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Nanosheet Fab APC (GAA) Patent Snapshot 2026

Nanosheet Fab APC (GAA) Patent Snapshot 2026
Evidence Snapshot
Nanosheet Fab APC (GAA) Patent Snapshot in 2026

The nanosheet fab advanced process control (gate-all-around) patent space is highly concentrated, with three filers accounting for the entire ranked corpus and Applied Materials holding a commanding position. Activity peaked sharply in 2020 and has since eased, signalling that foundational IP was established early and the field is now entering a quieter, post-peak phase.

10
Patent families in scope
N/A
Concentration not assessed
N/A
Growth trend not assessed
United States
Leading jurisdiction
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Published byPatsnap Insights Team··5 min readVerified by Patsnap Eureka data
Overview

Applied Materials leads a three-player field with no outside challengers yet visible

Applied Materials Inc ranks first with 5 patent families, followed by Tokyo Electron Ltd with 4 and Onto Innovation Inc with 1 — together they represent 100% of the top hundred filers’ combined total, meaning no other organisation has yet established a meaningful filing footprint in this niche.

The tier gap between first and second place is narrow in absolute terms, but Applied Materials’ lead across both process-equipment (C23C coating/deposition) and device-level (H01L) classes gives it broader technical coverage than Tokyo Electron, which is more concentrated in device and H10P transistor classes.

Leading applicants
#ApplicantPatent familiesShare
1Applied Materials Inc5
2Tokyo Electron Ltd4
3Onto Innovation Inc1
↗ Hover a row · click a company to ask Eureka

With only three identifiable assignees and the entire corpus spanning 10 patent families, the space remains accessible to new entrants who can differentiate on process-control methodology or metrology, particularly for GAA nanosheet integration flows.

Patent publication typically lags filing by 18–24 months, so activity in 20242025 may be under-represented in this corpus and the apparent absence of recent filings should not be interpreted as a definitive halt in R&D.

Source: Patsnap Eureka. Chart shows the top applicants ranked by patent families. Applicant counts can overlap where a patent family lists several applicants, so they need not sum to the total in scope. This same dataset is now available on Patsnap Open Platform via MCP.Connect via MCP →
Trends & Structure

A sharp 2020 peak, a sparse technology mix, and an adjacent nanotechnology branch

The filing trend reveals a single visible burst of activity in 2020 followed by a long quiet period, while the technology composition chart shows that semiconductor device classes are visible in but several adjacent branches remain lightly populated.

Annual filing trend

Filing volume surged to its peak in 2020 and has remained at or near zero in subsequent years, consistent with a field where foundational process-control IP was established quickly. Years from 2024 onward should be treated as potentially undercounted due to publication lag.

Annual filing trendAnnual values from 2017 to 2026, peaking at 8 in 2020.02017020180201982020020211202212023020240202502026↗ Hover for values · click a bar to ask Eureka

Technology composition

H01L (semiconductor devices) and H10P anchor the corpus, with C23C (coating and surface deposition) also prominent — reflecting the ALD/CVD-heavy nature of GAA nanosheet fabrication. B82Y (nanotechnology applications) appears with only 2 records, flagging it as an under-served adjacent branch relative to the visible classes.

Technology compositionH01L · Semiconductor devices leads with 10; H10P 9.H01L · Semiconductor dev…10H10P9C23C · Coating & surface…7C30B · Crystal growth4H01J · Electron & discha…3B82Y · Nanotechnology ap…2↗ Hover for values · click a bar to ask Eureka
Source: Patsnap Eureka. Technology-branch counts are measured in patent records; a single patent family can carry several IPC classes, so class totals can exceed the family total in scope.Explore deeper in Eureka →
Key Patents

Highly cited patent families surfaced by the query

Citation-heavy patent families returned by the query. Use this section as citation context, not as a curated list of the most topic-specific patents.

Featured patent
US20220406572A1Published 2022-12-22

Substrate processing method, substrate processing …

Tokyo Electron Limited

The present disclosure appropriately shortens a processing step for processing a substrate in which a silicon layer and a silicon germanium layer are alternatively laminated. The present disclosure provides a substrate processing method of processing the substrate in which the silicon layer and the silicon germanium layer are alternatively laminated, which… (excerpt from the patent abstract)

Substrate processing method, substrate processing … — patent drawingSubstrate processing method, substrate processing … — patent drawing
Representative drawings from the patent document.
Open this patent in Eureka →
Highly cited patent families surfaced by this query
#PatentCitations
1基板处理方法、基板处理装置和纳米线或纳米片的晶体管的制造方法6
2Substrate processing method, substrate processing …4
3Gate all around I/O engineering2

Ranked by total forward citations. Citation counts favour older and broadly cited patent families, and broad or adjacent patents may appear when they match the search scope. Treat this section as citation context, not as a curated list of the most topic-specific patents. Some patent titles may be shown in their original, non-English language where an accurate translation could not be guaranteed.

Source: Patsnap Eureka. Citation-ranked patent families surfaced by this query.Open in Eureka →
Visible assignees

Assignee snapshot from the current evidence set

The applicants below are visible in this query result. Because the evidence set is relatively small, read this section as a directional snapshot rather than a full competitive ranking.

Leader · Applied Materials Inc

Applied Materials Inc

Applied Materials holds 5 patent families — the largest share in this corpus. Its technology focus spans C23C 16 (chemical vapour deposition and coating), H01L 21 (semiconductor fabrication processes), and H01L 29 (transistor structures), indicating a strategy that ties process-equipment capability directly to device-level outcomes. Momentum data shows a new-entrant trend in the most recent period, consistent with this being an emerging product line rather than a mature portfolio segment.

5 patent families
Challenger · Tokyo Electron Ltd

Tokyo Electron Ltd

Tokyo Electron holds 4 patent families, focused on H01L 21 (semiconductor fabrication), H10P 14, and H10P 72 — classes that map closely to GAA transistor operation and device physics rather than deposition process chemistry. This device-centric emphasis is complementary to Applied Materials’ process-equipment approach, suggesting the two companies are attacking different points in the GAA integration stack rather than directly competing on identical claims.

4 patent families
🔍
More assignee evidence is available in Eureka
Use Eureka to validate whether these visible assignees remain central after refining the query scope and adding related patent classes.
Applied Materials IncTokyo Electron Ltd+ more
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Source: Patsnap Eureka. Assignee evidence is drawn from the current PatSnap Eureka query. In small evidence sets, applicant counts should be treated as directional signals, not a complete competitive ranking.Explore players →
Frequently asked questions

Frequently asked questions

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Built on Patsnap Open Platform

This report’s underlying patent dataset — filings, assignees, technology clusters — is open for developers via MCP and REST API. Free to start, 10,000 credits, no credit card required.

Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

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