopolised by one filer. Below tenth place, volume drops quickly to a long tail of companies with only one or two records each.
Is patent filing in this space growing or slowing down?
Filing peaked in 2020 at 12 records and has since declined, with 2021’s 7 filings falling to 4 by 2024 — a confirmed 43% drop over that span. The 2025 and 2026 figures should not be read as continuing that trend, because publication typically lags actual filing by around 18 months and recent years are still incomplete. A clearer read on the current direction will only be possible once those years finish publishing.
What technology areas carry the most patent claim density?
Antenna structures (IPC class H01Q) and waveguide and microwave elements (H01P) each appear in roughly half of the 68 records, making them the most heavily claimed areas. Printed circuit and assembly structures (H05K) and semiconductor device claims (H01L) trail well behind, at about a quarter and an eighth of records respectively. Connector-specific claims (H01R) are even thinner, appearing in just under 12% of records.
Disclaimer. This analysis is based on Patsnap Eureka data drawn from a limited snapshot of global patent records and is provided for general information and reference only. Patent data carries inherent limitations — recent filings are under-counted because of publication lag, counts may be on a record or family basis, classification and applicant-name data may contain errors or duplicates, and the underlying search query defines the scope shown — so the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing here is an exhaustive prior-art, novelty, freedom-to-operate or validity search, nor does it constitute legal, financial or professional advice, and it should not be relied upon as such. Verify independently and review with qualified patent and legal professionals before acting on it.
Method: Filing trend and technology composition. Derived from a Patsnap search on Millimeter Wave Packaging and Interconnect covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish. Every share divides by all records in scope. Data: Patsnap Eureka. See the full landscape report.