https://www.patsnap.com/resources/blog/rd-blog/optical-transceiver-semiconductor-laser-patent-landscape/ · Patsnap · data cut-off 2026-07-31 · downloaded from the live page
Photonics & Optics · Patent Landscape
Optical Transceiver Semiconductor Laser Patents: Who Holds the Claim Space
  • Filing has cooled since its 2017 peak of 16. the midpoint year (2022) sits at 10, and the most recent full year is lower still — a flattening pattern rather than an accelerating one, even allowing for publication lag.
  • 206 families concentrate almost entirely in H01S. but meaningful secondary claim density sits in G02B, H04B and G02F, showing the technology is claimed as much through transmission and modulation systems as through the laser die itself.
  • The United States receives more filings than China, Japan, WIPO, Europe and the UK combined. a routing pattern worth checking before assuming this is a China-centric filing race.
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206
Published Records
41%
Top-5 Share of All Records
-27%
Filing Growth 2021→2024
US
Leading Jurisdiction

Filing growth compares 2021 (11 records) with 2024 (8) — a three-year span. 2024 is the most recent year we treat as complete: publication lags filing by roughly 18 months, so 2025 onwards are still filling in and any growth rate that ends there would understate the field. Top-5 share is the combined record count of the five largest assignees divided by all 206 records in scope (CR5), not by the ranked leaders only.

Published byPatsnap Research··8 min readSourced from Patsnap Eureka
Overview

What this landscape covers

This dataset tracks 206 patent families filed between 2015 and 2026 whose title or abstract names an optical transceiver, optical module or co-packaged optics system, and whose title, claims or classification touches DFB lasers, electro-absorption modulated lasers (EML), directly modulated lasers, or laser sources, classified under H01S5/12, H01S5/026 or H01S5/183. It is a laser-source-in-transceiver view, not a general photonics view: the search string deliberately excludes laser work that has no stated transceiver or module context.

Publication typically lags filing by around 18 months, so counts for the most recent year or two understate real filing activity and should be read as a floor, not a ceiling.

Filing activity and technology composition, 2015–2026
  1. 1LUMENTUMRADIANT GMBH36
  2. 2APPLIED OPTOELECTRONICS INC(US)18
  3. 3FUJITSU LTD11
  4. 4HISENSE BROADBAND MULTIMEDIA TECH10
  5. 5NIPPON TELEGRAPH & TELEPHONE CORP10
  6. 6HITACHI LTD8
  7. 7NEC CORP8
  8. 8MITSUBISHI ELECTRIC CORP7
  9. 9MARVELL ASIA PTE LTD7
  10. 10OPNEXT JAPAN INC6
Source: Patsnap Eureka. Assignee ranking and totals. Derived from a Patsnap search on Optical Transceiver Semiconductor Laser covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
The data

Filing trend and technology composition

Two views of the same 206 families: how filing activity has moved year over year, and which IPC subclasses carry the claims.

Filing trend, 2017–2026

Filings peaked at 16 in 2017, fell through the middle of the decade, and sat at 10 by 2022 — the midpoint year — before continuing to soften. The most recent year (2, partial) is not comparable to earlier full years because of publication lag, but the multi-year direction from 2017 to 2022 is already flat-to-declining without needing that final data point.

Filing trend, 2017–2026051015201620172018201920202021202220232024202522026Most recent year is partial — publication lag means later filings are not yet visible.

IPC subclass composition

Every family in this set touches H01S, the laser subclass that defines the search. The next-heaviest subclasses are G02B (optical elements and systems, 71 records) and H04B (general transmission, 68 records), followed by G02F (optical control and modulation, 45). H01L (semiconductor devices generally, 19), H04J (multiplex communication, 14), H10P (4) and H05K (printed circuits and assemblies, 3) show that most of the remaining claim activity sits in packaging and system integration rather than in alternative semiconductor laser physics.

IPC subclass compositionH01S · Lasers & stimulated emission206100.0%G02B · Optical elements & systems7134.5%H04B · Transmission (general)6833.0%G02F · Optical control & modulation4521.8%H01L · Semiconductor devices199.2%H04J · Multiplex communication146.8%H10P41.9%H05K · Printed circuits & assemblies31.5%Other52.4%

Shares are the percentage of the 206 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.

Source: Patsnap Eureka. Filing trend and technology composition. Derived from a Patsnap search on Optical Transceiver Semiconductor Laser covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.

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Key patents

Most-cited prior art and a representative recent filing

Representative recent filing
US12015244B22024-06-18

US12015244B2 — DFB laser DC-coupled output power configuration scheme with adjustable voltage difference

XIAMEN EOCHIP SEMICONDUCTOR CO., LTD

A DFB laser DC-coupled output power configuration scheme with adjustable voltage difference utilizes an external or internal power configuration unit to provide two electric DC power supplies with a fixed voltage difference for the transmitting unit TX of the DFB laser and the optical transceiver integrated chip, while optimizing the transmitting unit TX. The transistors in the transmitting unit TX are low-voltage high-speed tubes, and the transmitting unit TX includes a negative capacitance structure composed of capacitors C1 and C2 as an auxiliary structure for improving bandwidth.Filed by Xiamen Eochip Semiconductor Co., Ltd, granted 2024-06-18 — illustrates how recent claim activity is shifting toward power-supply and bias-network architecture around the DFB die rather than the laser cavity itself.

US12015244B2 — patent drawing 1US12015244B2 — patent drawing 2
View full record
Most-cited records in this corpus
#Publication no.Patent titleCitations
1US10826613B1Integrated compact in-package light engine52
2US20050275053A1Optical module device45
3US20100265983A1Surface emitting laser module and vertical illuminated photodiode module42
4US20150055960A1Heated laser package with increased efficiency for optical transmitter systems41
5US20140241726A1Temperature controlled multi-channel transmitter optical subassembly and optical transceiver module including…36
6US20080266638A1Semiconductor laser and optical module36
7US20010026857A1Photonic crystal, method of fabricating the same, optical module, and optical system36
8US20050105911A1TO-can type optical module35
9JP2006030227AOptical module34
10US20100074291A1Distributed Feedback Semiconductor Laser Device30

Citation counts favour older filings simply because they have had more years to accumulate citations inside this corpus — read them as a signal of influence on subsequent filers, not as a ranking of present-day relevance.

Each row carries its publication number; clicking a row searches Eureka by that number.

Source: Patsnap Eureka. Citation counts and representative records. Derived from a Patsnap search on Optical Transceiver Semiconductor Laser covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
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Insights

What the numbers mean for a filing decision

Three read-throughs from the composition and trend data that matter more than the raw counts.

Claim density
206 families, 100% touch H01S
core subclass coverage

The laser subclass is fully occupied

Every family in this set carries an H01S classification, which means any new DFB, EML or directly modulated laser filing is entering ground that is already densely mapped. Differentiation is more likely to come from the packaging, drive-circuit or modulation claims layered around the laser than from the laser structure alone.

Source: IPC composition, this dataset
Filing momentum
16 (2017) → 10 (2022) → 2 (2026, partial)
peak-to-midpoint-to-latest

Growth is flat to declining, not accelerating

The peak year for filing was 2017. By the 2022 midpoint, annual filings had already dropped to 10, well below peak. That multi-year decline predates the most recent, publication-lag-affected years, so it is not an artefact of undercounting the last 12–18 months.

Source: filing trend, this dataset
Jurisdiction routing
US 112 vs. China 32, Japan 29, WIPO 15, EPO 13, UK 2
receiving office split

Filing strategy centres on the US office

More than half of all receiving-office filings in this set go through the United States, well ahead of China and Japan. For a company weighing where enforcement risk or freedom-to-operate exposure concentrates, that US skew is the first fact to check, ahead of any assumption about a China-led race.

Source: receiving office counts, this dataset
System-level claiming
G02B 71, H04B 68, G02F 45
secondary subclass counts

Modulation and transmission claims rival the laser claims

Optical elements (G02B), general transmission (H04B) and optical modulation (G02F) each carry substantial claim volume, close to a third of the core H01S count each. That signals filers are protecting the transceiver system around the laser as heavily as the laser source itself.

Source: IPC composition, this dataset
Eureka AI Agent
Looking for what nobody has claimed yet?

Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to optical transceiver semiconductor laser, with the prior art for and against each one.

Find the white space →
Source: Patsnap Eureka. Co-assignee relationships and derived observations. Derived from a Patsnap search on Optical Transceiver Semiconductor Laser covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
Players

Who is filing, and where momentum has stalled

Assignee activity in this set is led by Japanese optical-component and telecom-equipment firms, several of them jointly filing with domestic partners, but recent-year momentum across the named assignees is uniformly flat.

Filing pattern
7 co-assignee pairs
joint filings identified

Collaboration is narrow and mostly domestic

Only seven co-assignee pairs appear across 206 families, and the strongest pairs link a Japanese optical-component maker with a Japanese electronics conglomerate, or a telecom carrier with a university. This is a landscape of largely independent filers rather than a dense collaboration network.

Source: co-assignee pairs, this dataset
Recent momentum
0 in the latest year across named leaders
latest-year filings, top assignees

No tracked leader filed in the most recent year

Every assignee named in the recent-momentum data — spanning Japanese, Chinese and other established filers — shows zero filings in the latest year, including a -100% YoY drop for one Chinese assignee. Treat this cautiously given publication lag, but it is consistent with the broader flat-to-declining trend.

Source: recent-year momentum by assignee, this dataset
New entrants
Xiamen Eochip Semiconductor Co., Ltd
representative recent filer

Newer, smaller filers are active where incumbents have gone quiet

The most recent representative filing in this set comes from a semiconductor specialist rather than one of the long-established optical-module names, filing on power-supply and bias-network architecture around the DFB die — a narrower, more circuit-level claim than the system-level filings typical of the older leaders.

Source: representative record, this dataset
🔍
Under-claimed sub-areas worth checking before filing
Branches with comparatively thin claim density relative to the core laser and transceiver subclasses
Bias-network / negative-capacitance drive circuitsCo-packaged optics thermal managementMulti-channel TOSA temperature controlDirectly modulated laser bandwidth extensionSurface-emitting laser module integration
Rank all filers by momentum →
Recent-year filing momentum by assignee
AssigneeRecent yearYoY
NTT Innovative Devices Corporation0
Oclaro Japan, Inc.0
Source Photonics, Inc. (US)0
Qingdao Hisense Broadband Multimedia Technologies Co., Ltd.0-100%
NEC Corporation0
Nippon Telegraph and Telephone Corporation (NTT)0
Fujitsu Limited0
Hitachi, Ltd.0
Source: Patsnap Eureka. Assignee-level momentum. Derived from a Patsnap search on Optical Transceiver Semiconductor Laser covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
What's next

Where to take this analysis

The dataset points to a mature, US-weighted filing landscape with system-level claims layered around a densely occupied laser core. Two directions follow from that.

Map claim boundaries around the DFB die

Given how thin new laser-physics filing has become, drive-circuit and bias-network claims — like the negative-capacitance structure in the representative filing — are a more promising place to check freedom to operate than the laser cavity itself.

Explore this in Eureka

Stress-test the flat filing trend against publication lag

The decline from 2017 to 2022 is real, but the last one to two years are undercounted by definition. Before concluding the field is winding down, run a fresher pull closer to the data cut-off.

Run a fresh search in Eureka
Source: Patsnap Eureka. Forward-looking reading of the same dataset. Derived from a Patsnap search on Optical Transceiver Semiconductor Laser covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
FAQ

Common questions about this landscape

Answers are grounded in the same dataset. Derived from a Patsnap search on Optical Transceiver Semiconductor Laser covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company's registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.