Optical and Wireless Die Interconnect Patents: Top Companies, Trends 2026
Optical and Wireless Die Interconnect Patents: Who Leads and Where the Field Is Still Open
Concentrated but not closed. the top 5 assignees hold 34.1% of all 768 records in scope, and the top 10 hold 45.4% — leaving more than half the field to a long tail of single- and few-filing entrants. Annual filings moved from 34 in 2017 to a peak of 64 in 2024, including a +36% rise from 47 in 2021 to that 2024 peak. The 2025 and 2026 figures (down to 3 in the partial latest year) reflect publication lag rather than an actual slowdown in filing.
- 1INTEL CORP97
- 2CIENA CORP64
- 3MONOLITHIC 3D INC46
- 4CALIFORNIA INST OF TECH29
- 5MASSACHUSETTS INST OF TECH26
See the full optical and wireless die interconnect analysis in Eureka
- The complete ranking, not just the top five
- Every IPC branch with its share of the corpus
- The most-cited records, and where claim space is still thin
Common questions about this landscape
Who holds the most patents in optical and wireless die interconnect?
One assignee leads the ranked field with 97 records, well ahead of the fifth-ranked assignee at 26 and the tenth-ranked at 15. The top 5 assignees together hold 34.1% of all 768 records in scope, and the top 10 hold 45.4%, meaning a large share of the field still sits outside the leading filers. This concentration pattern is typical of a technology area with a few sustained corporate research programs alongside many smaller or academic filers.
Is filing activity in this space growing or slowing down?
Filing volume grew from 47 records in 2021 to a peak of 64 in 2024, a 36% increase over that span, and 2024 is the most recent year that can be read as a complete filing year. The apparent drop in 2025 and 2026 is a publication-lag artefact — patents typically publish about 18 months after filing — not evidence of declining interest. Anyone assessing momentum should treat the last one to two years of any trend chart as understated rather than as a real slowdown.
What technology areas dominate the claim language?
Optical elements and systems (IPC class G02B) appear in 47.4% of the 768 records, making it the single most common classification, followed by semiconductor devices (H01L) at 29.3% and general transmission (H04B) at 19.0%. Because a single patent can carry multiple IPC codes, these percentages overlap rather than sum to 100%, which itself shows how closely optical, semiconductor and RF disciplines intersect in die interconnect claims. Laser-related claims (H01S) are comparatively thin at 9.2%, suggesting less crowded claim space there.
Disclaimer. This analysis is based on Patsnap Eureka data drawn from a limited snapshot of global patent records and is provided for general information and reference only. Patent data carries inherent limitations — recent filings are under-counted because of publication lag, counts may be on a record or family basis, classification and applicant-name data may contain errors or duplicates, and the underlying search query defines the scope shown — so the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing here is an exhaustive prior-art, novelty, freedom-to-operate or validity search, nor does it constitute legal, financial or professional advice, and it should not be relied upon as such. Verify independently and review with qualified patent and legal professionals before acting on it.
Method: Filing trend and technology composition. Derived from a Patsnap search on Optical and Wireless Die Interconnect covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish. Every share divides by all records in scope. Data: Patsnap Eureka. See the full landscape report.