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The agent works the prompt against patents and technical literature, citing every source.
Run your analysis now →Filing growth compares 2021 (2 records) with 2024 (2) — a three-year span. 2024 is the most recent year we treat as complete: publication lags filing by roughly 18 months, so 2025 onwards are still filling in and any growth rate that ends there would understate the field.
This landscape tracks patent families at the intersection of millimeter-wave transceiver design and its physical system integration — RF front-end modules, beamformer IC packaging, antenna-transceiver co-location and system-in-package construction. The corpus is small and tightly scoped: 20 patent families, all filed through the United States receiving office, classified across antenna, transmission, waveguide and packaging IPC subclasses. It excludes general mmWave transceiver circuit design that does not specify an integration or packaging claim.
Because the search string requires both a mmWave transceiver term and a system-integration term in the claims, this set skews toward filings that treat the antenna and the front-end as a single claimed unit. That skew is visible in the IPC composition and shapes every section that follows.
Twenty patent families make up this corpus, filed exclusively through the United States receiving office. The trend line and IPC split below show where claim activity has concentrated and where it has not.
Filings ran to 9 in 2017, the high point for this corpus, then fell back with a flat 2022 midpoint of zero. Because publication lags filing by roughly 18 months, the most recent years are understated rather than genuinely empty — but the multi-year plateau after 2017 is a real signal that filers are not returning to this claim space at the earlier pace.
H01Q (antennas) appears in 17 of 20 records, far ahead of H04B transmission claims (7) and H01P waveguide elements or H05K printed-circuit assemblies (5 each). H04L and H04W each show a single record. The mix confirms this corpus is built around antenna-transceiver integration specifically, not general RF transceiver design.
Shares are the percentage of the 20 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.
This page is one run against one query. Ask Eureka your own question about mmwave transceiver system integration and every answer comes back with the patent numbers behind it.
Try EurekaA surface mount constructed millimeter wave transceiver device and methods of making a surface mount constructed millimeter wave transceiver device are disclosed. The transceiver device includes a printed circuit board having a first waveguide port and a second waveguide port. A diplexer is surface mounted to a first side of the printed circuit board, the diplexer comprising a low frequency waveguide port and a high frequency waveguide port each coupled to an antenna port. A transmitter and a receiver are surface mounted to a second side of the printed circuit board, located opposite the first side of the printed circuit board, wherein the transmitter and the receiver comprise a transmitter.Filed by Vubiq Networks, Inc. — illustrates the two-sided, diplexer-mediated packaging approach now common in this claim space.


| # | Publication no. | Patent title | Citations |
|---|---|---|---|
| 1 | US20190379134A1 | Electronic Device Antenna Arrays Mounted Against a Dielectric Layer | 58 |
| 2 | US20190027802A1 | Millimeter Wave Transmission Line Structures | 57 |
| 3 | US10418687B2 | Electronic device with millimeter wave antennas on printed circuits | 42 |
| 4 | US20190097328A1 | Systems and Methods for Mitigating Polarization Loss | 41 |
| 5 | US20190089052A1 | Antenna Arrays with Etched Substrates | 39 |
| 6 | US20200021037A1 | Millimeter Wave Patch Antennas with Parasitic Elements | 25 |
| 7 | US20190027838A1 | Millimeter Wave Antennas Having Dual Patch Resonating Elements | 24 |
| 8 | US20200014095A1 | Electronic Device With Millimeter Wave Antennas on Printed Circuits | 20 |
| 9 | US10608344B2 | Electronic device antenna arrays mounted against a dielectric layer | 20 |
| 10 | US10263332B2 | Antenna arrays with etched substrates | 12 |
Ranked by citation count within the searched corpus; older filings accumulate citations by virtue of longer availability, so treat this as influence rather than current importance.
Each row carries its publication number; clicking a row searches Eureka by that number.
When you want the answer in the next five minutes.
The agent works the prompt against patents and technical literature, citing every source.
Run your analysis now →When it has to run inside your own pipeline.
Patent search, landscape analysis and assignee resolution as MCP tools. Drop them into any agent framework, or call REST directly.
Browse MCP servers →Citation counts and filing dates tell different stories here. Read together, they show where influence sits versus where activity is currently moving.
The most-cited record in this corpus concerns antenna arrays mounted against a dielectric layer, followed closely by millimeter-wave transmission-line structure claims. Both predate most of the corpus, which is typical — older filings accumulate citations simply by being available longer, so treat this as a map of influence, not of what matters most today.
Filing activity has not returned to its 2017 level in this corpus, with a flat midpoint in 2022. Given the roughly 18-month publication lag, the most recent one or two years will read lower than they eventually turn out to be, but the multi-year plateau in between is a genuine signal of reduced filing pressure.
Dense filing in H01Q antenna claims means that claim space is occupied, not that antenna-integration technology itself is mature. New filers competing directly on antenna mounting or array geometry are entering a crowded field; those working on the digital or network-coordination side face comparatively open ground.
Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to mmwave transceiver system integration, with the prior art for and against each one.
Twenty families is a small enough set that ranking should be read as positioning, not market share. What stands out is not who leads but that recent-year momentum has gone quiet across the board.
With only 20 families across the entire dataset, this is a narrow field compared to broader mmWave or RF categories. Rankings here should be treated as directional rather than definitive given the sample size.
Assignees tracked for recent-year momentum, including Apple and Vubiq Networks, show zero new families in the latest tracked year. Publication lag means this understates true activity, but it is consistent with the broader flat trend since 2017.
Every family in this corpus was filed through the United States receiving office, with no other jurisdiction represented. That is either a search-scope artefact or a genuine indicator that this specific integration claim style is being pursued almost exclusively in the US market.
| Assignee | Recent year | YoY |
|---|---|---|
| Apple Inc. | 0 | — |
| Vubiq Networks, Inc. | 0 | — |
The filing and citation data point to specific next questions rather than a finished picture. These are the natural follow-ups for an R&D or IP team acting on this landscape.
Before filing near antenna-mounting or transmission-line-geometry claims, check the granted claim language of the highest-cited records in this corpus directly rather than relying on the IPC summary alone.
Run a claim chart in EurekaBecause publication lags filing by roughly 18 months, the apparent 2022–2026 plateau should be re-checked as new records surface, particularly from assignees showing zero latest-year momentum today.
Set a filing alert in EurekaH04L and H04W each carry a single record in this corpus — worth a dedicated search to confirm whether that is a true gap or a scope artefact of the search string used here.
Scope a follow-up search in EurekaIt refers to claims that combine a millimeter-wave transceiver or front-end with its physical packaging or antenna structure, rather than claiming the RF circuit alone. In this corpus that shows up as a heavy overlap between H04B transmission claims and H01Q antenna claims, plus H01P waveguide and H05K printed-circuit assembly claims. Practically, it covers antenna-in-package, surface-mount transceiver, and beamformer-to-antenna coupling architectures filed mostly through the US patent office in this dataset.
The corpus shows nine filings in 2017, the highest single year, followed by a plateau that includes a flat 2022 midpoint. This does not necessarily mean the field went quiet — patent publication typically lags the actual filing date by about 18 months, so the last one or two years in any trend chart will always look thinner than they eventually turn out to be. Still, several consecutive years without a rebound to 2017 levels suggests filers shifted priority elsewhere or consolidated around the claim positions already staked out.
The most-cited records in this corpus are dominated by antenna-array and transmission-line structure claims — for example, dielectric-mounted antenna arrays and millimeter-wave transmission-line geometry, each cited over fifty times within this search. High citation counts mean many later filings reference these claims, which typically indicates they cover a foundational structural approach that is hard to avoid entirely. Designers usually respond by moving to a different mounting substrate, a different transmission-line cross-section, or board-level assembly claims instead of substrate-etch claims.
Based on the IPC composition, it is weighted toward antennas: 17 of 20 records carry an H01Q antenna classification, compared with 7 for H04B transmission and 5 each for H01P waveguide elements and H05K printed-circuit assembly. Digital and network-layer classifications (H04L, H04W) appear only once each. That imbalance means most of the claim density sits in physical antenna structure and its integration with the front-end, not in the transceiver's digital signal chain.
The thinnest IPC buckets in this corpus are H04L (digital information transmission) and H04W (wireless network methods), each with a single record against seventeen for antennas. That points to an opening around control, calibration and network-coordination logic tied to a specific antenna-transceiver package, rather than the antenna structure or the transceiver circuit in isolation. A first claim there would pair that thin bucket with the dense antenna bucket rather than competing directly inside H01Q.
Go past this page: query the whole mmwave transceiver system integration corpus yourself, in your own scope.
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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.
Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company's registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.