Mini-LED Die Bonding & Transfer Patent Snapshot 2026
The Mini-LED die bonding and transfer patent corpus is very small — only 3 patent families in scope — and is concentrated in China, with two filers accounting for all recorded activity. Annual filing volume peaked in 2019 and has since eased, placing the field in a decline stage, though the narrow corpus means any new entrant could materially shift the evidence snapshot.
A two-player field dominated by Huizhou China Star Optoelectronics
Huizhou. China Star Optoelectronics Technology Co Ltd leads with 2 patent families, representing the majority of all documented activity in this search scope. Dongguan Liangyou Hardware Prod Co Ltd holds 1 patent family, rounding out a field of exactly two ranked applicants.
The top five filers collectively hold 100% of the ranked applicants visible in this query’ combined total, indicating extreme concentration with no observable second tier of challengers at this corpus scale.
| # | Applicant | Patent families | Share |
|---|---|---|---|
| 1 | Huizhou China Star Optoelectronics Technology Co Ltd | 2 | |
| 2 | Dongguan Liangyou Hardware Prod Co Ltd | 1 |
The visible position of Huizhou. China Star Optoelectronics — a display-panel subsidiary of TCL’s display division — signals that mini-LED die bonding activity captured here is primarily driven by integrated display manufacturers rather than dedicated equipment or materials specialists.
The most recent filing years carry inherent publication lag and may under-represent actual recent activity; the apparent absence of filings from 2020 onward should not be read as confirmed inactivity. Longer-window growth, applicant concentration, and technology-route coverage are therefore more reliable signals than the latest-year bar alone.
A 2019 spike, then silence — and a semiconductor-device-heavy technology mix
The annual filing trend reveals a single burst of activity in 2019 followed by near-zero filings; the technology composition is anchored in semiconductor-device classes with secondary coverage in lighting components.
Annual filing trend
Two filings appeared in 2019, constituting the corpus peak, followed by one filing in 2023 and no recorded filings in surrounding years. Publication lag affects the most recent 18–24 months, so zero values after 2023 should be treated as provisional.
↗ Hover for values · click a bar to ask EurekaTechnology composition
H01L (Semiconductor devices) covers all 3 patent families and is the visible branch. F21V (Lighting device components) and F21Y (Light-source form index) each appear in 2 records, reflecting the end-application context. B08B (Cleaning, general) and H10P each appear once, pointing to process-step and emerging-device adjacencies.
↗ Hover for values · click a bar to ask EurekaHighly cited patent families surfaced by the query
Citation-heavy patent families returned by the query. Use this section as citation context, not as a curated list of the most topic-specific patents.
MINI-LED背光及其制作方法
一种Mini-LED（40）背光及其制作方法。Mini-LED（40）背光包括：背板（10）以及多个矩形的设有呈阵列排布Mini-LED（40）的灯板（20），灯板（20）呈阵列排布拼接设置在背板（10）上；相邻灯板（20）之间设有拼缝，并且背板（10）设有对应于拼缝的凹槽，拼缝及凹槽内充满经固化的白胶（50）。还提供了相应的Mini-LED（40）背光制作方法。Mini-LED（40）背光及其制作方法能够有效改善Mini-LED（40）背光的灯板（20）板间暗线问题。 (excerpt from the patent abstract)
| # | Patent | Citations |
|---|---|---|
| 1 | Mini-LED背光及其制作方法 | 38 |
Ranked by total forward citations. Citation counts favour older and broadly cited patent families, and broad or adjacent patents may appear when they match the search scope. Treat this section as citation context, not as a curated list of the most topic-specific patents. Some patent titles may be shown in their original, non-English language where an accurate translation could not be guaranteed.
Assignee snapshot from the current evidence set
The applicants below are visible in this query result. Because the evidence set is relatively small, read this section as a directional snapshot rather than a full competitive ranking.
Huizhou China Star Optoelectronics
Holder of 2 patent families, the leader concentrates on F21V 19 (lighting device components), F21Y 115 (light-source form index), and H01L 25 (multi-component semiconductor assemblies). This reflects a display-integration perspective — bonding and packaging in the context of finished backlight modules. No momentum data is available for this applicant, so trajectory is characterized by the 2019 peak filing activity alone.
families: 2Dongguan Liangyou Hardware Prod Co Ltd
Holder of 1 patent family, this applicant is a new entrant (trend: ▲ new entrant) with its single filing in 2023. Its technology emphasis spans B08B 5 (general cleaning processes), H01L 21 (semiconductor fabrication processes), and H01L 33 (LED device structures), suggesting a process-equipment or contract-manufacturing angle rather than end-product integration.
families: 1Frequently asked questions
The scoped corpus contains 3 patent families. This is a very small dataset, so conclusions should be treated as directional indicators rather than definitive market signals.
Huizhou China Star Optoelectronics Technology Co Ltd leads with 2 patent families. It is a display-panel entity within the TCL group and approaches the technology from a lighting-assembly and multi-chip packaging perspective.
The field is characterized as decline, with annual filings having peaked in 2019 and eased since. A single filing appeared in 2023, and recent years show no recorded activity — though publication lag means the most recent 18–24 months may be under-counted.
China accounts for 2 patent records and WIPO (PCT) accounts for 1. No filings in the US, Europe, or other major markets are recorded in this corpus, reflecting a predominantly China-centric protection strategy.
H01L (Semiconductor devices) covers all 3 patent families. F21V (Lighting device components) and F21Y (Light-source form index) each appear in 2 records. B08B (Cleaning, general) and H10P each appear once, representing adjacent process and device-structure perspectives.
No co-applicant or cross-institutional collaboration is recorded in the corpus. Both filers appear to have developed their intellectual property independently, which may reflect proprietary development strategies or the early industrialization stage of the technology.
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Disclaimer. This page is generated from PatSnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
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