Nanosheet FET DTCO/ML (GAA) Patent Snapshot 2026
The nanosheet FET design-technology co-optimization and machine-learning (GAA) space is an early-growth field concentrated among three filers — Intel, Samsung, and Synopsys — with filings still expanding on a multi-year basis from a small 2019 base, though annual volume has eased from its 2023 peak. Semiconductor device architecture (H01L) dominates the technology mix, and the United States is the primary filing jurisdiction.
Intel and Samsung share the lead in a highly concentrated, nascent field
The corpus stands at 8 patent families in scope. Intel Corp and Samsung Electronics each rank first with 3 patent families, followed by Synopsys Inc with 2 — together these three filers account for the entirety of the top-ranked applicants.
The top five filers collectively hold 100% of the combined total among the ranked applicants visible in this query, indicating extreme concentration with no meaningful second tier. This level of consolidation is characteristic of a field still being defined by a handful of early movers.
| # | Applicant | Patent families | Share |
|---|---|---|---|
| 1 | Intel Corporation | 3 | |
| 2 | Samsung Electronics Co., Ltd. | 3 | |
| 3 | Synopsys Inc | 2 |
The shared leadership between a device manufacturer (Intel), a foundry-integrated conglomerate (Samsung), and an EDA/design-automation vendor (Synopsys) suggests the DTCO and ML angle of GAA development is attracting both process-side and design-tool-side IP strategies simultaneously.
The most recent 18–24 months of filings are subject to publication lag and likely undercount true activity; the apparent absence of 2025–2026 filings should not be read as a slowdown. Longer-window growth, applicant concentration, and technology-route coverage are therefore more reliable signals than the latest-year bar alone.
Multi-year growth from a 2019 origin, with H01L semiconductor devices dominating the technology mix
Two charts capture the field’s temporal trajectory and its IPC composition — together they show a field that ignited around 2019, surged in 2023, and is overwhelmingly rooted in semiconductor device fabrication and structure classifications.
Annual filing trend
Filings first appeared in 2019 with 2 families, then were largely absent until 2022, before a clear 2023 surge to 4 families — the highest single-year count on record. The 2024 and 2025–2026 data are understated due to publication lag and should not be interpreted as decline. The three-year recent window sits well above the prior three-year window, confirming growth-stage dynamics on a multi-year basis.
↗ Hover for values · click a bar to ask EurekaTechnology composition
H01L (Semiconductor devices) covers all 8 patent families in the corpus, confirming the field is anchored in core transistor structure and fabrication claims. H10P appears in 2 families, indicating some coverage of specific semiconductor device types, while B82Y (Nanotechnology applications) appears in 1 family — a relatively sparse branch that signals limited but present nanotechnology-framing activity.
↗ Hover for values · click a bar to ask EurekaHighly cited patent families surfaced by the query
Citation-heavy patent families returned by the query. Use this section as citation context, not as a curated list of the most topic-specific patents.
Integrated gate-all-around (GAA)/finfet transistor…
In embodiments of the present disclosure, an integrated transistor device includes a gate-all-around (GAA) transistor and a FinFET transistor device on the same substrate. The FinFET transistor includes a dielectric region between the channel of the FinFET transistor and the substrate. (excerpt from the patent abstract)
| # | Patent | Citations |
|---|---|---|
| 1 | Crystal orientation engineering to achieve consist… | 5 |
| 2 | Semiconductor device including nanosheet transistor | 3 |
| 3 | N-type transistor fabrication in complementary FET… | 3 |
Ranked by total forward citations. Citation counts favour older and broadly cited patent families, and broad or adjacent patents may appear when they match the search scope. Treat this section as citation context, not as a curated list of the most topic-specific patents. Some patent titles may be shown in their original, non-English language where an accurate translation could not be guaranteed.
Assignee snapshot from the current evidence set
The applicants below are visible in this query result. Because the evidence set is relatively small, read this section as a directional snapshot rather than a full competitive ranking.
Intel Corporation
Intel holds 3 patent families in scope, co-leading the corpus with Samsung. Its filings are concentrated in H01L 21 (semiconductor device fabrication processes), H01L 29 (semiconductor device structures), and H01L 27 (integrated circuits), indicating a broad process-and-device coverage strategy. Intel’s momentum is classified as a new entrant in the recent filing window, meaning its GAA DTCO/ML IP is newly established rather than a long-running portfolio.
families: 3Samsung Electronics Co., Ltd.
Samsung Electronics also holds 3 patent families in scope and mirrors Intel’s H01L 29 and H01L 21 focus, with additional H01L 27 coverage. Like Intel, Samsung is classified as a new entrant in the recent window, reflecting that both companies entered this specific DTCO/ML intersection of GAA technology concurrently. Samsung’s dual role as foundry and device designer makes its IP position strategically broad.
families: 3Frequently asked questions
The corpus contains 8 patent families in scope as captured in this evidence set. This is a small, early-stage corpus consistent with the field’s recent emergence from research into applied IP strategy.
Intel Corp and Samsung Electronics Co., Ltd. each hold 3 patent families, jointly leading the corpus. Synopsys Inc holds 2 patent families. These three filers account for all ranked applicants in the evidence.
The field is classified as Growth. Recent three-year filings are well above the prior three-year window (a 200% increase), indicating multi-year expansion. Annual volume has eased from the 2023 peak, and the most recent years are further understated by publication lag.
The United States leads with 5 patent records, followed by Europe (EPO) with 3. No direct filings in Korean, Japanese, or Chinese offices are visible in the current evidence, though publication lag may account for some absence in more recent APAC filings.
H01L (Semiconductor devices) covers all 8 patent families in scope and is the visible classification. H10P appears in 2 families and B82Y (Nanotechnology applications) in 1, both representing relatively sparse adjacent branches.
The evidence shows no co-applicant filings in this corpus. Intel, Samsung, and Synopsys have each filed independently, with no cross-organizational collaboration agreements visible in patent records at this time.
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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
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