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Run your analysis now →Filing growth compares 2021 (11 records) with 2024 (8) — a three-year span. 2024 is the most recent year we treat as complete: publication lags filing by roughly 18 months, so 2025 onwards are still filling in and any growth rate that ends there would understate the field. Top-5 share is the combined record count of the five largest assignees divided by all 206 records in scope (CR5), not by the ranked leaders only.
This dataset tracks 206 patent families filed between 2015 and 2026 whose title or abstract names an optical transceiver, optical module or co-packaged optics system, and whose title, claims or classification touches DFB lasers, electro-absorption modulated lasers (EML), directly modulated lasers, or laser sources, classified under H01S5/12, H01S5/026 or H01S5/183. It is a laser-source-in-transceiver view, not a general photonics view: the search string deliberately excludes laser work that has no stated transceiver or module context.
Publication typically lags filing by around 18 months, so counts for the most recent year or two understate real filing activity and should be read as a floor, not a ceiling.
Two views of the same 206 families: how filing activity has moved year over year, and which IPC subclasses carry the claims.
Filings peaked at 16 in 2017, fell through the middle of the decade, and sat at 10 by 2022 — the midpoint year — before continuing to soften. The most recent year (2, partial) is not comparable to earlier full years because of publication lag, but the multi-year direction from 2017 to 2022 is already flat-to-declining without needing that final data point.
Every family in this set touches H01S, the laser subclass that defines the search. The next-heaviest subclasses are G02B (optical elements and systems, 71 records) and H04B (general transmission, 68 records), followed by G02F (optical control and modulation, 45). H01L (semiconductor devices generally, 19), H04J (multiplex communication, 14), H10P (4) and H05K (printed circuits and assemblies, 3) show that most of the remaining claim activity sits in packaging and system integration rather than in alternative semiconductor laser physics.
Shares are the percentage of the 206 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.
This page is one run against one query. Ask Eureka your own question about optical transceiver semiconductor laser and every answer comes back with the patent numbers behind it.
Try EurekaA DFB laser DC-coupled output power configuration scheme with adjustable voltage difference utilizes an external or internal power configuration unit to provide two electric DC power supplies with a fixed voltage difference for the transmitting unit TX of the DFB laser and the optical transceiver integrated chip, while optimizing the transmitting unit TX. The transistors in the transmitting unit TX are low-voltage high-speed tubes, and the transmitting unit TX includes a negative capacitance structure composed of capacitors C1 and C2 as an auxiliary structure for improving bandwidth.Filed by Xiamen Eochip Semiconductor Co., Ltd, granted 2024-06-18 — illustrates how recent claim activity is shifting toward power-supply and bias-network architecture around the DFB die rather than the laser cavity itself.
| # | Publication no. | Patent title | Citations |
|---|---|---|---|
| 1 | US10826613B1 | Integrated compact in-package light engine | 52 |
| 2 | US20050275053A1 | Optical module device | 45 |
| 3 | US20100265983A1 | Surface emitting laser module and vertical illuminated photodiode module | 42 |
| 4 | US20150055960A1 | Heated laser package with increased efficiency for optical transmitter systems | 41 |
| 5 | US20140241726A1 | Temperature controlled multi-channel transmitter optical subassembly and optical transceiver module including… | 36 |
| 6 | US20080266638A1 | Semiconductor laser and optical module | 36 |
| 7 | US20010026857A1 | Photonic crystal, method of fabricating the same, optical module, and optical system | 36 |
| 8 | US20050105911A1 | TO-can type optical module | 35 |
| 9 | JP2006030227A | Optical module | 34 |
| 10 | US20100074291A1 | Distributed Feedback Semiconductor Laser Device | 30 |
Citation counts favour older filings simply because they have had more years to accumulate citations inside this corpus — read them as a signal of influence on subsequent filers, not as a ranking of present-day relevance.
Each row carries its publication number; clicking a row searches Eureka by that number.
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Browse MCP servers →Three read-throughs from the composition and trend data that matter more than the raw counts.
Every family in this set carries an H01S classification, which means any new DFB, EML or directly modulated laser filing is entering ground that is already densely mapped. Differentiation is more likely to come from the packaging, drive-circuit or modulation claims layered around the laser than from the laser structure alone.
The peak year for filing was 2017. By the 2022 midpoint, annual filings had already dropped to 10, well below peak. That multi-year decline predates the most recent, publication-lag-affected years, so it is not an artefact of undercounting the last 12–18 months.
More than half of all receiving-office filings in this set go through the United States, well ahead of China and Japan. For a company weighing where enforcement risk or freedom-to-operate exposure concentrates, that US skew is the first fact to check, ahead of any assumption about a China-led race.
Optical elements (G02B), general transmission (H04B) and optical modulation (G02F) each carry substantial claim volume, close to a third of the core H01S count each. That signals filers are protecting the transceiver system around the laser as heavily as the laser source itself.
Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to optical transceiver semiconductor laser, with the prior art for and against each one.
Assignee activity in this set is led by Japanese optical-component and telecom-equipment firms, several of them jointly filing with domestic partners, but recent-year momentum across the named assignees is uniformly flat.
Only seven co-assignee pairs appear across 206 families, and the strongest pairs link a Japanese optical-component maker with a Japanese electronics conglomerate, or a telecom carrier with a university. This is a landscape of largely independent filers rather than a dense collaboration network.
Every assignee named in the recent-momentum data — spanning Japanese, Chinese and other established filers — shows zero filings in the latest year, including a -100% YoY drop for one Chinese assignee. Treat this cautiously given publication lag, but it is consistent with the broader flat-to-declining trend.
The most recent representative filing in this set comes from a semiconductor specialist rather than one of the long-established optical-module names, filing on power-supply and bias-network architecture around the DFB die — a narrower, more circuit-level claim than the system-level filings typical of the older leaders.
| Assignee | Recent year | YoY |
|---|---|---|
| NTT Innovative Devices Corporation | 0 | — |
| Oclaro Japan, Inc. | 0 | — |
| Source Photonics, Inc. (US) | 0 | — |
| Qingdao Hisense Broadband Multimedia Technologies Co., Ltd. | 0 | -100% |
| NEC Corporation | 0 | — |
| Nippon Telegraph and Telephone Corporation (NTT) | 0 | — |
| Fujitsu Limited | 0 | — |
| Hitachi, Ltd. | 0 | — |
The dataset points to a mature, US-weighted filing landscape with system-level claims layered around a densely occupied laser core. Two directions follow from that.
Given how thin new laser-physics filing has become, drive-circuit and bias-network claims — like the negative-capacitance structure in the representative filing — are a more promising place to check freedom to operate than the laser cavity itself.
Explore this in EurekaThe decline from 2017 to 2022 is real, but the last one to two years are undercounted by definition. Before concluding the field is winding down, run a fresher pull closer to the data cut-off.
Run a fresh search in EurekaThis dataset of 206 patent families is led by a small group of Japanese optical-component and telecom-equipment firms, alongside Chinese and other international filers, rather than by a single dominant assignee. Filing activity across the named leaders has flattened in the most recent tracked year, so current leadership by cumulative count does not necessarily mean current leadership by filing pace. Anyone evaluating this space should look at both the cumulative ranking and the recent-year momentum figures, since they tell different stories.
No. Filing peaked in 2017 at 16 families and had already fallen to 10 by the 2022 midpoint, a decline that predates the most recent, publication-lag-affected years. That said, publication typically lags filing by around 18 months, so the very last one or two years in any trend chart will always look lower than they eventually will once all filings post. The honest read is flat-to-declining over the medium term, not a collapse in the newest data points.
The core laser subclass, H01S, is fully occupied — every family in this set carries an H01S classification. Comparatively thinner claim density sits in specific system-level branches such as bias-network and negative-capacitance drive circuits around the laser die, co-packaged optics thermal management, and multi-channel TOSA temperature control, each of which shows up in the data with narrower coverage than the core laser and general transmission subclasses. These are reasonable starting points for a novelty search rather than guaranteed open ground.
In this 206-family set, the United States receiving office accounts for 112 filings, well ahead of China's 32 and Japan's 29. That skew likely reflects where the leading assignees in this niche — several long-established optical-module and telecom-equipment firms — have historically sought enforcement coverage, plus PCT and EPO routes layered on top. It is a useful check against the common assumption that optical-component patent races are automatically China-centric; in this specific technical slice, they are not.
US12015244B2 covers a DC-coupled power configuration scheme for a DFB laser transmitting unit, using two fixed-voltage-difference DC supplies and a negative-capacitance structure built from two capacitors to extend bandwidth, with low-voltage high-speed transistors in the transmit path. A designer using a comparable dual-supply bias arrangement with a similar negative-capacitance bandwidth-extension technique around a DFB transmit unit should review this claim set closely. Workable alternatives typically involve different bias-network topologies or bandwidth-extension techniques that do not rely on the same fixed-voltage-difference, dual-capacitor structure.
Both, in different ways. Classification is highly concentrated — all 206 families sit in H01S — but assignee filing is comparatively fragmented, with only seven identified co-assignee pairs and no single company dominating recent-year filings. That combination, dense claim subject matter but a long tail of independent filers, means the practical risk for a new entrant is more about bumping into an existing narrow claim than about facing one dominant blocking portfolio.
Go past this page: query the whole optical transceiver semiconductor laser corpus yourself, in your own scope.
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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.
Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company's registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.