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MXene Manufacturing Patents: Who Leads, Where the Gaps Are 2026

MXene Manufacturing Patents: Who Leads, Where the Gaps Are 2026
https://www.patsnap.com/resources/blog/rd-blog/mxene-material-manufacturing-process-patent-landscape/ · Patsnap · data cut-off 2026-07-31 · downloaded from the live page
Patent Landscape · Advanced Materials
MXene material manufacturing process patents: mapping a small but accelerating filing base
  • Filings are still accelerating, not maturing: the midpoint year 2022 shows zero filings before a run-up to a peak of 6 in 2024, so this is an early-stage claim landscape.
  • Nanotechnology and inorganic-chemistry classes dominate, with B82Y (10 records) and C01B (9 records) covering the great majority of the 16 families, while ceramics, capacitors and sensing applications remain thin.
  • One US halogen-etching patent carries outsized weight, cited 60 times against single digits for every other record in the set — a strong signal of where downstream designers are already building around.
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16
Published Records
44%
Top-5 Share of All Records
+200%
3-Yr Growth (lag-adjusted)
IN
Leading Jurisdiction
Published byPatsnap Research··7 min readSourced from Patsnap Eureka
Overview

A young, narrow patent field built around one etching route

MXene manufacturing patenting is small in absolute terms — 16 patent families across the full 2015-2026 window — but the shape of the filing curve says the field is still opening up rather than settling down. The trend line sits at zero in 2017, stays flat through the middle of the window, and only starts climbing toward the back half, peaking at 6 families in 2024. Because publication typically lags filing by around 18 months, that 2024 peak and the single 2026 filing are both undercounts of what has actually been filed.

The technology composition points to a field still defined by its founding chemistry: elemental or halogen etching of MAX phase powders to strip the A-layer and produce layered MXene. Nanotechnology (B82Y) and inorganic compound chemistry (C01B) account for the bulk of records, while ceramics (C04B), capacitors (H01G), semiconductor devices (H01L) and water treatment (C02F) each register only one or two filings — evidence of early-stage downstream application claims rather than a mature, multi-branch industry.

Filing activity by year, 2017-2026
  1. 1UNITED STATES GOVERNMENT AS REPRESENTED BY THE SECRETARY OF THE AIR FORCE2
  2. 2KOREA INSTITUTE OF GEOSCIENCE AND MINERAL RESOURCES2
  3. 3RAJNI KANT VERMA1
  4. 4DR SHYAM SUNDAR BEHURA1
  5. 5DR N VENKATACHALAM1
  6. 6DR A BALAJI1
  7. 7DHARMBIR SINGH1
  8. 8KOREA INST OF SCI & TECH1
  9. 9PRESIDENCY UNIV1
  10. 10ISWARYA M1
Source: Patsnap Eureka. Assignee ranking and totals. Derived from a Patsnap search on MXene Material Manufacturing Process covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

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Filing Data

Filing trend and technology composition

The dataset spans 16 published patent families filed between 2015 and mid-2026, drawn from India, United States, China and EPO filings and classified primarily under nanotechnology and inorganic-chemistry IPC codes.

From flat to accelerating

Zero filings in 2017 and at the 2022 midpoint, followed by a run to a peak of 6 in 2024, indicates the field only recently crossed from academic curiosity to active patenting. The partial 2026 count of 1 should not be read as a slowdown given the usual 18-month publication lag.

From flat to accelerating023560201720182019202020212022202362024202512026Most recent year is partial — publication lag means later filings are not yet visible.

Etching chemistry over downstream application

B82Y (10 records) and C01B (9 records) together dominate the set, reflecting a focus on the core synthesis and nanomaterial characterisation rather than end-use integration. C04B, B01J, H01G, H01L, C01G and C02F each appear only once or twice, marking ceramics composites, catalysis, energy storage, semiconductor and water-treatment applications as still lightly claimed.

Etching chemistry over downstream applicationB82Y · Nanotechnology applications1062.5%C01B · Non-metallic elements & inorga…956.3%C04B · Ceramics, cement & refractories318.8%B01J · Chemical/physical processes & …212.5%H01G · Capacitors212.5%H01L · Semiconductor devices212.5%C01G · Compounds of other metals16.3%C02F · Water & wastewater treatment16.3%Other531.3%

Shares are the percentage of the 16 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.

Source: Patsnap Eureka. Filing trend and technology composition. Derived from a Patsnap search on MXene Material Manufacturing Process covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.

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Key Patents

The record other filings are built around

Representative filing
US12054428B22024-08-06

Preparation of layered MXene via elemental halogen etching of MAX phase

UNITED STATES GOVERNMENT AS REPRESENTED BY THE SECRETARY OF THE AIR FORCE

The patent describes introducing dried MAX phase powder — general formula Mn+1AXn with a wide range of permitted transition metals and metalloids — into a vessel under anhydrous, inert conditions, then reacting it with a halogen and solvent to selectively etch the A-layer and yield a layered MXene material.Filed by the United States Government as represented by the Secretary of the Air Force; granted 2024-08-06.

US12054428B2 — patent drawing 1US12054428B2 — patent drawing 2
View full filing
Most-cited records in the corpus
#Publication no.Patent titleCitations
1US20210139379A1Preparation of Layered MXene via Elemental Halogen Etching of MAX Phase60
2CN111863310AMXene制备方法及其作为导电银浆增强相的应用7
3CN112885964A一种多场调控忆阻器及其制备方法5
4IN202411071738AA mxene integrated znfe2o4 nanocomposite based resistive ethanol gas sensor1

Citation counts inside a searched corpus favour older, foundational filings; treat this as a signal of influence on the field rather than of current commercial importance.

Patent titles are shown in the language they were filed in, not translated, so that each record stays verifiable against the original filing — a translated title will not match in Eureka or in any national register. Publication numbers are shown where the record carries one (4 of 4 rows); clicking a row searches Eureka by that number.

Source: Patsnap Eureka. Citation counts and representative records. Derived from a Patsnap search on MXene Material Manufacturing Process covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
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Insights

What the numbers mean for a filing decision

Three patterns stand out once the raw counts are read against the timeline and classification split.

Concentration
60 citations
on the lead US record

One halogen-etching filing anchors the field

US20210139379A1 / US12054428B2 is cited far more than any other record in the set, with the next most-cited filing at 7 citations. That gap means most later filers are building on, or designing around, this specific elemental halogen etching route rather than an alternative synthesis path.

Citation gap of 60 vs. 7
Geography
India 6, US 6
leading receiving offices

Filing activity splits evenly between India and the US

India and the United States each account for 6 of the 16 records, with China at 3 and EPO at 1. That even split across two very different patent systems suggests no single jurisdiction has yet become the default venue for MXene manufacturing claims.

China 3, EPO 1
Technology mix
10 + 9 records
in B82Y and C01B

Synthesis classes dwarf application classes

B82Y and C01B together cover the majority of the 16 families, while application-facing classes such as H01G (capacitors), H01L (semiconductors) and C02F (water treatment) sit at one or two records each. The imbalance shows claim activity is still concentrated on making the material, not on integrating it.

Application classes at 1-2 records each
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Source: Patsnap Eureka. Co-assignee relationships and derived observations. Derived from a Patsnap search on MXene Material Manufacturing Process covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
Players

Who is filing, and where the gate still stands open

With only 16 families in the corpus and recent-year momentum flat across every named assignee, no single organisation has pulled decisively ahead — this is a field of first movers, not incumbents.

Momentum
0 in latest year
across all listed assignees

No assignee shows fresh-year activity

Every organisation tracked in the recent-year momentum data — including Korea Institute of Geoscience and Mineral Resources, the US Air Force, KAIST, KIST, University of Chicago and Tianjin University — shows zero filings in the latest tracked year. That is consistent with publication lag rather than a genuine pullback, but it means current league-table position is not a reliable guide to who is filing right now.

Momentum flat across the board
Institutional mix
Academic + defence
assignee profile

Research institutes and defence bodies, not materials majors

The named assignees are university and government research bodies rather than established materials or electronics manufacturers. That profile fits a technology still in the synthesis-and-characterisation stage, where institutional labs file first and commercial licensing or follow-on filings from industry come later.

University and government labs lead
Jurisdiction spread
4 offices
India, US, China, EPO

Filing strategy is not yet jurisdiction-locked

Records land across India, the United States, China and the EPO in comparable numbers rather than clustering in one office. A new entrant has genuine choice of venue right now, rather than needing to follow an established filing pattern set by a dominant player.

No single dominant office
🔍
Under-claimed branches worth a first-mover look
These sub-areas sit inside the same IPC footprint but carry only one or two filings each — space for a first, narrow claim rather than a crowded fight over the core etching step.
MXene-based capacitor electrode integrationMXene composite ceramics processingMXene water-treatment membrane formulationsMXene-catalysis coupling (B01J overlap)MXene semiconductor device fabrication
Rank all filers by momentum →
Recent-year filing momentum by assignee
AssigneeRecent yearYoY
Korea Institute of Geoscience and Mineral Resources0
United States Government as represented by the Secretary of the Air Force0
Korea Advanced Institute of Science and Technology (KAIST)0
Korea Institute of Science and Technology (KIST)0
University of Chicago0
Tianjin University0
Harbin Engineering University0
Hefei Innovation Research Institute of Beihang University0
Source: Patsnap Eureka. Assignee-level momentum. Derived from a Patsnap search on MXene Material Manufacturing Process covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
What's Next

Where to take this analysis

The filing base is small enough that a single new filer can materially change the competitive picture within a year or two of publication catching up.

Watch the etching-route claim boundary

The lead US halogen-etching patent sits at the centre of citation activity. Anyone developing an alternative etching chemistry — fluoride-free, molten-salt, or electrochemical routes — should map their claims against it before committing to a synthesis pathway.

Explore etching alternatives in Eureka

Track application-class filings as they emerge

Capacitor, semiconductor and water-treatment classes each carry only one or two records today. A new filing in any of these branches would meaningfully shift that class's share of the dataset, so periodic re-checks matter more here than in the core synthesis classes.

Set up monitoring in Eureka
Source: Patsnap Eureka. Forward-looking reading of the same dataset. Derived from a Patsnap search on MXene Material Manufacturing Process covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
FAQ

Common questions about MXene manufacturing patents

Answers are grounded in the same dataset. Derived from a Patsnap search on MXene Material Manufacturing Process covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company’s registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.

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