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Molded Pulp Packaging Patents: Leaders, Trends & White Space 2026

Molded Pulp Packaging Patents: Leaders, Trends & White Space 2026
https://www.patsnap.com/resources/blog/rd-blog/molded-pulp-and-fiber-based-packaging-patent-landscape/ · Patsnap · data cut-off 2026-07-31 · downloaded from the live page
Patent Landscape · Molded Pulp & Fiber-Based Packaging
Molded Pulp and Fiber-Based Packaging Patents: Who Holds the Forming Claims
  • Filing peaked in 2022 at seven records and has not been matched since, suggesting the field's initial claiming rush has already passed rather than being underway.
  • D21J concentrates nearly the entire corpus 17 of 17 records sit in fibreboard and moulded-pulp classification, with only single-digit spillover into barrier layers, laminates, or paper stock treatment.
  • Europe and PCT filings dominate the receiving offices EPO carries seven records and WIPO four, pointing to a field still being claimed for multi-jurisdiction reach rather than settled into single-country defence.
Get a prior-art report on your approach
17
Published Records
EP
Leading Jurisdiction
8
Active Filers Ranked
2022
Peak Filing Year
Published byPatsnap Research··7 min readSourced from Patsnap Eureka
Field Overview

What this landscape covers

Molded pulp and fiber-based packaging patents in this dataset concentrate on the mechanics of turning pulp suspensions into rigid or semi-rigid packaging forms: mold geometry, forming process control, drying energy reduction, wet strength, and dimensional accuracy. The search string deliberately pairs D21J (fibreboard and moulded pulp) with process-level terms rather than material chemistry alone, which is why the corpus is small — 17 published families — but tightly focused on manufacturing method rather than end-use packaging design.

That focus matters for a reader deciding where to file: this is a process-and-tooling landscape, not a materials-science one. Claims here tend to describe mold construction, production lines, and multilayer forming steps rather than novel fiber chemistries, which narrows the field of relevant prior art but also means any new filing has to differentiate against a small number of well-cited forming-process patents.

Filing activity, 2017–2026
  1. 1Valmet Technologies Oy9
  2. 2Stora Enso Oyj2
  3. 3Kemira Oyj2
  4. 4Societe des Produits Nestle S.A.1
  5. 5Zhejiang Shukang Technology Co., Ltd.1
  6. 6Kiefel GmbH1
  7. 7Zhongkai University of Agriculture and Engineering1
  8. 8PRATISHTHAN IND PTE LTD1
Source: Patsnap Eureka. Assignee ranking and totals. Derived from a Patsnap search on Molded Pulp and Fiber-Based Packaging covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
The Numbers

Filing trend and technology composition

Two views of the same 17-family corpus: how filing activity has moved year over year, and which IPC subclasses carry the claims.

A single peak, then a pullback

Filings rose from zero in 2017 to a peak of seven in 2022, then declined. With publication lagging filing by roughly 18 months, the final one or two years in the chart will understate true filing activity, but the shape through 2022 already shows a concentrated rather than accelerating filing pattern.

A single peak, then a pullback024680201720182019202020217202220232024202502026Most recent year is partial — publication lag means later filings are not yet visible.

D21J carries the field

All 17 records touch D21J (fibreboard and moulded pulp), with smaller counts spilling into D21H (pulp and paper compositions, 4 records) and single-record appearances in B32B laminates, B65D containers, D21C pulp production, D21D paper stock treatment, B31F mechanical working, and B07C sorting. That long tail of one-record subclasses is where adjacent claim territory sits largely unclaimed.

D21J carries the fieldD21J · Fibreboard & moulded pulp17100.0%D21H · Pulp & paper compositions423.5%B07C · Postal & object sorting15.9%B31F · Paper mechanical working15.9%B32B · Layered products & laminates15.9%B65D · Containers & packaging15.9%D21C · Pulp production & treatment15.9%D21D · Paper stock treatment15.9%

Shares are the percentage of the 17 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.

Source: Patsnap Eureka. Filing trend and technology composition. Derived from a Patsnap search on Molded Pulp and Fiber-Based Packaging covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.

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Key Patents

The most-cited records in this corpus

Representative Filing
WO2026115198A12026-06-04

Method for producing molded fiber product and molded fiber product thereof

KEMIRA OYJ

There is provided a method for producing a molded fiber based article by forming the molded fiber based article from a first aqueous pulp suspension and a second aqueous suspension comprising refined fiber material. Additionally, is provided a molded fiber based article produced with said method.Filed by Kemira Oyj, published 2026-06-04 as WO2026115198A1.

WO2026115198A1 — patent drawing 1WO2026115198A1 — patent drawing 2
View full filing
Ranked by citation count
#Publication no.Patent titleCitations
1EP3985170A1Mold for manufacturing of a molded fiber product12
2WO2022218772A1A cellulose fiber structure comprising a barrier layer6
3EP4265840A1Mold for manufacturing of a molded fiber product4
4WO2022219519A1A multilayered moulded product and method for the preparation thereof3
5EP3985171A1Production line for molded fiber product3
6EP4265841A1Mold for manufacturing of a molded fiber product2
7EP4265841B1Mold for manufacturing of a molded fiber product2
8CN116732801A一种细菌纤维素基纸浆模塑包装材料及其制备方法与应用1

Citation counts inside a searched corpus favour older filings; treat them as a signal of influence on later filers, not as a measure of current commercial relevance.

Patent titles are shown in the language they were filed in, not translated, so that each record stays verifiable against the original filing — a translated title will not match in Eureka or in any national register. Publication numbers are shown where the record carries one (8 of 8 rows); clicking a row searches Eureka by that number.

Source: Patsnap Eureka. Citation counts and representative records. Derived from a Patsnap search on Molded Pulp and Fiber-Based Packaging covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
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Reading the Data

What the filing pattern signals

Three data points shape how a new entrant should think about this space: where claim density sits, where citation weight concentrates, and what the receiving-office pattern implies about strategy.

Filing Trend
7 in 2022
peak year filings

The rush has already happened

Filing activity rose to a peak of seven records in 2022 and has not returned to that level since. For a field this small, that single peak represents a meaningful share of total activity concentrated in one filing window rather than steady incremental growth.

17 total families, 2017–2026
Classification
17 of 17
records touch D21J

Process claims dominate over material claims

Every record in the corpus sits in D21J, fibreboard and moulded pulp. Material-composition classes like D21H appear in only four records, and packaging-container classification B65D appears once, indicating the claim activity is about forming and tooling method, not end-product design.

IPC subclass distribution
Citation Weight
12 citations
top-cited record

Mold construction sets the reference point

The most-cited record in this corpus is a mold-manufacturing patent, cited 12 times, with a related mold patent from the same family line also appearing among the top-cited group. Citation weight in a small corpus like this tends to sit with foundational tooling claims rather than downstream product variants.

Most-cited records table
Jurisdiction
7 EPO filings
largest receiving office

Europe anchors the filing strategy

The European Patent Office receives more filings than any other office in this dataset, with WIPO PCT filings second. That combination suggests applicants are building for multi-jurisdiction coverage from a European base rather than filing nationally first and expanding later.

Receiving office counts
Eureka AI Agent
Looking for what nobody has claimed yet?

Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to molded pulp and fiber-based packaging, with the prior art for and against each one.

Find the white space →
Source: Patsnap Eureka. Co-assignee relationships and derived observations. Derived from a Patsnap search on Molded Pulp and Fiber-Based Packaging covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
Who's Filing

Assignee landscape and where activity is flat

No assignee in this corpus shows growth in the latest tracked year; several show a full year-over-year drop to zero. That pattern, combined with the field's small total size, points to a landscape shaped by a handful of active filers rather than a broad competitive race.

Momentum
0
latest-year filings, most assignees

Activity has gone quiet across the board

Every tracked assignee, including Kemira Oyj and Nestle, shows zero filings in the latest year, with some recording a full year-over-year decline. That is consistent with the corpus-wide peak in 2022 having already passed rather than a slowdown specific to any one company.

Recent-year momentum by assignee
Collaboration
1 pair
co-assignee link

Filing here is mostly done alone

The dataset shows only one co-assignee pairing of meaningful strength, linking a Stora Enso-affiliated entity with a partner firm. Outside that single link, assignees in this corpus file independently rather than through joint ventures or shared filings.

Co-assignee pair analysis
Geography
7 vs 4
EPO vs WIPO filings

European filers lead, China and Finland follow

Beyond the EPO and WIPO totals, China and Finland each contribute two records, with single filings from Austria and India. The spread confirms this is a European- and Nordic-centred field with limited but present activity from Chinese filers.

Receiving office breakdown
🔍
Under-claimed branches worth watching
Single-record IPC subclasses in this corpus point to adjacent claim territory that has not been built out.
Barrier-layer lamination on molded pulpPostal-sorting compatible fiber formsMechanical post-forming (B31F) of pulp traysPulp stock treatment for dimensional accuracyMultilayer moulded product structures
Rank all filers by momentum →
Recent-year filing momentum by assignee
AssigneeRecent yearYoY
Valmet Technologies Oy0
Stora Enso Oyj0
Kemira Oyj0-100%
Societe des Produits Nestle S.A.0-100%
Zhejiang Shukang Technology Co., Ltd.0
Kiefel GmbH0
Zhongkai University of Agriculture and Engineering0
PRATISHTHAN IND PTE LTD0-100%
Source: Patsnap Eureka. Assignee-level momentum. Derived from a Patsnap search on Molded Pulp and Fiber-Based Packaging covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
Next Steps

Where to take this analysis

This landscape identifies the pattern; deciding what to file next requires drilling into specific claims and the white space around them.

Map claim scope against the mold-patent family

The top-cited records in this corpus are mold-construction patents from a single family line. Before filing on forming tooling, check how narrowly those claims are drafted and where their dependent claims leave room.

Explore claims in Eureka

Assess the under-claimed IPC branches

Barrier-layer lamination, mechanical post-forming, and pulp stock treatment each show only one record in this corpus. That is a shallow prior-art bar for a well-drafted first claim.

Run a white-space search in Eureka
Source: Patsnap Eureka. Forward-looking reading of the same dataset. Derived from a Patsnap search on Molded Pulp and Fiber-Based Packaging covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
FAQ

Common questions about this landscape

Answers are grounded in the same dataset. Derived from a Patsnap search on Molded Pulp and Fiber-Based Packaging covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

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Go past this page: query the whole molded pulp and fiber-based packaging corpus yourself, in your own scope.
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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company’s registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.

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