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Molded Pulp Packaging Patents: Top Companies & Filing Trends 2026

Molded Pulp Packaging Patents: Top Companies & Filing Trends 2026
https://www.patsnap.com/resources/blog/rd-blog/molded-pulp-packaging-patent-landscape-patent-landscape/ · Patsnap · data cut-off 2026-08-31 · downloaded from the live page
Patent Landscape · Molded Pulp Packaging
Molded Pulp Packaging Patents: Leaders, Filing Trends and Open Claim Space

A data-backed view of the molded pulp packaging patent landscape: leading assignees, filing trends since 2015, technology classes and where claim space is still open.

145
Published Records
28%
Top-5 Share of All Records
-11%
Filing Growth 2021→2024
US
Leading Jurisdiction

Filing growth = 2021 (9 records) → 2024 (8); 2024 is the last year we treat as complete. Top-5 share = the 5 largest assignees ÷ all 145 records in scope (CR5), not the ranked leaders only.

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Published byPatsnap Research··7 min readSourced from Patsnap Eureka
Overview

What the molded pulp packaging patent record shows

The dataset covers 145 published records filed between 2015 and the 2026 cut-off, drawn from filings that name molded pulp packaging directly in the title or claims alongside a packaging-material or packaging-container reference. Filing activity is spread across a wide base of receiving offices rather than concentrated in one jurisdiction, with the United States and China each accounting for the largest shares, followed by smaller volumes from the Philippines, the WIPO PCT route, Japan and the EPO.

No single company dominates the field. The ranked leader sits at 11 records out of 79 ranked assignees, and concentration at the top is moderate rather than extreme — the top 10 combined account for 43.4% of all records in scope, leaving well over half the field to entrants filing in small numbers. That pattern matters for anyone assessing freedom to operate: it signals a technology where claim space is still being staked out, not one already locked up by a handful of incumbents.

Filing activity and technology composition, 2015–2026
  1. 1KEYES FIBER11
  2. 2MAE SYKI YOUNG9
  3. 3DIAMOND INT CORP8
  4. 4MOLDED FIBER TECH7
  5. 5RICOH CO LTD6
  6. 6SOCIETE DES PRODUITS NESTLE SA6
  7. 7CONAGRA FOODS RDM INC5
  8. 8GRAFCOR PACKAGING4
  9. 9WING FAT (HENAN) MOLDED FIBER TECH DEV CO LTD4
  10. 10PACKAGING CORPORATION OF AMERICA3
Source: Patsnap Eureka. Assignee ranking and totals. Derived from a Patsnap search on Molded Pulp Packaging Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
The Data

Filing trend and technology composition

Two views of the same 145 records: how filing volume has moved year over year, and which IPC subclasses the claims actually sit in.

Filing trend, 2017–2026

Volume rose from 2 records in 2017 to a peak of 17 in 2022, then eased to 8 by 2024 — an -11% move from 2021's 9 over that three-year span. 2025 and 2026 are undercounted because publication lags filing by roughly 18 months; treat the most recent two years as incomplete rather than as a declining trend.

Filing trend, 2017–20260510152022017201820192020202117202220232024202502026Most recent year is partial — publication lag means later filings are not yet visible.

Publication lags filing by roughly 18 months, so 2025 onwards are still filling in. Growth rates on this page therefore end at 2024; running them to the last bar would understate the field.

Technology composition by IPC subclass

B65D (containers and packaging) appears in 99.3% of the 145 records, confirming that molded pulp packaging claims are filed overwhelmingly as container/packaging art. Smaller subclasses — B65B packaging and wrapping at 6.9%, A23P food shaping at 3.4%, D21J fibreboard and moulded pulp at 2.8% — mark the more specific process and application niches layered on top of that base.

Technology composition by IPC subclassB65D · Containers & packaging14499.3%B65B · Packaging & wrapping106.9%A23P · Food shaping/forming53.4%D21J · Fibreboard & moulded pulp42.8%A24F · Smokers' requisites21.4%B05D · Coating processes21.4%B29C · Shaping of plastics21.4%B41M · Printing & marking processes21.4%Other1913.1%

Shares are the percentage of the 145 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.

Source: Patsnap Eureka. Filing trend and technology composition. Derived from a Patsnap search on Molded Pulp Packaging Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish.

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Key Patents

Representative filing and most-cited prior art

Representative filing
PH22015000054Y12015-02-18

PH22015000054Y1 — Molded pulp egg packaging container

MAE SYKI YOUNG

An egg packaging container made of molded pulp from recycled or processed paper, comprising an egg tray member and a cover member integrally hinged at the rear. The tray carries a flap with a locking tab that engages a corresponding slot on the cover, and that flap also supports the eggs once the cover is mounted. The cover's upper portion forms a trough with spaced window openings that expose the eggs inside.Filed by Mae Syki Young, 2015-02-18 — an early filing in the coverage window, illustrating how tray/cover locking geometry and viewing-window features get claimed in application-specific molded pulp packaging.

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Most-cited records in the corpus
#Publication no.Patent titleCitations
1US5335770AMolded pulp fiber interior package cushioning structures93
2US3732976APackage for fragile articles63
3US2863595AMolded pulp packaging members61
4US20080210584A1Fiber-cast packaging with inner bag and method for the production thereof57
5US20120037529A1Bottle shipment packaging and method54
6US6325210B1Wine bottle package54
7US3233812AMolded pulp container49
8US2917216AIndividual serving pack41
9US2838173APacking for fragile articles40
10US5816409AMolded pulp fiber interior package cushioning structures35

Citation counts reward older filings that have had more time to accumulate citations inside this searched corpus — read them as a signal of influence on later filers, not as a measure of current commercial importance.

Each row carries its publication number; clicking a row searches Eureka by that number.

Source: Patsnap Eureka. Citation counts and representative records. Derived from a Patsnap search on Molded Pulp Packaging Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
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Insights

What the numbers mean for a filing decision

Four read-outs from the dataset that bear directly on where to file, who to watch, and where claim space is still open.

Concentration
28.3%
of 145 records held by top 5

Leadership is real but not a lock

The ranked leader holds 11 records and the top 5 combined take 28.3% of all 145 records in scope. That is enough to matter in a freedom-to-operate check, but it leaves more than two-thirds of the field to a long tail of assignees filing in small numbers — a structure closer to an open field than a duopoly.

Based on the 79-company assignee ranking
Filing momentum
-11%
2021 (9) → 2024 (8)

Activity has cooled from its 2022 peak, not collapsed

Filings peaked at 17 in 2022 before easing to 8 by 2024, a decline the dataset states as -11% over that three-year span. 2025-26 counts will rise as later publications land, so this should be read as a plateau after a filing surge rather than a shrinking field.

2024 is the most recent complete filing year
Technology base
99.3%
of records tag B65D

Almost everything sits in the same core class

B65D covers 99.3% of the 145 records, meaning nearly every filing is anchored in general container/packaging claims. The differentiation between filings happens in the secondary classes — D21J moulded-pulp process claims and A23P food-shaping claims — which are each claimed by a small minority of records.

Classes overlap; shares sum to more than 100% of records
Jurisdiction spread
US 48 / China 44
leading receiving offices

Filing activity splits between two anchor markets

The United States (48) and China (44) are the two largest receiving offices, with the Philippines, WIPO PCT, Japan and the EPO trailing at single digits. A strategy built only around one of the two anchor markets misses roughly half the documented activity in the other.

Receiving-office counts, all 145 records
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Co-filing is rare in this field
AssigneeCo-assigneeShared families
KEYES FIBERBANZURU FURETABUKUSUPATSUKU1

The strongest co-assignee pairing in the dataset appears only once, between Keyes Fiber and a partner entity — co-development filings are the exception rather than the rule in molded pulp packaging.

Source: Patsnap Eureka. Co-assignee relationships and derived observations. Derived from a Patsnap search on Molded Pulp Packaging Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
What's Next

Where to take this analysis

The ranking, trend and citation tables on this page are a starting point. The next steps depend on whether the question is defensive, competitive or exploratory.

Check freedom to operate against the most-cited records

The five most-cited records anchor a large share of downstream citation activity. Any new tray, cushioning or cover-locking design should be checked against these before filing.

Run a clearance search in Eureka

Track the entrants below the top 10

With 43.4% of records held by the top 10 and the rest spread across a long tail, new entrants are still establishing position. Watching filing velocity among mid-tier assignees flags who is scaling up.

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Probe the under-claimed secondary classes

D21J, A23P and the other secondary IPC classes each cover a small minority of records. That gap is where narrower, more defensible claims around specific pulp-forming or food-contact processes may still be available.

Explore white space in Eureka
Source: Patsnap Eureka. Forward-looking reading of the same dataset. Derived from a Patsnap search on Molded Pulp Packaging Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
FAQ

Common questions about the molded pulp packaging patent landscape

Answers are grounded in the same dataset. Derived from a Patsnap search on Molded Pulp Packaging Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company’s registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.

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