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MAP Process Automation Patents: Who Leads, Trends 2026

MAP Process Automation Patents: Who Leads, Trends 2026
https://www.patsnap.com/resources/blog/rd-blog/modified-atmosphere-packaging-process-automation-patent-landscape/ · Patsnap · data cut-off 2026-07-31 · downloaded from the live page
Packaging Technology · Patent Landscape
Modified Atmosphere Packaging Process Automation Patents
  • Filing has plateaued, not grown. the trend runs from 3 filings in 2017 to a 2025 peak of 10, with the 2022 midpoint at 7 — flat-to-declining momentum rather than a rising curve.
  • This is a control-systems fight, not a packaging-machinery one. G05B (control & regulating systems) touches 116 of 118 records, with G06F, H04L and G06N layered on top — the claims are about software and control loops, not seal geometry.
  • The named leaders have gone quiet. every assignee tracked for recent-year momentum shows zero filings in the latest year, including a -100% YoY drop for one — the historical leaders are not the current filers.
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118
Published Records
49%
Top-5 Share of All Records
-86%
3-Yr Growth (lag-adjusted)
US
Leading Jurisdiction
Published byPatsnap Research··6 min readSourced from Patsnap Eureka
Overview

What this landscape covers

This dataset tracks patent families at the intersection of modified atmosphere packaging and process automation — gas-flushing control, tray-seal automation and the process-control logic (IPC classes B65B31/02, B65B57 and G05B19/418) that ties packaging hardware to a control loop. It is a narrow, applied slice: the search terms pull in general process-control patents that happen to cite MAP or gas-flushing use cases, alongside packaging-specific automation filings.

Coverage runs from 2015 through the 2026-07-31 cut-off, with 118 published records forming the full family set used in the assignee ranking. Because publication typically lags filing by around 18 months, the 2026 and late-2025 counts understate actual filing activity for those years and should be read as provisional.

Filing activity and IPC composition, 2017-2026
  1. 1FISHER ROSEMOUNT SYST INC17
  2. 2ROSEMOUNT INC16
  3. 3APPLIED MATERIALS INC14
  4. 4REFLEX MFG SYST6
  5. 5HONEYWELL INTERNATIONAL INC5
  6. 6MITSUBISHI ELECTRIC CORP4
  7. 7YOKOGAWA ELECTRIC CORP3
  8. 8GLOBAL LIFE SCIENCES SOLUTIONS USA LLC2
  9. 9CHINA NON-FERROUS METALS PROCESSING TECH CO LTD2
  10. 10GLASS SERVICE2
Source: Patsnap Eureka. Assignee ranking and totals. Derived from a Patsnap search on Modified Atmosphere Packaging Process Automation covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

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The data

Filing trend and technology composition

Two views of the same 118-family set: how filing volume has moved year over year, and which IPC subclasses the claims actually sit in.

A flat trend with one recent peak

Filings rose slowly from 3 in 2017 to a midpoint of 7 in 2022, then peaked at 10 in 2025 before the partial 2026 count of 4 — consistent with a mature, cyclical filing pattern rather than sustained growth. Read the last one to two years as undercounted given publication lag.

A flat trend with one recent peak03581032017201820192020202120222023202410202542026Most recent year is partial — publication lag means later filings are not yet visible.

Control systems dominate the classification

G05B appears in 116 of 118 records, making this overwhelmingly a control-and-regulation filing set. G06F (42), H04L (27) and G06N (16) show software, networking and AI-model claims layered on top of that control core, while G06Q, H01L, B24B and H10P appear as smaller adjacent slices rather than primary claim territory.

Control systems dominate the classificationG05B · Control & regulating systems11698.3%G06F · Electric digital data processi…4235.6%H04L · Digital information transmissi…2722.9%G06N · Computing based on AI models1613.6%G06Q · Business, commerce & admin dat…1311.0%H01L · Semiconductor devices1210.2%B24B · Grinding & polishing108.5%H10P108.5%Other3126.3%

Shares are the percentage of the 118 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.

Source: Patsnap Eureka. Filing trend and technology composition. Derived from a Patsnap search on Modified Atmosphere Packaging Process Automation covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.

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Key patents

Most-cited prior art in this corpus

Representative filing
US7246194B22007-07-17

Interface module for use with a fieldbus device network and with internet and non-internet based process control networks

ROSEMOUNT, INC.

An interface module is operatively connected to a Fieldbus process control network and to at least one non-Fieldbus process control network to facilitate the exchange of process control information between the networks. The interface module stores a database in which the process control parameters of the function blocks in the field devices of the Fieldbus process control network are mapped to corresponding process control parameters of the non-Fieldbus process control network.Filed by Rosemount Inc.; granted 2007-07-17. Its claims sit at the network-interface layer between fieldbus and non-fieldbus control systems, which is the layer most MAP line-automation retrofits have to cross.

US7246194B2 — patent drawing 1US7246194B2 — patent drawing 2
View full record
Highest-citation records
#Publication no.Patent titleCitations
1US5963447AMultiple-agent hybrid control architecture for intelligent real-time control of distributed nonlinear process…198
2US6820070B2Method and tool for data mining in automatic decision making systems150
3US9804588B2Determining associations and alignments of process elements and measurements in a process147
4US20020193899A1Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing132
5US20150261215A1Determining associations and alignments of process elements and measurements in a process111
6US5307346ANetwork-field interface for manufacturing systems107
7US20040153594A1Interface module for use with a Modbus device network and a Fieldbus device network97
8US5659467AMultiple model supervisor control system and method of operation82
9US20050066104A1Interface module for use with a fieldbus device network and with internet and non-internet based process cont…77
10US20160216706A1Commissioning field devices in a process control system supported by big data76

Citation counts favour older filings that have had more time to accumulate citations within the searched corpus; treat them as a signal of influence on the field's vocabulary, not of current commercial relevance.

Each row carries its publication number; clicking a row searches Eureka by that number.

Source: Patsnap Eureka. Citation counts and representative records. Derived from a Patsnap search on Modified Atmosphere Packaging Process Automation covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
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Insights

What the numbers mean for a filing decision

Three findings from the dataset that change where a team should and should not spend claim-drafting effort.

Filing momentum
2025 peak: 10
families filed

Growth has stalled after a 2025 spike

The climb from 3 filings in 2017 to a midpoint of 7 in 2022 looked like steady growth, but the 2025 peak of 10 followed by a partial 4 in 2026 reads more like a cyclical bump than a new wave. Treat 2026 as understated due to publication lag, but do not assume it will close the gap to 2025.

Filing trend, 2017-2026
Classification concentration
116 / 118
records in G05B

Control-loop claims, not mechanical ones

Almost every record in this set touches G05B (control & regulating systems), with G06F and H04L layered on top. A drafting strategy built around seal or tray mechanics alone misses where the claim density actually sits.

IPC composition
Assignee activity
0 in latest year
for every tracked leader

The historical leaders have stopped filing

Every assignee with tracked recent-year momentum — including a -100% YoY drop for one of them — shows zero filings in the latest year. That is either a data-lag artefact or a genuine pause by incumbents, and it is worth checking directly before assuming the field is abandoned.

Recent-year momentum
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Looking for what nobody has claimed yet?

Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to modified atmosphere packaging process automation, with the prior art for and against each one.

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Source: Patsnap Eureka. Co-assignee relationships and derived observations. Derived from a Patsnap search on Modified Atmosphere Packaging Process Automation covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
Players

Who holds the claim space

Receiving-office data and co-assignee pairs point to a US- and China-centred filing pattern built around a small number of process-control specialists, with named individuals appearing alongside corporate assignees in the strongest co-filing pairs.

Receiving office
37
US filings

United States leads, China close behind

The United States accounts for 37 filings and China 29, with EPO (14), WIPO/PCT (12), the United Kingdom (7) and India (4) forming a smaller secondary tier. That split suggests dual US/China prosecution strategies are the norm for serious filers in this space.

Receiving offices
Co-filing pattern
10
co-assignee pairs

Individual inventors co-own core control patents

The strongest co-assignee pairs pair a corporate process-control assignee with named individual inventors, each appearing three times. That points to a small internal team, not a broad multi-company alliance, behind the densest claim clusters.

Co-assignee pairs
Momentum
0
recent-year filings, all tracked assignees

No current leader has replaced the historical ones

Every named assignee tracked for momentum, from established process-control firms to a major electronics group, shows zero filings in the latest year. This is a field where the incumbent map is old; a new entrant filing today would face a genuinely open competitive set.

Recent-year momentum by assignee
🔍
Under-claimed sub-areas worth checking before filing
Branches of the search space that show up in the IPC mix but do not carry heavy claim density on their own.
AI-driven gas-mix optimisationFieldbus-to-non-fieldbus interface mappingTray-seal defect vision inspectionEdge-device metrology for MAP linesSemiconductor-grade process sensors in packaging
Rank all filers by momentum →
Recent-year filing momentum by assignee
AssigneeRecent yearYoY
Fisher-Rosemount Systems, Inc.0
Rosemount Inc. (USA)0
Applied Materials, Inc.0-100%
REFLEX MFG SYST0
Honeywell International Inc.0
Mitsubishi Electric Corporation0
Yokogawa Electric Corporation0
ROTVOLD ERIC D0
Source: Patsnap Eureka. Assignee-level momentum. Derived from a Patsnap search on Modified Atmosphere Packaging Process Automation covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
What's next

Where to take this analysis

The dataset points to open claim territory rather than a settled field. Two directions make sense from here.

Map the white space against your own process

Cross-reference the under-claimed sub-areas above against the specific control architecture you plan to file on, before assuming a clear path exists.

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Verify the momentum drop directly

Zero recent-year filings across every tracked assignee could reflect publication lag rather than a genuine pause — check the underlying application dates before drawing conclusions.

Check filing status in Patsnap Eureka
Source: Patsnap Eureka. Forward-looking reading of the same dataset. Derived from a Patsnap search on Modified Atmosphere Packaging Process Automation covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
FAQ

Common questions about this landscape

Answers are grounded in the same dataset. Derived from a Patsnap search on Modified Atmosphere Packaging Process Automation covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company’s registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.

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